Anne F. Miller

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Slurry for chemical mechanical polishing of aluminum
- Patent number 7,731,864
- Issue date Jun 8, 2010
- Intel Corporation
- Allen Daniel Feller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Introducing nanotubes in trenches and structures formed thereby
- Patent number 7,666,465
- Issue date Feb 23, 2010
- Intel Corporation
- Paul B. Fischer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming planarizing copper in a low-k dielectric
- Patent number 7,585,760
- Issue date Sep 8, 2009
- Intel Corporation
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical dissolution of barrier and adhesion layers
- Patent number 7,560,380
- Issue date Jul 14, 2009
- Intel Corporation
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Damascene fabrication with electrochemical layer removal
- Patent number 7,223,685
- Issue date May 29, 2007
- Intel Corporation
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Surfactant slurry additives to improve erosion, dishing, and defect...
- Patent number 7,201,784
- Issue date Apr 10, 2007
- Intel Corporation
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for making a semiconductor device having a high-k gate diele...
- Patent number 7,157,378
- Issue date Jan 2, 2007
- Intel Corporation
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial dielectric planarization layer
- Patent number 7,109,557
- Issue date Sep 19, 2006
- Intel Corporation
- Chris E. Barns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High pH slurry for chemical mechanical polishing of copper
- Patent number 6,909,193
- Issue date Jun 21, 2005
- Intel Corporation
- Anne E. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sacrificial dielectric planarization layer
- Patent number 6,908,863
- Issue date Jun 21, 2005
- Intel Corporation
- Chris E. Barns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper polish slurry for reduced interlayer dielectric erosion and...
- Patent number 6,852,631
- Issue date Feb 8, 2005
- Intel Corporation
- Anne E. Miller
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Copper polish slurry for reduced interlayer dielectric erosion and...
- Patent number 6,838,383
- Issue date Jan 4, 2005
- Intel Corporation
- Anne E. Miller
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
High PH slurry for chemical mechanical polishing of copper
- Patent number 6,825,117
- Issue date Nov 30, 2004
- Intel Corporation
- Anne E. Miller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper polish slurry for reduced interlayer dielectric erosion and...
- Patent number 6,787,061
- Issue date Sep 7, 2004
- Intel Corporation
- Anne E. Miller
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Ceric-ion slurry for use in chemical-mechanical polishing
- Patent number 6,752,844
- Issue date Jun 22, 2004
- Intel Corporation
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Slurry and method for chemical mechanical polishing of copper
- Patent number 6,740,591
- Issue date May 25, 2004
- Intel Corporation
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Slurry for polishing a barrier layer
- Patent number 6,719,920
- Issue date Apr 13, 2004
- Intel Corporation
- Anne E. Miller
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and chemistry for cleaning of oxidized copper during chemica...
- Patent number 6,719,614
- Issue date Apr 13, 2004
- Intel Corporation
- Anne E. Miller
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method of forming a raised contact for a substrate
- Patent number 6,596,640
- Issue date Jul 22, 2003
- Intel Corporation
- Paul B. Fishcer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and chemistry for cleaning of oxidized copper during chemica...
- Patent number 6,464,568
- Issue date Oct 15, 2002
- Intel Corporation
- Anne E. Miller
- B08 - CLEANING
Information Patent Grant
Method and chemistry for cleaning of oxidized copper during chemica...
- Patent number 6,443,814
- Issue date Sep 3, 2002
- Intel Corporation
- Anne E. Miller
- B08 - CLEANING

Patents Applicationslast 30 patents

Information Patent Application
Ultrasonic electropolishing of conductive material
- Publication number 20080213995
- Publication date Sep 4, 2008
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Chemical dissolution of barrier and adhesion layers
- Publication number 20080102631
- Publication date May 1, 2008
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming planarizing copper in a low-k dielectric
- Publication number 20070298605
- Publication date Dec 27, 2007
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for copper damascence fill for forming an interconnect
- Publication number 20070298607
- Publication date Dec 27, 2007
- Tatyana N. Andryushchenko
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reducing aluminum dissolution in high pH solutions
- Publication number 20070152252
- Publication date Jul 5, 2007
- Mark F. Buehler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Slurry for chemical mechanical polishing of aluminum
- Publication number 20070004209
- Publication date Jan 4, 2007
- Allen Daniel Feller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper containing abrasive particles to modify reactivity and perfo...
- Publication number 20060138087
- Publication date Jun 29, 2006
- Harsono S. Simka
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Introducing nanotubes in trenches and structures formed thereby
- Publication number 20060141222
- Publication date Jun 29, 2006
- Paul B. Fischer
- B82 - NANO-TECHNOLOGY
Information Patent Application
Chemical mechanical polish slurry
- Publication number 20060124592
- Publication date Jun 15, 2006
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Facilitating removal of sacrificial layers to form replacement meta...
- Publication number 20060046523
- Publication date Mar 2, 2006
- Jack Kavalieros
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a semiconductor device having a high-k gate diele...
- Publication number 20060008968
- Publication date Jan 12, 2006
- Justin K. Brask
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial dielectric planarization layer
- Publication number 20050070061
- Publication date Mar 31, 2005
- Chris E. Barns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sacrificial dielectric planarization layer
- Publication number 20050070093
- Publication date Mar 31, 2005
- Chris E. Barns
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH PH SLURRY FOR CHEMICAL MECHANICAL POLISHING OF COPPER
- Publication number 20050017367
- Publication date Jan 27, 2005
- ANNE E. MILLER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Damascene fabrication with electrochemical layer removal
- Publication number 20050003637
- Publication date Jan 6, 2005
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Surfactant slurry additives to improve erosion, dishing, and defect...
- Publication number 20040266183
- Publication date Dec 30, 2004
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Damascene fabrication with electrochemical layer removal
- Publication number 20040256224
- Publication date Dec 23, 2004
- Tatyana N. Andryushchenko
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Ceric-ion slurry for use in chemical-mechanical polishing
- Publication number 20040203245
- Publication date Oct 14, 2004
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Ceric-ion slurry for use in chemical-mechanical polishing
- Publication number 20040203227
- Publication date Oct 14, 2004
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Slurry and method for chemical mechanical polishing of copper
- Publication number 20030211745
- Publication date Nov 13, 2003
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper polish slurry for reduced interlayer dielectric erosion and...
- Publication number 20030194868
- Publication date Oct 16, 2003
- Anne E. Miller
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
HIGH PH SLURRY FOR CHEMICAL MECHANICAL POLISHING OF COPPER
- Publication number 20030134512
- Publication date Jul 17, 2003
- ANNE E. MILLER
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry for polishing a barrier layer
- Publication number 20030102457
- Publication date Jun 5, 2003
- Anne E. Miller
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Slurry and method for chemical mechanical polishing of copper
- Publication number 20020177316
- Publication date Nov 28, 2002
- Anne E. Miller
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Copper polish slurry for reduced interlayer dielectric erosion and...
- Publication number 20020177318
- Publication date Nov 28, 2002
- Anne E. Miller
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND CHEMISTRY FOR CLEANING OF OXIDIZED COPPER DURING CHEMICA...
- Publication number 20020106976
- Publication date Aug 8, 2002
- Anne E. Miller
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
Method and chemistry for cleaning of oxidized copper during chemica...
- Publication number 20020107155
- Publication date Aug 8, 2002
- Anne E. Miller
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
METHOD AND CHEMISTRY FOR CLEANING OF OXIDIZED COPPER DURING CHEMICA...
- Publication number 20020102922
- Publication date Aug 1, 2002
- Anne E. Miller
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Application
CERIC-ION SLURRY FOR USE IN CHEMICAL-MECHANICAL POLISHING
- Publication number 20020053656
- Publication date May 9, 2002
- ANNE E. MILLER
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Anne F. Miller

Person

Patents Grantslast 30 patents

Slurry for chemical mechanical polishing of aluminum

Introducing nanotubes in trenches and structures formed thereby

Method for forming planarizing copper in a low-k dielectric

Chemical dissolution of barrier and adhesion layers

Damascene fabrication with electrochemical layer removal

Surfactant slurry additives to improve erosion, dishing, and defect...

Method for making a semiconductor device having a high-k gate diele...

Sacrificial dielectric planarization layer

High pH slurry for chemical mechanical polishing of copper

Sacrificial dielectric planarization layer

Copper polish slurry for reduced interlayer dielectric erosion and...

Copper polish slurry for reduced interlayer dielectric erosion and...

High PH slurry for chemical mechanical polishing of copper

Copper polish slurry for reduced interlayer dielectric erosion and...

Ceric-ion slurry for use in chemical-mechanical polishing

Slurry and method for chemical mechanical polishing of copper

Slurry for polishing a barrier layer

Method and chemistry for cleaning of oxidized copper during chemica...

Method of forming a raised contact for a substrate

Method and chemistry for cleaning of oxidized copper during chemica...

Method and chemistry for cleaning of oxidized copper during chemica...

Patents Applicationslast 30 patents

Ultrasonic electropolishing of conductive material

Chemical dissolution of barrier and adhesion layers

Method for forming planarizing copper in a low-k dielectric

Method for copper damascence fill for forming an interconnect

Reducing aluminum dissolution in high pH solutions

Slurry for chemical mechanical polishing of aluminum

Copper containing abrasive particles to modify reactivity and perfo...

Introducing nanotubes in trenches and structures formed thereby

Chemical mechanical polish slurry

Facilitating removal of sacrificial layers to form replacement meta...

Method for making a semiconductor device having a high-k gate diele...

Sacrificial dielectric planarization layer

Sacrificial dielectric planarization layer

HIGH PH SLURRY FOR CHEMICAL MECHANICAL POLISHING OF COPPER

Damascene fabrication with electrochemical layer removal

Surfactant slurry additives to improve erosion, dishing, and defect...

Damascene fabrication with electrochemical layer removal

Ceric-ion slurry for use in chemical-mechanical polishing

Ceric-ion slurry for use in chemical-mechanical polishing

Slurry and method for chemical mechanical polishing of copper

Copper polish slurry for reduced interlayer dielectric erosion and...

HIGH PH SLURRY FOR CHEMICAL MECHANICAL POLISHING OF COPPER

Slurry for polishing a barrier layer

Slurry and method for chemical mechanical polishing of copper

Copper polish slurry for reduced interlayer dielectric erosion and...

METHOD AND CHEMISTRY FOR CLEANING OF OXIDIZED COPPER DURING CHEMICA...

Method and chemistry for cleaning of oxidized copper during chemica...

METHOD AND CHEMISTRY FOR CLEANING OF OXIDIZED COPPER DURING CHEMICA...

CERIC-ION SLURRY FOR USE IN CHEMICAL-MECHANICAL POLISHING