Claims
- 1. An adhesive prepared from a resin composition, the resin composition comprising:
- a resin comprising an aryl cyanate ester resin or an aryl cyanate resin, and a member selected from the group consisting of cycloaliphatic and aliphatic diepoxide resins, and bisphenol diepoxide resins; and
- an additive comprising a hydroxymethyl functionalized oligomeric/polymeric phenolic resin having the formula: ##STR3## wherein X is H, CH.sub.3 or C.sub.2 H.sub.5, and wherein the additive has a degree of hydroxymethylation in the range of about 5 to about 15 percent based on the molar equivalent of the monomer unit of novolak or poly (hydroxy-styrene), the resin and additive being an admixture.
- 2. The adhesive of claim 1 wherein the resin is liquid at room temperature.
- 3. The adhesive of claim 1 wherein the resin is the cyanate ester resin and the resin has 5-20 percent of the monomeric functionality converted to triazine rings or a prepolymer.
- 4. The adhesive of claim 1 wherein the resin a diepoxide is selected from the group consisting of: 3,4-epoxy cyclohexyl methyl-3,4-epoxy cyclohexane carboxylate; bis-3,4-epoxy cyclohexyl adipate; bis-epoxide derived from 4-vinyl-1-cyclohexene; bis-(3,4-epoxycyclohexyl) adipate; bis-glycidyl ethers such as 2,2-bis (4-glycidoxyphenyl)propane; 1,4-butane diol diglycidyl ether; diglycidyl ether of bisphenol F; and mixtures thereof.
- 5. The additive of claim 1 wherein the additive has a molecular weight in the range of about 1,000 to about 8,000 daltons.
- 6. The adhesive of claim 1 wherein the additive is a hydroxymethylated novolak or poly(p-hydroxystyrene) having a degree of hydroxymethylation in the range of about 5 to about 15 percent based on the molar equivalent of formaldehyde used for a molar equivalent of the monomer unit of novolak or poly(hydroxy-styrene).
- 7. The adhesive of claim 1 wherein the weight ratio of resin to additive is in the range of about 95:5 to about 80:20.
- 8. The adhesive of claim 1 further comprising, in admixture, a filler.
- 9. The adhesive of claim 8 wherein the filler is present in a weight ratio of resin or resin and adhesive to filler in the range of about 15:85 to about 50:50.
- 10. The adhesive of claim 8 wherein the filler is a conductive filler.
- 11. The adhesive of claim 8 wherein the filler is metal flakes.
- 12. The resin of claim 1 when the additive is further characterized by the absence of a solvent.
Parent Case Info
This application is a continuation of application Ser. No. 08/859,975 filed May 21, 1997, U.S. Pat. No. 5,955,543, which is a continuation of application Ser. No. 09/585,343 filed Jan. 11, 1996, abandoned.
US Referenced Citations (17)
Foreign Referenced Citations (4)
Number |
Date |
Country |
53-134034 |
Nov 1978 |
JPX |
1-95164 |
Apr 1989 |
JPX |
1-159908 |
Jun 1989 |
JPX |
4-300952 |
Oct 1992 |
JPX |
Non-Patent Literature Citations (1)
Entry |
Ireland, "Epoxy Bleedout in Ceramic Chip Carriers", Int. J. Hybrid Microelectronics, vol. 5, No. 1, Feb. 1982, pp. 1-4. |
Continuations (2)
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Number |
Date |
Country |
Parent |
859975 |
May 1997 |
|
Parent |
585343 |
Jan 1996 |
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