Angelique D. Raley

Person

Mechanicville, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Photoactive metal-based hard mask integration
- Patent number 12,100,591
- Issue date Sep 24, 2024
- Tokyo Electron Limited
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming self-aligned contacts using spin-on silicon car...
- Patent number 12,080,599
- Issue date Sep 3, 2024
- Tokyo Electron Limited
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for highly anisotropic etching of titanium oxide spacer usin...
- Patent number 12,009,211
- Issue date Jun 11, 2024
- Tokyo Electron Limited
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming contact holes with controlled local critical dimension unif...
- Patent number 11,978,631
- Issue date May 7, 2024
- Tokyo Electron Limited
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Extreme ultraviolet lithography patterning method
- Patent number 11,915,931
- Issue date Feb 27, 2024
- Tokyo Electron Limited
- Choong-man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-situ encapsulation of metal-insulator-metal (MIM) stacks for res...
- Patent number 11,882,776
- Issue date Jan 23, 2024
- Tokyo Electron Limited
- Katie Lutker-Lee
Information Patent Grant
Methods of patterning small features
- Patent number 11,837,471
- Issue date Dec 5, 2023
- Tokyo Electron Limited
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for patterning a dielectric layer
- Patent number 11,756,790
- Issue date Sep 12, 2023
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALD (atomic layer deposition) liner for via profile control and rel...
- Patent number 11,742,241
- Issue date Aug 29, 2023
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Split ash processes for via formation to suppress damage to low-K l...
- Patent number 11,721,578
- Issue date Aug 8, 2023
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for using ultra thin ruthenium metal hard mask for etching p...
- Patent number 11,688,604
- Issue date Jun 27, 2023
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for dry etching silicon carbide films for resist underlayer...
- Patent number 11,658,038
- Issue date May 23, 2023
- Tokyo Electron Limited
- Angelique Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for critical dimension (CD) trim of an organic pattern used...
- Patent number 11,621,164
- Issue date Apr 4, 2023
- Tokyo Electron Limited
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas phase etch with controllable etch selectivity of Si-containing...
- Patent number 11,538,691
- Issue date Dec 27, 2022
- Tokyo Electron Limited
- Subhadeep Kal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective deposition of conductive cap for fully-aligned-via (FAV)
- Patent number 11,515,203
- Issue date Nov 29, 2022
- Tokyo Electron Limited
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods to control critical dimension (CD) shrink ratio...
- Patent number 11,495,436
- Issue date Nov 8, 2022
- Tokyo Electron Limited
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for forming self-aligned contacts using spin-on silicon car...
- Patent number 11,482,454
- Issue date Oct 25, 2022
- Tokyo Electron Limited
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming a semiconductor feature using atomic layer etch
- Patent number 11,424,123
- Issue date Aug 23, 2022
- Tokyo Electron Limited
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Protective layers and methods of formation during plasma etching pr...
- Patent number 11,410,852
- Issue date Aug 9, 2022
- Tokyo Electron Limited
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Platform and method of operating for integrated end-to-end self-ali...
- Patent number 11,398,379
- Issue date Jul 26, 2022
- Tokyo Electron Limited
- Robert Clark
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Gas phase etching system and method
- Patent number 11,380,554
- Issue date Jul 5, 2022
- Tokyo Electron Limited
- Subhadeep Kal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for inverse via patterning for back end of line dual damasce...
- Patent number 11,361,993
- Issue date Jun 14, 2022
- Tokyo Electron Limited
- Angelique D. Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for reducing lithography defects and pattern transfer
- Patent number 11,333,968
- Issue date May 17, 2022
- Tokyo Electron Limited
- Angelique D. Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of patterning a metal film with improved sidewall roughness
- Patent number 11,322,364
- Issue date May 3, 2022
- Tokyo Electron Limited
- Nicholas Joy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Radiation of substrates during processing and systems thereof
- Patent number 11,289,325
- Issue date Mar 29, 2022
- Tokyo Electron Limited
- Michael Edley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Critical dimension trimming method designed to minimize line width...
- Patent number 11,227,767
- Issue date Jan 18, 2022
- Tokyo Electron Limited
- Angelique Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
ALD (atomic layer deposition) liner for via profile control and rel...
- Patent number 11,164,781
- Issue date Nov 2, 2021
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing methods for mandrel pull from spacers for multi-color...
- Patent number 11,127,594
- Issue date Sep 21, 2021
- Tokyo Electron Limited
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aware and correcting heterogenous platform incorporating integ...
- Patent number 11,101,173
- Issue date Aug 24, 2021
- Tokyo Electron Limited
- Robert Clark
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Gas phase etch with controllable etch selectivity of Si-containing...
- Patent number 10,971,372
- Issue date Apr 6, 2021
- Tokyo Electron Limited
- Subhadeep Kal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
System and Method for Semiconductor Structure
- Publication number 20240379354
- Publication date Nov 14, 2024
- TOKYO ELECTRON LIMITED
- David Eitan Barlaz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL ELEMENTS PATTERNING
- Publication number 20240353751
- Publication date Oct 24, 2024
- TEL Manufacturing and Engineering of America, Inc.
- Angelique Raley
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
EXTREME ULTRAVIOLET LITHOGRAPHY PATTERNING METHOD
- Publication number 20240153773
- Publication date May 9, 2024
- TOKYO ELECTRONIC LIMITED
- Choong-Man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-ETCH TREATMENT FOR METAL ETCH
- Publication number 20230369064
- Publication date Nov 16, 2023
- TOKYO ELECTRON LIMITED
- Scott Lefevre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods To Provide Anisotropic Etching Of Metal Hard Masks Using A...
- Publication number 20230343554
- Publication date Oct 26, 2023
- TOKYO ELECTRON LIMITED
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Patterning Features with Metal Based Resists
- Publication number 20230326755
- Publication date Oct 12, 2023
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Hard Mask Integration
- Publication number 20230260801
- Publication date Aug 17, 2023
- TOKYO ELECTRON LIMITED
- Angelique Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PHOTOACTIVE METAL-BASED HARD MASK INTEGRATION
- Publication number 20230253205
- Publication date Aug 10, 2023
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Scaling in Microfabrication
- Publication number 20230245890
- Publication date Aug 3, 2023
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Patterning a Substrate Using Photolithography
- Publication number 20230197505
- Publication date Jun 22, 2023
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Highly Anisotropic Etching Of Titanium Oxide Spacer Usin...
- Publication number 20230154752
- Publication date May 18, 2023
- TOKYO ELECTRON LIMITED
- Ya-Ming Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UV Treatment of EUV Resists
- Publication number 20230152705
- Publication date May 18, 2023
- TOKYO ELECTRON LIMITED
- Steven Grzeskowiak
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Focus Ring Regeneration
- Publication number 20230081862
- Publication date Mar 16, 2023
- TOKYO ELECTRON LIMITED
- Yanxiang Shi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Hybrid Development of EUV Resists
- Publication number 20230078946
- Publication date Mar 16, 2023
- TOKYO ELECTRON LIMITED
- Steven Grzeskowiak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Extreme Ultraviolet Lithography Patterning Method
- Publication number 20230054125
- Publication date Feb 23, 2023
- TOKYO ELECTRON LIMITED
- Choong-man Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Self-Aligned Contacts Using Spin-on Silicon Car...
- Publication number 20230044047
- Publication date Feb 9, 2023
- TOKYO ELECTRON LIMITED
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Line Roughness Reduction and Self-Aligned Multi-Patternin...
- Publication number 20220319838
- Publication date Oct 6, 2022
- TOKYO ELECTRON LIMITED
- Eric Chih-Fang Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PATTERNING A DIELECTRIC LAYER
- Publication number 20220293419
- Publication date Sep 15, 2022
- TOKYO ELECTRON LIMITED
- Yen-Tien Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for Forming Self-Aligned Contacts Using Spin-on Silicon Car...
- Publication number 20220262679
- Publication date Aug 18, 2022
- TOKYO ELECTRON LIMITED
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Reducing Lithography Defects and Pattern Transfer
- Publication number 20220244636
- Publication date Aug 4, 2022
- TOKYO ELECTRON LIMITED
- Angélique D. Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation of Substrates During Processing and Systems Thereof
- Publication number 20220189764
- Publication date Jun 16, 2022
- TOKYO ELECTRON LIMITED
- Michael Edley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORMING CONTACT HOLES WITH CONTROLLED LOCAL CRITICAL DIMENSION UNIF...
- Publication number 20220181152
- Publication date Jun 9, 2022
- TOKYO ELECTRON LIMITED
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CRITICAL DIMENSION (CD) TRIM OF AN ORGANIC PATTERN USED...
- Publication number 20220076942
- Publication date Mar 10, 2022
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma Pre-Treatment Method To Improve Etch Selectivity And Defecti...
- Publication number 20220037152
- Publication date Feb 3, 2022
- TOKYO ELECTRON LIMITED
- Angelique Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ALD (ATOMIC LAYER DEPOSITION) LINER FOR VIA PROFILE CONTROL AND REL...
- Publication number 20220020642
- Publication date Jan 20, 2022
- TOKYO ELECTRON LIMITED
- Xinghua Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Radiation of Substrates During Processing and Systems Thereof
- Publication number 20210407790
- Publication date Dec 30, 2021
- TOKYO ELECTRON LIMITED
- Michael Edley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR DRY ETCHING SILICON CARBIDE FILMS FOR RESIST UNDERLAYER...
- Publication number 20210358763
- Publication date Nov 18, 2021
- TOKYO ELECTRON LIMITED
- Angelique Raley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods to Control Critical Dimension (CD) Shrink Ratio...
- Publication number 20210343502
- Publication date Nov 4, 2021
- TOKYO ELECTRON LIMITED
- Junling Sun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PATTERNING A METAL FILM WITH IMPROVED SIDEWALL ROUGHNESS
- Publication number 20210313192
- Publication date Oct 7, 2021
- TOKYO ELECTRON LIMITED
- Nicholas Joy
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
In-situ Encapsulation of Metal-Insulator-Metal (MIM) stacks for Res...
- Publication number 20210313513
- Publication date Oct 7, 2021
- TOKYO ELECTRON LIMITED
- Katie Lutker-Lee
- H01 - BASIC ELECTRIC ELEMENTS

Angelique D. Raley

Person

Patents Grantslast 30 patents

Photoactive metal-based hard mask integration

Methods for forming self-aligned contacts using spin-on silicon car...

Method for highly anisotropic etching of titanium oxide spacer usin...

Forming contact holes with controlled local critical dimension unif...

Extreme ultraviolet lithography patterning method

In-situ encapsulation of metal-insulator-metal (MIM) stacks for res...

Methods of patterning small features

Method for patterning a dielectric layer

ALD (atomic layer deposition) liner for via profile control and rel...

Split ash processes for via formation to suppress damage to low-K l...

Method for using ultra thin ruthenium metal hard mask for etching p...

Method for dry etching silicon carbide films for resist underlayer...

Method for critical dimension (CD) trim of an organic pattern used...

Gas phase etch with controllable etch selectivity of Si-containing...

Selective deposition of conductive cap for fully-aligned-via (FAV)

Systems and methods to control critical dimension (CD) shrink ratio...

Methods for forming self-aligned contacts using spin-on silicon car...

Forming a semiconductor feature using atomic layer etch

Protective layers and methods of formation during plasma etching pr...

Platform and method of operating for integrated end-to-end self-ali...

Gas phase etching system and method

Method for inverse via patterning for back end of line dual damasce...

Method for reducing lithography defects and pattern transfer

Method of patterning a metal film with improved sidewall roughness

Radiation of substrates during processing and systems thereof

Critical dimension trimming method designed to minimize line width...

ALD (atomic layer deposition) liner for via profile control and rel...

Manufacturing methods for mandrel pull from spacers for multi-color...

Self-aware and correcting heterogenous platform incorporating integ...

Gas phase etch with controllable etch selectivity of Si-containing...

Patents Applicationslast 30 patents

System and Method for Semiconductor Structure

OPTICAL ELEMENTS PATTERNING

EXTREME ULTRAVIOLET LITHOGRAPHY PATTERNING METHOD

PRE-ETCH TREATMENT FOR METAL ETCH

Methods To Provide Anisotropic Etching Of Metal Hard Masks Using A...

Patterning Features with Metal Based Resists

Metal Hard Mask Integration

PHOTOACTIVE METAL-BASED HARD MASK INTEGRATION

Pitch Scaling in Microfabrication

Method for Patterning a Substrate Using Photolithography

Method For Highly Anisotropic Etching Of Titanium Oxide Spacer Usin...

UV Treatment of EUV Resists

Focus Ring Regeneration

Hybrid Development of EUV Resists

Extreme Ultraviolet Lithography Patterning Method

Methods for Forming Self-Aligned Contacts Using Spin-on Silicon Car...

Method of Line Roughness Reduction and Self-Aligned Multi-Patternin...

METHOD FOR PATTERNING A DIELECTRIC LAYER

Methods for Forming Self-Aligned Contacts Using Spin-on Silicon Car...

Method For Reducing Lithography Defects and Pattern Transfer

Radiation of Substrates During Processing and Systems Thereof

FORMING CONTACT HOLES WITH CONTROLLED LOCAL CRITICAL DIMENSION UNIF...

METHOD FOR CRITICAL DIMENSION (CD) TRIM OF AN ORGANIC PATTERN USED...

Plasma Pre-Treatment Method To Improve Etch Selectivity And Defecti...

ALD (ATOMIC LAYER DEPOSITION) LINER FOR VIA PROFILE CONTROL AND REL...

Radiation of Substrates During Processing and Systems Thereof

METHOD FOR DRY ETCHING SILICON CARBIDE FILMS FOR RESIST UNDERLAYER...

Systems and Methods to Control Critical Dimension (CD) Shrink Ratio...

METHOD OF PATTERNING A METAL FILM WITH IMPROVED SIDEWALL ROUGHNESS

In-situ Encapsulation of Metal-Insulator-Metal (MIM) stacks for Res...