Ansgar Schäufele

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Munchen, DE

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Patents Grantslast 30 patents

Information Patent Grant
Covering for a component and method for producing a covering for a...
- Patent number 11,180,364
- Issue date Nov 23, 2021
- Snaptrack, Inc.
- Ansgar Schäufele
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a microelectromechanical transducer
- Patent number 9,637,379
- Issue date May 2, 2017
- TDK Corporation
- Marcel Giesen
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Component having stress-reduced mounting
- Patent number 8,624,466
- Issue date Jan 7, 2014
- EPCOS AG
- Ansgar Schäufele
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of producing a thin-film resonator
- Patent number 7,805,820
- Issue date Oct 5, 2010
- EPCOS AG
- Christoph Eggs
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Encapsulated electronics device with improved heat dissipation
- Patent number 6,992,400
- Issue date Jan 31, 2006
- Nokia Corporation
- Pasi Tikka
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
COMPONENT WITH A THIN-LAYER COVERING AND METHOD FOR ITS PRODUCTION
- Publication number 20190238113
- Publication date Aug 1, 2019
- SnapTrack, Inc.
- Roland ROSEZIN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COVERING FOR A COMPONENT AND METHOD FOR PRODUCING A COVERING FOR A...
- Publication number 20170267519
- Publication date Sep 21, 2017
- SnapTrack, Inc.
- Ansgar SCHÄUFELE
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Method for Producing a Microelectromechanical Transducer
- Publication number 20160167960
- Publication date Jun 16, 2016
- EPCOS AG
- Marcel GIESEN
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPONENT HAVING STRESS-REDUCED MOUNTING
- Publication number 20100176899
- Publication date Jul 15, 2010
- EPCOS AG
- Ansgar Schäufele
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Thin-film resonator and method for producing a multi-layer component
- Publication number 20060170308
- Publication date Aug 3, 2006
- EPCOS AG
- Christoph Eggs
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
Method for improving heat dissipation in encapsulated electronic co...
- Publication number 20050167854
- Publication date Aug 4, 2005
- Nokia Corporation
- Pasi Tikka
- H03 - BASIC ELECTRONIC CIRCUITRY