Andy Quang Tran

Person

Grand Prairie, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,769,247
- Issue date Sep 26, 2023
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Exposed pad integrated circuit package
- Patent number 11,195,269
- Issue date Dec 7, 2021
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,580,723
- Issue date Mar 3, 2020
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 10,366,947
- Issue date Jul 30, 2019
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor device having stacked attached chips overhan...
- Patent number 9,768,098
- Issue date Sep 19, 2017
- Texas Instruments Incorporated
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semi-hermetic semiconductor package
- Patent number 9,721,859
- Issue date Aug 1, 2017
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor having light-blocking structure in leadframe and m...
- Patent number 9,608,158
- Issue date Mar 28, 2017
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 9,576,886
- Issue date Feb 21, 2017
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor having light-blocking structure in leadframe and m...
- Patent number 9,515,059
- Issue date Dec 6, 2016
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flat no-lead packages with electroplated edges
- Patent number 9,373,569
- Issue date Jun 21, 2016
- Texas Instruments Incorporation
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices having solderable lead surfaces expo...
- Patent number 9,219,019
- Issue date Dec 22, 2015
- Texas Instruments Incorporated
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabricating a proximity sensor having light-blocking structure in l...
- Patent number 9,171,830
- Issue date Oct 27, 2015
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Proximity sensor having light blocking structure in leadframe
- Patent number 8,994,154
- Issue date Mar 31, 2015
- Texas Instruments Incorporated
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method of crossover determination in differential pair a...
- Patent number 8,769,469
- Issue date Jul 1, 2014
- Texas Instruments Incorporated
- Gregory Eric Howard
- G06 - COMPUTING CALCULATING COUNTING

Patents Applicationslast 30 patents

Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20230377124
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20220092767
- Publication date Mar 24, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Flat No-Lead Packages with Electroplated Edges
- Publication number 20190295935
- Publication date Sep 26, 2019
- Texas Instruments Incorporated
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flat No-Lead Packages with Electroplated Edges
- Publication number 20170162489
- Publication date Jun 8, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMI-HERMETIC SEMICONDUCTOR PACKAGE
- Publication number 20170062297
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES
- Publication number 20170062315
- Publication date Mar 2, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Proximity Sensor Having Light-Blocking Structure in Leadframe and M...
- Publication number 20170047469
- Publication date Feb 16, 2017
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EXPOSED PAD INTEGRATED CIRCUIT PACKAGE
- Publication number 20160286652
- Publication date Sep 29, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Reynaldo Corpuz Javier
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHAN...
- Publication number 20160233147
- Publication date Aug 11, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE...
- Publication number 20160181180
- Publication date Jun 23, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...
- Publication number 20160071788
- Publication date Mar 10, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROXIMITY SENSOR HAVING LIGHT-BLOCKING STRUCTURE IN LEADFRAME AND M...
- Publication number 20160043064
- Publication date Feb 11, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20160005712
- Publication date Jan 7, 2016
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH QFN LEA...
- Publication number 20150262919
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...
- Publication number 20150262918
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...
- Publication number 20150262903
- Publication date Sep 17, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Alok Kumar Lohia
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Fabricating a Proximity Sensor Having Light-Blocking Structure in L...
- Publication number 20150162317
- Publication date Jun 11, 2015
- TEXAS INSTRUMENTS INCORPORATED
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD OF CROSSOVER DETERMINATION IN DIFFERENTIAL PAIR A...
- Publication number 20140189628
- Publication date Jul 3, 2014
- TEXAS INSTRUMENTS INCORPORATED
- Gregory Eric Howard
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Light Blocking Structure in Leadframe
- Publication number 20140091326
- Publication date Apr 3, 2014
- Andy Quang Tran
- H01 - BASIC ELECTRIC ELEMENTS

Andy Quang Tran

Person

Patents Grantslast 30 patents

Exposed pad integrated circuit package

Exposed pad integrated circuit package

Flat no-lead packages with electroplated edges

Flat no-lead packages with electroplated edges

Packaged semiconductor device having stacked attached chips overhan...

Semi-hermetic semiconductor package

Proximity sensor having light-blocking structure in leadframe and m...

Flat no-lead packages with electroplated edges

Proximity sensor having light-blocking structure in leadframe and m...

Flat no-lead packages with electroplated edges

Packaged semiconductor devices having solderable lead surfaces expo...

Fabricating a proximity sensor having light-blocking structure in l...

Proximity sensor having light blocking structure in leadframe

System and method of crossover determination in differential pair a...

Patents Applicationslast 30 patents

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

Flat No-Lead Packages with Electroplated Edges

Flat No-Lead Packages with Electroplated Edges

SEMI-HERMETIC SEMICONDUCTOR PACKAGE

FLAT NO-LEAD PACKAGES WITH ELECTROPLATED EDGES

Proximity Sensor Having Light-Blocking Structure in Leadframe and M...

EXPOSED PAD INTEGRATED CIRCUIT PACKAGE

PACKAGED SEMICONDUCTOR DEVICE HAVING STACKED ATTACHED CHIPS OVERHAN...

PACKAGED SEMICONDUCTOR DEVICE HAVING ATTACHED CHIPS OVERHANGING THE...

PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...

PROXIMITY SENSOR HAVING LIGHT-BLOCKING STRUCTURE IN LEADFRAME AND M...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH QFN LEA...

STRUCTURE AND METHOD OF PACKAGED SEMICONDUCTOR DEVICES WITH BENT-LE...

PACKAGED SEMICONDUCTOR DEVICES HAVING SOLDERABLE LEAD SURFACES EXPO...

Fabricating a Proximity Sensor Having Light-Blocking Structure in L...

SYSTEM AND METHOD OF CROSSOVER DETERMINATION IN DIFFERENTIAL PAIR A...

Light Blocking Structure in Leadframe