Anthony E. Panczak

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Shielding technique for semiconductor package including metal lid a...
- Patent number 9,153,543
- Issue date Oct 6, 2015
- Amkor Technology, Inc.
- Marc Alan Mangrum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making near chip size integrated circuit package
- Patent number 6,962,829
- Issue date Nov 8, 2005
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package having adhesive bead supporting planar l...
- Patent number 6,268,654
- Issue date Jul 31, 2001
- Ankor Technology, Inc.
- Thomas P. Glenn
- G11 - INFORMATION STORAGE
Information Patent Grant
Near chip size integrated circuit package
- Patent number 6,228,676
- Issue date May 8, 2001
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making integrated circuit package having adhesive bead su...
- Patent number 6,117,705
- Issue date Sep 12, 2000
- Amkor Technology, Inc.
- Thomas P. Glenn
- G11 - INFORMATION STORAGE
Information Patent Grant
Integrated circuit package
- Patent number 6,034,429
- Issue date Mar 7, 2000
- Amkor Technology, Inc.
- Thomas P. Glenn
- G11 - INFORMATION STORAGE
Information Patent Grant
Near chip size integrated circuit package
- Patent number 5,981,314
- Issue date Nov 9, 1999
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making an integrated circuit package
- Patent number 5,950,074
- Issue date Sep 7, 1999
- Amkor Technology, Inc.
- Thomas P. Glenn
- G11 - INFORMATION STORAGE
Information Patent Grant
Substrate board having an anti-adhesive solder mask
- Patent number 5,796,586
- Issue date Aug 18, 1998
- National Semiconductor, Inc.
- Shaw Wei Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder ball joint
- Patent number 5,796,163
- Issue date Aug 18, 1998
- Amkor Technology, Inc.
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra thin ball grid array using a flex tape or printed wiring boar...
- Patent number 5,620,928
- Issue date Apr 15, 1997
- National Semiconductor Corporation
- Shaw W. Lee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Method of making near chip size integrated circuit package
- Publication number 20020168798
- Publication date Nov 14, 2002
- Thomas P. Glenn
- H01 - BASIC ELECTRIC ELEMENTS

Anthony E. Panczak

Person

Patents Grantslast 30 patents

Shielding technique for semiconductor package including metal lid a...

Method of making near chip size integrated circuit package

Integrated circuit package having adhesive bead supporting planar l...

Near chip size integrated circuit package

Method of making integrated circuit package having adhesive bead su...

Integrated circuit package

Near chip size integrated circuit package

Method of making an integrated circuit package

Substrate board having an anti-adhesive solder mask

Solder ball joint

Ultra thin ball grid array using a flex tape or printed wiring boar...

Patents Applicationslast 30 patents

Method of making near chip size integrated circuit package