Anson Jay Call

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package metal shadowing checks
- Patent number 10,956,649
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Connected plane stiffener within integrated circuit chip carrier
- Patent number 10,770,385
- Issue date Sep 8, 2020
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Automated generation of surface-mount package design
- Patent number 10,706,204
- Issue date Jul 7, 2020
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduction of laminate failure in integrated circuit (IC) device car...
- Patent number 10,607,928
- Issue date Mar 31, 2020
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package via stack checking
- Patent number 10,546,096
- Issue date Jan 28, 2020
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 10,483,233
- Issue date Nov 19, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package metal shadowing checks
- Patent number 10,423,752
- Issue date Sep 24, 2019
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 10,276,534
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating contacts of an electronic package structure t...
- Patent number 10,276,535
- Issue date Apr 30, 2019
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminate substrate thermal warpage prediction for designing a lamin...
- Patent number 10,108,753
- Issue date Oct 23, 2018
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Reduction of solder interconnect stress
- Patent number 9,865,557
- Issue date Jan 9, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Copper feature design for warpage control of substrates
- Patent number 9,659,131
- Issue date May 23, 2017
- GLOBALFOUNDRIES Inc.
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Split ball grid array pad for multi-chip modules
- Patent number 9,633,914
- Issue date Apr 25, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
In-plane copper imbalance for warpage prediction
- Patent number 9,563,732
- Issue date Feb 7, 2017
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Copper feature design for warpage control of substrates
- Patent number 9,105,535
- Issue date Aug 11, 2015
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Apparatus for crack prevention in integrated circuit packages
- Patent number 7,786,579
- Issue date Aug 31, 2010
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for assembling a carrier and a semiconductor device
- Patent number 6,584,684
- Issue date Jul 1, 2003
- International Business Machines
- Peter J. Brofman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrical interconnection package and method thereof
- Patent number 6,333,563
- Issue date Dec 25, 2001
- International Business Machines Corporation
- Raymond A. Jackson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, materials, and methods for socketable ball grid
- Patent number 6,300,164
- Issue date Oct 9, 2001
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, materials, and applications of ball grid array interconn...
- Patent number 6,297,559
- Issue date Oct 2, 2001
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module with metal-ion matrix induced dendrites for interconnection
- Patent number 6,218,629
- Issue date Apr 17, 2001
- International Business Machines Corporation
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure, materials, and methods for socketable ball grid
- Patent number 6,120,885
- Issue date Sep 19, 2000
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydro...
- Patent number 6,114,450
- Issue date Sep 5, 2000
- International Business Corporation
- Krishna Gandhi Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hyd...
- Patent number 5,955,543
- Issue date Sep 21, 1999
- International Business Machines Corporation
- Krishna Gandhi Sachdev
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable polymer chip encapsulant
- Patent number 5,930,597
- Issue date Jul 27, 1999
- International Business Machines Corporation
- Anson Jay Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and solution for cleaning solder connections of electronic c...
- Patent number 5,759,285
- Issue date Jun 2, 1998
- International Business Machines Corporation
- Stephen L. Buchwalter
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Reworkable polymer chip encapsulant
- Patent number 5,659,203
- Issue date Aug 19, 1997
- International Business Machines Corporation
- Anson Jay Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for directly joining a chip to a heat sink
- Patent number 5,533,256
- Issue date Jul 9, 1996
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming chip carrier with a single protective encapsulant
- Patent number 5,471,027
- Issue date Nov 28, 1995
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection structure and test method
- Patent number 5,147,084
- Issue date Sep 15, 1992
- International Business Machines Corporation
- John R. Behun
- G01 - MEASURING TESTING

Patents Applicationslast 30 patents

Information Patent Application
AUTOMATED GENERATION OF SURFACE-MOUNT PACKAGE DESIGN
- Publication number 20200104454
- Publication date Apr 2, 2020
- International Business Machines Corporation
- Jean Audet
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Connected Plane Stiffener Within Integrated Circuit Chip Carrier
- Publication number 20200035593
- Publication date Jan 30, 2020
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE METAL SHADOWING CHECKS
- Publication number 20190377850
- Publication date Dec 12, 2019
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE VIA STACK CHECKING
- Publication number 20190102504
- Publication date Apr 4, 2019
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGE METAL SHADOWING CHECKS
- Publication number 20190102506
- Publication date Apr 4, 2019
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061799
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF SOLDER INTERCONNECT STRESS
- Publication number 20180061800
- Publication date Mar 1, 2018
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAMINATE SUBSTRATE THERMAL WARPAGE PREDICTION FOR DESIGNING A LAMIN...
- Publication number 20170351783
- Publication date Dec 7, 2017
- International Business Machines Corporation
- Anson J. Call
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170141078
- Publication date May 18, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES
- Publication number 20170077000
- Publication date Mar 16, 2017
- International Business Machines Corporation
- Anson J. Call
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Copper Feature Design for Warpage Control of Substrates
- Publication number 20150317423
- Publication date Nov 5, 2015
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Copper Feature Design for Warpage Control of Substrates
- Publication number 20130334711
- Publication date Dec 19, 2013
- International Business Machines Corporation
- Edmund Blackshear
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
APPARATUS FOR CRACK PREVENTION IN INTEGRATED CIRCUIT PACKAGES
- Publication number 20080290510
- Publication date Nov 27, 2008
- International Business Machines Corporation
- Jean Audet
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
ELECTRICALLY CONDUCTIVE LIQUID PISTON ENGINE
- Publication number 20080072597
- Publication date Mar 27, 2008
- International Business Machines Corporation
- Anson J. Call
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
Method for assembling a carrier and a semiconductor device
- Publication number 20010007288
- Publication date Jul 12, 2001
- Peter J. Brofman
- H01 - BASIC ELECTRIC ELEMENTS

Anson Jay Call

Person

Patents Grantslast 30 patents

Semiconductor package metal shadowing checks

Connected plane stiffener within integrated circuit chip carrier

Automated generation of surface-mount package design

Reduction of laminate failure in integrated circuit (IC) device car...

Semiconductor package via stack checking

Split ball grid array pad for multi-chip modules

Semiconductor package metal shadowing checks

Reduction of solder interconnect stress

Method of fabricating contacts of an electronic package structure t...

Laminate substrate thermal warpage prediction for designing a lamin...

Reduction of solder interconnect stress

Copper feature design for warpage control of substrates

Split ball grid array pad for multi-chip modules

In-plane copper imbalance for warpage prediction

Copper feature design for warpage control of substrates

Apparatus for crack prevention in integrated circuit packages

Method for assembling a carrier and a semiconductor device

Electrical interconnection package and method thereof

Structure, materials, and methods for socketable ball grid

Structure, materials, and applications of ball grid array interconn...

Module with metal-ion matrix induced dendrites for interconnection

Structure, materials, and methods for socketable ball grid

Aryl Cyanate and/or diepoxide and tetrahydropyranyl-protected hydro...

Aryl cyanate and/or diepoxide and hydroxymethylated phenolic or hyd...

Reworkable polymer chip encapsulant

Method and solution for cleaning solder connections of electronic c...

Reworkable polymer chip encapsulant

Method for directly joining a chip to a heat sink

Method for forming chip carrier with a single protective encapsulant

Interconnection structure and test method

Patents Applicationslast 30 patents

AUTOMATED GENERATION OF SURFACE-MOUNT PACKAGE DESIGN

Connected Plane Stiffener Within Integrated Circuit Chip Carrier

SEMICONDUCTOR PACKAGE METAL SHADOWING CHECKS

SEMICONDUCTOR PACKAGE VIA STACK CHECKING

SEMICONDUCTOR PACKAGE METAL SHADOWING CHECKS

REDUCTION OF SOLDER INTERCONNECT STRESS

REDUCTION OF SOLDER INTERCONNECT STRESS

LAMINATE SUBSTRATE THERMAL WARPAGE PREDICTION FOR DESIGNING A LAMIN...

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

SPLIT BALL GRID ARRAY PAD FOR MULTI-CHIP MODULES

Copper Feature Design for Warpage Control of Substrates

Copper Feature Design for Warpage Control of Substrates

APPARATUS FOR CRACK PREVENTION IN INTEGRATED CIRCUIT PACKAGES

ELECTRICALLY CONDUCTIVE LIQUID PISTON ENGINE

Method for assembling a carrier and a semiconductor device