Anindya Poddar

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Metal ribs in electromechanical devices
- Patent number 12,160,219
- Issue date Dec 3, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Frame design in embedded die package
- Patent number 12,154,861
- Issue date Nov 26, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 12,125,799
- Issue date Oct 22, 2024
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package for stress sensitive component and semiconductor device
- Patent number 12,074,134
- Issue date Aug 27, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Forming integrated inductors and transformers with embedded magneti...
- Patent number 12,057,264
- Issue date Aug 6, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package with thermal pad
- Patent number 12,021,019
- Issue date Jun 25, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Packages with electrical fuses
- Patent number 12,009,336
- Issue date Jun 11, 2024
- Texas Instruments Incorporated
- Mahmud Halim Chowdhury
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip packaged devices with thermal pad
- Patent number 11,955,456
- Issue date Apr 9, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having an interdigitated mold arrangement
- Patent number 11,942,384
- Issue date Mar 26, 2024
- Texas Instruments Incorporated
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with isolated heat spreader
- Patent number 11,923,281
- Issue date Mar 5, 2024
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal ribs in electromechanical devices
- Patent number 11,736,085
- Issue date Aug 22, 2023
- Texas Instruments Incorporated
- Anindya Poddar
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 11,538,717
- Issue date Dec 27, 2022
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 11,450,638
- Issue date Sep 20, 2022
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of a passive component in a cavity of an integrated cir...
- Patent number 11,430,722
- Issue date Aug 30, 2022
- Texas Instruments Incorporated
- Jeffrey Morroni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices for high voltage with die edge prote...
- Patent number 11,417,579
- Issue date Aug 16, 2022
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fan-out electronic device
- Patent number 11,410,875
- Issue date Aug 9, 2022
- Texas Instruments Incorporated
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit backside metallization
- Patent number 11,367,699
- Issue date Jun 21, 2022
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with isolated heat spreader
- Patent number 11,302,615
- Issue date Apr 12, 2022
- Texas Instruments Incorporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die packaging with integrated ceramic substrate
- Patent number 11,183,460
- Issue date Nov 23, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stress buffer layer in embedded package
- Patent number 11,183,441
- Issue date Nov 23, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded die package multichip module
- Patent number 11,158,595
- Issue date Oct 26, 2021
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper passivation
- Patent number 11,021,786
- Issue date Jun 1, 2021
- Texas Instruments Incorporated
- Luu Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device with double-sided cooling
- Patent number 10,879,155
- Issue date Dec 29, 2020
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic package for integrated circuits and related methods
- Patent number 10,861,741
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated circuit backside metallization
- Patent number 10,763,230
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Hiroyuki Sada
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bump bond structure for enhanced electromigration performance
- Patent number 10,763,231
- Issue date Sep 1, 2020
- Texas Instruments Incorporated
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Packaged semiconductor devices for high voltage with die edge prote...
- Patent number 10,748,827
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of a passive component in an integrated circuit package
- Patent number 10,734,313
- Issue date Aug 4, 2020
- Texas Instruments Incorporated
- Jeffrey Morroni
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Additive deposition low temperature curable magnetic interconnectin...
- Patent number 10,650,957
- Issue date May 12, 2020
- Texas Instruments Incorporated
- Yi Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage flip-chip on lead (FOL) package
- Patent number 10,580,722
- Issue date Mar 3, 2020
- Texas Instruments Incoporated
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20240421120
- Publication date Dec 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20240347441
- Publication date Oct 17, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20240332243
- Publication date Oct 3, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RIBS IN ELECTROMECHANICAL DEVICES
- Publication number 20230396230
- Publication date Dec 7, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya PODDAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
POWER MODULE PACKAGE WITH MAGNETIC MOLD COMPOUND
- Publication number 20230335509
- Publication date Oct 19, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES
- Publication number 20230275007
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto SHIBUYA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION PROCESS FOR PROTECTING CIRCUIT COMPONENTS
- Publication number 20230274993
- Publication date Aug 31, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya PODDAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD
- Publication number 20230136784
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT
- Publication number 20230137762
- Publication date May 4, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Makoto Shibuya
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY
- Publication number 20230092132
- Publication date Mar 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Hau Nguyen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL INTERPOSER
- Publication number 20230059142
- Publication date Feb 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Vivek Arora
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGES WITH ELECTRICAL FUSES
- Publication number 20230036643
- Publication date Feb 2, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Mahmud Halim CHOWDHURY
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE
- Publication number 20230005881
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD
- Publication number 20230005880
- Publication date Jan 5, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...
- Publication number 20220415768
- Publication date Dec 29, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Jeffrey MORRONI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER
- Publication number 20220238424
- Publication date Jul 28, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE
- Publication number 20220108955
- Publication date Apr 7, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL RIBS IN ELECTROMECHANICAL DEVICES
- Publication number 20220069795
- Publication date Mar 3, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Anindya PODDAR
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER
- Publication number 20210202357
- Publication date Jul 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FRAME DESIGN IN EMBEDDED DIE PACKAGE
- Publication number 20210134729
- Publication date May 6, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS
- Publication number 20210090940
- Publication date Mar 25, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Kurt Peter Wachtler
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
- Publication number 20210035932
- Publication date Feb 4, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Hiroyuki SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE
- Publication number 20200402938
- Publication date Dec 24, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dibyajat Mishra
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGED SEMICONDUCTOR DEVICES FOR HIGH VOLTAGE WITH DIE EDGE PROTE...
- Publication number 20200381322
- Publication date Dec 3, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE WITH DOUBLE-SIDED COOLING
- Publication number 20200357729
- Publication date Nov 12, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FAN-OUT ELECTRONIC DEVICE
- Publication number 20200203219
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hau Thanh Nguyen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT BACKSIDE METALLIZATION
- Publication number 20200203295
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Hiroyuki SADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stress Buffer Layer in Embedded Package
- Publication number 20200203249
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Woochan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COPPER PASSIVATION
- Publication number 20200173013
- Publication date Jun 4, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Luu Thanh Nguyen
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
High Voltage Flip-Chip On Lead (FOL) Package
- Publication number 20200161225
- Publication date May 21, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Anindya Poddar
- H01 - BASIC ELECTRIC ELEMENTS

Anindya Poddar

Person

Patents Grantslast 30 patents

Metal ribs in electromechanical devices

Frame design in embedded die package

Embedded die packaging with integrated ceramic substrate

Package for stress sensitive component and semiconductor device

Forming integrated inductors and transformers with embedded magneti...

Semiconductor device package with thermal pad

Packages with electrical fuses

Flip chip packaged devices with thermal pad

Semiconductor package having an interdigitated mold arrangement

Semiconductor package with isolated heat spreader

Metal ribs in electromechanical devices

Electronic package for integrated circuits and related methods

Bump bond structure for enhanced electromigration performance

Integration of a passive component in a cavity of an integrated cir...

Packaged semiconductor devices for high voltage with die edge prote...

Fan-out electronic device

Integrated circuit backside metallization

Semiconductor package with isolated heat spreader

Embedded die packaging with integrated ceramic substrate

Stress buffer layer in embedded package

Embedded die package multichip module

Copper passivation

Electronic device with double-sided cooling

Electronic package for integrated circuits and related methods

Integrated circuit backside metallization

Bump bond structure for enhanced electromigration performance

Packaged semiconductor devices for high voltage with die edge prote...

Integration of a passive component in an integrated circuit package

Additive deposition low temperature curable magnetic interconnectin...

High voltage flip-chip on lead (FOL) package

Patents Applicationslast 30 patents

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

PACKAGES WITH ELECTRICAL FUSES

METAL RIBS IN ELECTROMECHANICAL DEVICES

POWER MODULE PACKAGE WITH MAGNETIC MOLD COMPOUND

CONDUCTIVE MEMBERS ATOP SEMICONDUCTOR PACKAGES

FABRICATION PROCESS FOR PROTECTING CIRCUIT COMPONENTS

SEMICONDUCTOR DEVICE PACKAGE WITH THERMAL PAD

SEMICONDUCTOR PACKAGE HAVING AN INTERDIGITATED MOLD ARRANGEMENT

WAFER LEVEL PROCESSING FOR MICROELECTRONIC DEVICE PACKAGE WITH CAVITY

FLIP CHIP PACKAGED DEVICES WITH THERMAL INTERPOSER

PACKAGES WITH ELECTRICAL FUSES

PACKAGE FOR STRESS SENSITIVE COMPONENT AND SEMICONDUCTOR DEVICE

FLIP CHIP PACKAGED DEVICES WITH THERMAL PAD

INTEGRATION OF A PASSIVE COMPONENT IN A CAVITY OF AN INTEGRATED CIR...

SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER

EMBEDDED DIE PACKAGING WITH INTEGRATED CERAMIC SUBSTRATE

METAL RIBS IN ELECTROMECHANICAL DEVICES

SEMICONDUCTOR PACKAGE WITH ISOLATED HEAT SPREADER

FRAME DESIGN IN EMBEDDED DIE PACKAGE

ELECTRONIC PACKAGE FOR INTEGRATED CIRCUITS AND RELATED METHODS

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

BUMP BOND STRUCTURE FOR ENHANCED ELECTROMIGRATION PERFORMANCE

PACKAGED SEMICONDUCTOR DEVICES FOR HIGH VOLTAGE WITH DIE EDGE PROTE...

ELECTRONIC DEVICE WITH DOUBLE-SIDED COOLING

FAN-OUT ELECTRONIC DEVICE

INTEGRATED CIRCUIT BACKSIDE METALLIZATION

Stress Buffer Layer in Embedded Package

COPPER PASSIVATION

High Voltage Flip-Chip On Lead (FOL) Package