Andy CHANG

Person

Hsinchu City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 11,469,201
- Issue date Oct 11, 2022
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,580,747
- Issue date Mar 3, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,615
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 10,573,616
- Issue date Feb 25, 2020
- Mediatek Inc.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Structure and formation method of chip package structure
- Patent number 10,354,974
- Issue date Jul 16, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor package and manufacturing met...
- Patent number 10,186,488
- Issue date Jan 22, 2019
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package, semiconductor device using the same and manu...
- Patent number 9,761,534
- Issue date Sep 12, 2017
- Mediatek Inc.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method for fabricating base for semicondu...
- Patent number 9,177,899
- Issue date Nov 3, 2015
- Mediatek Inc.
- Tzu-Hung Lin
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Molded interposer package and method for fabricating the same
- Patent number 9,040,359
- Issue date May 26, 2015
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded interposer package and method for fabricating the same
- Patent number 8,957,518
- Issue date Feb 17, 2015
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of designing integrated circuits and systems thereof
- Patent number 8,949,080
- Issue date Feb 3, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Tsai Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Molded interposer package and method for fabricating the same
- Patent number 8,859,340
- Issue date Oct 14, 2014
- Mediatek Inc.
- Thomas Matthew Gregorich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Information recording device and method of the same
- Patent number 7,193,944
- Issue date Mar 20, 2007
- Mediatek Inc.
- Andrew C. Chang
- G11 - INFORMATION STORAGE
Information Patent Grant
Circuit for protecting synchronizing patterns
- Patent number 6,928,038
- Issue date Aug 9, 2005
- Media Tek Inc.
- Chao-Long Tsai
- G11 - INFORMATION STORAGE
Information Patent Grant
Digitization apparatus and method using a finite state machine in f...
- Patent number 6,496,126
- Issue date Dec 17, 2002
- Mediatek Inc.
- Jing-Hong Conan Zhan
- G11 - INFORMATION STORAGE
Information Patent Grant
Digital data slicer
- Patent number 5,974,088
- Issue date Oct 26, 1999
- United Microelectronics Corp.
- Andrew C. Chang
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20200176408
- Publication date Jun 4, 2020
- MEDIATEK INC.
- Tzu-Hung Lin
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...
- Publication number 20170338183
- Publication date Nov 23, 2017
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANU...
- Publication number 20170084541
- Publication date Mar 23, 2017
- MEDIATEK INC.
- Wen-Sung Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20160307861
- Publication date Oct 20, 2016
- MEDIA TEK INC.
- Tzu-Hung Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE
- Publication number 20160172334
- Publication date Jun 16, 2016
- MEDIATEK INC.
- Wen-Sung HSU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140377913
- Publication date Dec 25, 2014
- Thomas Matthew GREGORICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20140191396
- Publication date Jul 10, 2014
- MEDIA TEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20140151867
- Publication date Jun 5, 2014
- MEDIATEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20140127865
- Publication date May 8, 2014
- MEDIATEK INC.
- Thomas Matthew GREGORICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...
- Publication number 20140035095
- Publication date Feb 6, 2014
- MEDIA TEK INC.
- Tzu-Hung LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20130168857
- Publication date Jul 4, 2013
- Thomas Matthew GREGORICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF DESIGNING INTEGRATED CIRCUITS AND SYSTEMS THEREOF
- Publication number 20120053923
- Publication date Mar 1, 2012
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Kuo-Tsai LI
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
STORAGE SYSTEM AND METHOD THEREOF
- Publication number 20090254717
- Publication date Oct 8, 2009
- MEDIATEK INC.
- Ing-Shry Kuo
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
DIGITAL CONTENT PROTECTION METHODS
- Publication number 20090245520
- Publication date Oct 1, 2009
- MEDIATEK INC.
- Andrew C. Chang
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Method of audio data transmission and system thereof
- Publication number 20060209880
- Publication date Sep 21, 2006
- Mediatek Incorporation
- Andrew C. Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
FAST DIGITAL DATA RECOVERY CIRCUIT
- Publication number 20050046603
- Publication date Mar 3, 2005
- Andrew Chang
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Information recording method
- Publication number 20040042376
- Publication date Mar 4, 2004
- MediaTek Inc.
- Andrew C. Chang
- G11 - INFORMATION STORAGE
Information Patent Application
Acceleration method for read/write device
- Publication number 20040042362
- Publication date Mar 4, 2004
- MediaTek Inc.
- Andrew C. Chang
- G11 - INFORMATION STORAGE
Information Patent Application
Circuit for protecting synchronizing patterns
- Publication number 20020172111
- Publication date Nov 21, 2002
- Chao-Long Tsai
- G11 - INFORMATION STORAGE
Information Patent Application
Digitization apparatus and method therefor
- Publication number 20020067302
- Publication date Jun 6, 2002
- Jing-Hong Conan Zhan
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Semiconductor package and method for fabricating base for semicondu...

Structure and formation method of chip package structure

Manufacturing method of semiconductor package and manufacturing met...

Semiconductor package, semiconductor device using the same and manu...

Semiconductor package and method for fabricating base for semicondu...

Molded interposer package and method for fabricating the same

Molded interposer package and method for fabricating the same

Methods of designing integrated circuits and systems thereof

Molded interposer package and method for fabricating the same

Information recording device and method of the same

Circuit for protecting synchronizing patterns

Digitization apparatus and method using a finite state machine in f...

Digital data slicer

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND MANUFACTURING MET...

SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANU...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

STRUCTURE AND FORMATION METHOD OF CHIP PACKAGE STRUCTURE

MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING BASE FOR SEMICONDU...

MOLDED INTERPOSER PACKAGE AND METHOD FOR FABRICATING THE SAME

METHODS OF DESIGNING INTEGRATED CIRCUITS AND SYSTEMS THEREOF

STORAGE SYSTEM AND METHOD THEREOF

DIGITAL CONTENT PROTECTION METHODS

Method of audio data transmission and system thereof

FAST DIGITAL DATA RECOVERY CIRCUIT

Information recording method

Acceleration method for read/write device

Circuit for protecting synchronizing patterns

Digitization apparatus and method therefor