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Andy Farlow

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  • Hassocks, GB
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Patents Grantslast 30 patents

  • Information Patent Grant

    Chip-scale package
    • Patent number 8,466,546
    • Issue date Jun 18, 2013
    • International Rectifier Corporation
    • Andy Farlow
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Process for fabricating a semiconductor package
    • Patent number 7,923,289
    • Issue date Apr 12, 2011
    • International Rectifier Corporation
    • Mark Pavier
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    Process for fabricating a semiconductor package
    • Publication number 20070231960
    • Publication date Oct 4, 2007
    • International Rectifier Corporation
    • Mark Pavier
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Chip-scale package
    • Publication number 20060249836
    • Publication date Nov 9, 2006
    • Andy Farlow
    • H01 - BASIC ELECTRIC ELEMENTS