Anna Katharina Krefft

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Munich, DE

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Patents Grantslast 30 patents

Information Patent Grant
Package comprising a substrate, an integrated device, and an encaps...
- Patent number 11,605,571
- Issue date Mar 14, 2023
- QUALCOMM Incorporated
- Alberto Jose Teixeira De Queiros
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Integrated circuit package comprising an enhanced electromagnetic s...
- Patent number 10,438,901
- Issue date Oct 8, 2019
- QUALCOMM Incorporated
- Anna Katharina Krefft
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
INTEGRATED BARE DIE PACKAGE, AND RELATED FABRICATION METHODS
- Publication number 20240203938
- Publication date Jun 20, 2024
- QUALCOMM Incorporated
- Yeng Kwan Hoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PACKAGE COMPRISING A SUBSTRATE, AN INTEGRATED DEVICE, AND AN ENCAP...
- Publication number 20210375707
- Publication date Dec 2, 2021
- QUALCOMM Incorporated
- Alberto Jose TEIXEIRA DE QUEIROS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT PACKAGE COMPRISING AN ENHANCED ELECTROMAGNETIC S...
- Publication number 20210327825
- Publication date Oct 21, 2021
- QUALCOMM Incorporated
- Chunrong LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEVICE COMPRISING COMPARTMENTAL SHIELDING WITH IMPROVED HEAT DISSIP...
- Publication number 20200203287
- Publication date Jun 25, 2020
- QUALCOMM Incorporated
- Anna Katharina KREFFT
- H01 - BASIC ELECTRIC ELEMENTS