Anish Tolia

Person

Santa Clara, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-step process for depositing copper seed layer in a via
- Patent number 6,893,541
- Issue date May 17, 2005
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Process for sputtering copper in a self ionized plasma
- Patent number 6,582,569
- Issue date Jun 24, 2003
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Direct temperature control for a component of a substrate processin...
- Patent number 6,433,314
- Issue date Aug 13, 2002
- Applied Materials, Inc.
- Tushar Mandrekar
- G05 - CONTROLLING REGULATING
Information Patent Grant
Method for igniting a plasma in a sputter reactor
- Patent number 6,413,383
- Issue date Jul 2, 2002
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma reactor and shields generating self-ionized plasma for sputt...
- Patent number 6,398,929
- Issue date Jun 4, 2002
- Applied Materials, Inc.
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for removing processing liquid from a processi...
- Patent number 6,375,753
- Issue date Apr 23, 2002
- Applied Materials, Inc.
- Anish Tolia
- B08 - CLEANING
Information Patent Grant
Method and apparatus for removing processing liquid from a processi...
- Patent number 6,345,642
- Issue date Feb 12, 2002
- Applied Materials, Inc.
- Ted G. Yoshidome
- F16 - ENGINEERING ELEMENTS AND UNITS GENERAL MEASURES FOR PRODUCING AND MAINT...
Information Patent Grant
Method and apparatus for removing processing liquid from a processi...
- Patent number 6,305,392
- Issue date Oct 23, 2001
- Applied Materials, Inc.
- Anish Tolia
- B08 - CLEANING
Information Patent Grant
Plasma treatment for ex-situ contact fill
- Patent number 6,297,147
- Issue date Oct 2, 2001
- Applied Materials, Inc.
- Lisa Yang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for controlling cooling and heating fluids for...
- Patent number 6,117,245
- Issue date Sep 12, 2000
- Applied Materials, Inc.
- Tushar Mandrekar
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Multi-step process for depositing copper seed layer in a via
- Publication number 20030124846
- Publication date Jul 3, 2003
- Tony P. Chiang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20030116427
- Publication date Jun 26, 2003
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method and apparatus for removing processing liquid from a processi...
- Publication number 20020026951
- Publication date Mar 7, 2002
- Anish Tolia
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Anish Tolia

Person

Patents Grantslast 30 patents

Multi-step process for depositing copper seed layer in a via

Process for sputtering copper in a self ionized plasma

Direct temperature control for a component of a substrate processin...

Method for igniting a plasma in a sputter reactor

Plasma reactor and shields generating self-ionized plasma for sputt...

Method and apparatus for removing processing liquid from a processi...

Method and apparatus for removing processing liquid from a processi...

Method and apparatus for removing processing liquid from a processi...

Plasma treatment for ex-situ contact fill

Method and apparatus for controlling cooling and heating fluids for...

Patents Applicationslast 30 patents

Multi-step process for depositing copper seed layer in a via

Self-ionized and inductively-coupled plasma for sputtering and resp...

Method and apparatus for removing processing liquid from a processi...