Anthony Minervini

Person

Palos Hills, IL, US

People

Patents Grantslast 30 patents

Information Patent Grant
Inductive acoustic filters for acoustic devices
- Patent number 11,902,727
- Issue date Feb 13, 2024
- Apple Inc.
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Vented liquid-resistant microphone assembly
- Patent number 11,882,394
- Issue date Jan 23, 2024
- Apple Inc.
- Anthony D. Minervini
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Miniature external temperature sensing device for estimating subsur...
- Patent number 11,635,334
- Issue date Apr 25, 2023
- Apple Inc.
- Helia Rahmani
- G01 - MEASURING TESTING
Information Patent Grant
Sensor assembly for electronic device
- Patent number 11,228,846
- Issue date Jan 18, 2022
- Apple Inc.
- Florence W. Ow
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Lids with a patterned conductor for microphone transducer packages,...
- Patent number 11,134,325
- Issue date Sep 28, 2021
- Apple Inc.
- Peter C. Hrudey
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Liquid-resistant packaging for electro-acoustic transducers and ele...
- Patent number 10,587,942
- Issue date Mar 10, 2020
- Apple Inc.
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port multi-part surface mount silicon condenser microphone
- Patent number 10,477,301
- Issue date Nov 12, 2019
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port multi-part surface mount MEMS microphone
- Patent number 10,321,226
- Issue date Jun 11, 2019
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated particle filter for MEMS device
- Patent number 10,167,188
- Issue date Jan 1, 2019
- Apple Inc.
- Janhavi S. Agashe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated particle and light filter for MEMS device
- Patent number 10,149,032
- Issue date Dec 4, 2018
- Apple Inc.
- Janhavi S. Agashe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Composite fuse element and method of making
- Patent number 10,134,556
- Issue date Nov 20, 2018
- Littelfuse, Inc.
- Ben Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microphone package with an integrated digital signal processor
- Patent number 10,123,112
- Issue date Nov 6, 2018
- Invensense, Inc.
- Carlo Murgia
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Top port multi-part surface mount silicon condenser microphone
- Patent number 9,980,038
- Issue date May 22, 2018
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated CMOS back cavity acoustic transducer and the method of p...
- Patent number 9,828,240
- Issue date Nov 28, 2017
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port multi-part surface mount silicon condenser microphone
- Patent number 9,693,133
- Issue date Jun 27, 2017
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems (MEMS) microphone having two back ca...
- Patent number 9,510,106
- Issue date Nov 29, 2016
- Invensense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Top port microelectromechanical systems microphone
- Patent number 9,426,581
- Issue date Aug 23, 2016
- Invensense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Microphone on printed circuit board (PCB)
- Patent number 9,392,376
- Issue date Jul 12, 2016
- Invensense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Top port multi-part surface mount silicon condenser microphone
- Patent number 9,338,560
- Issue date May 10, 2016
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Integrated CMOS back cavity acoustic transducer and the method of p...
- Patent number 9,299,671
- Issue date Mar 29, 2016
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus and method for reduced strain on MEMS devices
- Patent number 9,296,607
- Issue date Mar 29, 2016
- Invensense, Inc.
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Microelectromechanical systems device optimized for flip-chip assem...
- Patent number 9,282,389
- Issue date Mar 8, 2016
- Invensense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Methods of manufacture of top port surface mount MEMS microphones
- Patent number 9,156,684
- Issue date Oct 13, 2015
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of manufacture of bottom port surface mount MEMS microphones
- Patent number 9,150,409
- Issue date Oct 6, 2015
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port surface mount MEMS microphone
- Patent number 9,148,731
- Issue date Sep 29, 2015
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Top port surface mount MEMS microphone
- Patent number 9,139,421
- Issue date Sep 22, 2015
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Bottom port surface mount MEMS microphone
- Patent number 9,139,422
- Issue date Sep 22, 2015
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method and apparatus for controlling Q losses through force distrib...
- Patent number 9,143,057
- Issue date Sep 22, 2015
- Qualtre, Inc.
- Ashish A. Shah
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of manufacture of bottom port surface mount MEMS microphones
- Patent number 9,133,020
- Issue date Sep 15, 2015
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Methods of manufacture of top port multi-part surface mount MEMS mi...
- Patent number 9,096,423
- Issue date Aug 4, 2015
- Knowles Electronics, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY

Patents Applicationslast 30 patents

Information Patent Application
VENTED LIQUID-RESISTANT MICROPHONE ASSEMBLY
- Publication number 20240114277
- Publication date Apr 4, 2024
- Apple Inc.
- Anthony D. MINERVINI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY
- Publication number 20240107249
- Publication date Mar 28, 2024
- Apple Inc.
- Kyusang KIM
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
SPEAKER AND MICROPHONE FOR ACOUSTIC DEVICES
- Publication number 20230379609
- Publication date Nov 23, 2023
- Apple Inc.
- Scott C. GRINKER
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
VENTED LIQUID-RESISTANT MICROPHONE ASSEMBLY
- Publication number 20230262372
- Publication date Aug 17, 2023
- Apple Inc.
- Anthony D. MINERVINI
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INDUCTIVE ACOUSTIC FILTERS FOR ACOUSTIC DEVICES
- Publication number 20230262370
- Publication date Aug 17, 2023
- Apple Inc.
- Anthony D. MINERVINI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
ACOUSTIC WAVE ATTENUATOR FOR AN ELECTRONIC DEVICE
- Publication number 20230092004
- Publication date Mar 23, 2023
- Apple Inc.
- Peter C. Hrudey
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Miniature External Temperature Sensing Device for Estimating Subsur...
- Publication number 20210404883
- Publication date Dec 30, 2021
- Apple Inc.
- Helia Rahmani
- G01 - MEASURING TESTING
Information Patent Application
SENSOR ASSEMBLY FOR ELECTRONIC DEVICE
- Publication number 20210258698
- Publication date Aug 19, 2021
- Apple Inc.
- Florence W. OW
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIDS WITH A PATTERNED CONDUCTOR FOR MICROPHONE TRANSDUCER PACKAGES,...
- Publication number 20200404407
- Publication date Dec 24, 2020
- Apple Inc.
- Peter C. Hrudey
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
LIQUID-RESISTANT PACKAGING FOR ELECTRO-ACOUSTIC TRANSDUCERS AND ELE...
- Publication number 20200107096
- Publication date Apr 2, 2020
- Apple Inc.
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE
- Publication number 20190253791
- Publication date Aug 15, 2019
- KNOWLES ELECTRONICS, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE PACKAGE
- Publication number 20180249242
- Publication date Aug 30, 2018
- KNOWLES ELECTRONICS, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PARTICLE FILTER FOR MEMS DEVICE
- Publication number 20180215609
- Publication date Aug 2, 2018
- Apple Inc.
- Janhavi S. Agashe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED PARTICLE AND LIGHT FILTER FOR MEMS DEVICE
- Publication number 20180220216
- Publication date Aug 2, 2018
- Apple Inc.
- Janhavi S. Agashe
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE
- Publication number 20170264997
- Publication date Sep 14, 2017
- KNOWLES ELECTRONICS, LLC
- Anthony D. Minervini
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE PACKAGE WITH AN INTEGRATED DIGITAL SIGNAL PROCESSOR
- Publication number 20170164107
- Publication date Jun 8, 2017
- InvenSense, Inc.
- Carlo Murgia
- G10 - MUSICAL INSTRUMENTS ACOUSTICS
Information Patent Application
TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE
- Publication number 20160241951
- Publication date Aug 18, 2016
- KNOWLES ELECTRONICS, LLC
- Anthony D. Minervini
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...
- Publication number 20160167956
- Publication date Jun 16, 2016
- InvenSense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE
- Publication number 20160165330
- Publication date Jun 9, 2016
- InvenSense, Inc.
- Anthony D. Minervini
- G01 - MEASURING TESTING
Information Patent Application
APPARATUS AND METHOD FOR SEALING A MEMS DEVICE
- Publication number 20160093791
- Publication date Mar 31, 2016
- InvenSense, Inc.
- Anthony D. Minervini
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS DEVICE OPTIMIZED FOR FLIP-CHIP ASSEM...
- Publication number 20160050475
- Publication date Feb 18, 2016
- InvenSense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
TOP PORT MICROELECTROMECHANICAL SYSTEMS MICROPHONE
- Publication number 20150350793
- Publication date Dec 3, 2015
- InvenSense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE HAVING TWO BACK CA...
- Publication number 20150289045
- Publication date Oct 8, 2015
- InvenSense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
MEMS DEVICE WITH SPLIT PAD PACKAGE
- Publication number 20150217991
- Publication date Aug 6, 2015
- InvenSense, Inc.
- Anthony D. MINERVINI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MICROPHONE ON PRINTED CIRCUIT BOARD (PCB)
- Publication number 20150146887
- Publication date May 28, 2015
- InvenSense, Inc.
- Aleksey S. Khenkin
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...
- Publication number 20150102390
- Publication date Apr 16, 2015
- Invensense, Inc.
- Fang Liu
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS AND METHOD FOR REDUCED STRAIN ON MEMS DEVICES
- Publication number 20150021718
- Publication date Jan 22, 2015
- InvenSense, Inc.
- ANTHONY D. MINERVINI
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
COMPOSITE FUSE ELEMENT AND METHOD OF MAKING
- Publication number 20140240082
- Publication date Aug 28, 2014
- LITTELFUSE, INC.
- Ben Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package With A CMOS Die Positioned Underneath A MEMS Die
- Publication number 20120161259
- Publication date Jun 28, 2012
- Peter V. Loeppert
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE
- Publication number 20120161258
- Publication date Jun 28, 2012
- Peter V. Loeppert
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Anthony Minervini

Person

Patents Grantslast 30 patents

Inductive acoustic filters for acoustic devices

Vented liquid-resistant microphone assembly

Miniature external temperature sensing device for estimating subsur...

Sensor assembly for electronic device

Lids with a patterned conductor for microphone transducer packages,...

Liquid-resistant packaging for electro-acoustic transducers and ele...

Top port multi-part surface mount silicon condenser microphone

Top port multi-part surface mount MEMS microphone

Integrated particle filter for MEMS device

Integrated particle and light filter for MEMS device

Composite fuse element and method of making

Microphone package with an integrated digital signal processor

Top port multi-part surface mount silicon condenser microphone

Integrated CMOS back cavity acoustic transducer and the method of p...

Top port multi-part surface mount silicon condenser microphone

Microelectromechanical systems (MEMS) microphone having two back ca...

Top port microelectromechanical systems microphone

Microphone on printed circuit board (PCB)

Top port multi-part surface mount silicon condenser microphone

Integrated CMOS back cavity acoustic transducer and the method of p...

Apparatus and method for reduced strain on MEMS devices

Microelectromechanical systems device optimized for flip-chip assem...

Methods of manufacture of top port surface mount MEMS microphones

Methods of manufacture of bottom port surface mount MEMS microphones

Top port surface mount MEMS microphone

Top port surface mount MEMS microphone

Bottom port surface mount MEMS microphone

Method and apparatus for controlling Q losses through force distrib...

Methods of manufacture of bottom port surface mount MEMS microphones

Methods of manufacture of top port multi-part surface mount MEMS mi...

Patents Applicationslast 30 patents

VENTED LIQUID-RESISTANT MICROPHONE ASSEMBLY

MOLDED INTEGRATED CIRCUIT PACKAGE WITH SENSOR ASSEMBLY

SPEAKER AND MICROPHONE FOR ACOUSTIC DEVICES

VENTED LIQUID-RESISTANT MICROPHONE ASSEMBLY

INDUCTIVE ACOUSTIC FILTERS FOR ACOUSTIC DEVICES

ACOUSTIC WAVE ATTENUATOR FOR AN ELECTRONIC DEVICE

Miniature External Temperature Sensing Device for Estimating Subsur...

SENSOR ASSEMBLY FOR ELECTRONIC DEVICE

LIDS WITH A PATTERNED CONDUCTOR FOR MICROPHONE TRANSDUCER PACKAGES,...

LIQUID-RESISTANT PACKAGING FOR ELECTRO-ACOUSTIC TRANSDUCERS AND ELE...

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE PACKAGE

INTEGRATED PARTICLE FILTER FOR MEMS DEVICE

INTEGRATED PARTICLE AND LIGHT FILTER FOR MEMS DEVICE

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE

MICROPHONE PACKAGE WITH AN INTEGRATED DIGITAL SIGNAL PROCESSOR

TOP PORT MULTI-PART SURFACE MOUNT SILICON CONDENSER MICROPHONE

INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...

INTEGRATED TEMPERATURE SENSOR IN MICROPHONE PACKAGE

APPARATUS AND METHOD FOR SEALING A MEMS DEVICE

MICROELECTROMECHANICAL SYSTEMS DEVICE OPTIMIZED FOR FLIP-CHIP ASSEM...

TOP PORT MICROELECTROMECHANICAL SYSTEMS MICROPHONE

MICROELECTROMECHANICAL SYSTEMS (MEMS) MICROPHONE HAVING TWO BACK CA...

MEMS DEVICE WITH SPLIT PAD PACKAGE

MICROPHONE ON PRINTED CIRCUIT BOARD (PCB)

INTEGRATED CMOS BACK CAVITY ACOUSTIC TRANSDUCER AND THE METHOD OF P...

APPARATUS AND METHOD FOR REDUCED STRAIN ON MEMS DEVICES

COMPOSITE FUSE ELEMENT AND METHOD OF MAKING

Package With A CMOS Die Positioned Underneath A MEMS Die

PACKAGE WITH A CMOS DIE POSITIONED UNDERNEATH A MEMS DIE