Angel Pepe

Person

Rancho Palos Verdes, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Wire bond through-via structure and method
- Patent number 9,431,275
- Issue date Aug 30, 2016
- PFG IP LLC
- Randy Bindrup
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable semiconductor chip layer comprising prefabricated trench...
- Patent number 7,786,562
- Issue date Aug 31, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional module comprised of layers containing IC chips wi...
- Patent number 7,239,012
- Issue date Jul 3, 2007
- Irvine Sensors Corp.
- Angel Pepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process of manufacturing multilayer modules
- Patent number 7,127,807
- Issue date Oct 31, 2006
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of making stackable layers containing encapsulated integrate...
- Patent number 6,797,537
- Issue date Sep 28, 2004
- Irvine Sensors Corporation
- Angel Antonio Pepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stackable layers containing encapsulated integrated circuit chips w...
- Patent number 6,784,547
- Issue date Aug 31, 2004
- Irvine Sensors Corporation
- Angel Antonio Pepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer modules with flexible substrates
- Patent number 6,734,370
- Issue date May 11, 2004
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stacking of multilayer modules
- Patent number 6,717,061
- Issue date Apr 6, 2004
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Stack of multilayer modules with heat-focusing metal layer
- Patent number 6,560,109
- Issue date May 6, 2003
- Irvine Sensors Corporation
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Dry adhesive joining of layers of electronic devices
- Patent number 5,635,010
- Issue date Jun 3, 1997
- Angel A. Pepe
- B32 - LAYERED PRODUCTS
Information Patent Grant
Fabrication of dense parallel solder bump connections
- Patent number 5,406,701
- Issue date Apr 18, 1995
- Irvine Sensors Corporation
- Angel A. Pepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating stacks of IC chips by segmenting a larger stack
- Patent number 5,279,991
- Issue date Jan 18, 1994
- Irvine Sensors Corporation
- Joseph A. Minahan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming detector array contact bumps for improved lift of...
- Patent number 5,091,288
- Issue date Feb 25, 1992
- Rockwell International Corporation
- Pierino I. Zappella
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY

Patents Applicationslast 30 patents

Information Patent Application
STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...
- Publication number 20100291735
- Publication date Nov 18, 2010
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable semiconductor chip layer comprising prefabricated trench...
- Publication number 20050277288
- Publication date Dec 15, 2005
- Volkan Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Three-dimensional module comprised of layers containing IC chips wi...
- Publication number 20050037540
- Publication date Feb 17, 2005
- Angel Pepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacked microelectronic module with vertical interconnect vias
- Publication number 20040113222
- Publication date Jun 17, 2004
- Volkan H. Ozguz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer modules with flexible substrates
- Publication number 20040040743
- Publication date Mar 4, 2004
- James Satsuo Yamaguchi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Stackable layers containing encapsulated integrated circuit chips w...
- Publication number 20030127735
- Publication date Jul 10, 2003
- Angel Antonio Pepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stackable layers containing encapsulated integrated circuit chips w...
- Publication number 20030080419
- Publication date May 1, 2003
- Angel Antonio Pepe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multilayer modules with flexible substrates
- Publication number 20030047353
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER
- Publication number 20030048609
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of manufacturing multilayer modules
- Publication number 20030049889
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stacking of multilayer modules
- Publication number 20030049424
- Publication date Mar 13, 2003
- James Satsuo Yamaguchi
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Wire bond through-via structure and method

Stackable semiconductor chip layer comprising prefabricated trench...

Three-dimensional module comprised of layers containing IC chips wi...

Process of manufacturing multilayer modules

Method of making stackable layers containing encapsulated integrate...

Stackable layers containing encapsulated integrated circuit chips w...

Multilayer modules with flexible substrates

Stacking of multilayer modules

Stack of multilayer modules with heat-focusing metal layer

Dry adhesive joining of layers of electronic devices

Fabrication of dense parallel solder bump connections

Method for fabricating stacks of IC chips by segmenting a larger stack

Method of forming detector array contact bumps for improved lift of...

Patents Applicationslast 30 patents

STACKABLE SEMICONDUCTOR CHIP LAYER COMPRISING PREFABRICATED TRENCH...

Stackable semiconductor chip layer comprising prefabricated trench...

Three-dimensional module comprised of layers containing IC chips wi...

Stacked microelectronic module with vertical interconnect vias

Multilayer modules with flexible substrates

Stackable layers containing encapsulated integrated circuit chips w...

Stackable layers containing encapsulated integrated circuit chips w...

Multilayer modules with flexible substrates

STACK OF MULTILAYER MODULES WITH HEAT-FOCUSSING METAL LAYER

Method of manufacturing multilayer modules

Stacking of multilayer modules