Anthony R. Plepys

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Austin, TX, US

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Patents Grantslast 30 patents

Information Patent Grant
Laminated integrated circuit package
- Patent number 6,140,707
- Issue date Oct 31, 2000
- 3M Innovative Properties Co.
- Anthony R. Plepys
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer interconnect sutructure for ball grid arrays
- Patent number 5,844,168
- Issue date Dec 1, 1998
- Minnesota Mining and Manufacturing Company
- Randolph Dennis Schueller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wire bond tape ball grid array package
- Patent number 5,663,530
- Issue date Sep 2, 1997
- Minnesota Mining and Manufacturing Company
- Randolph D. Schueller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHIELDED ELECTRICAL CABLE
- Publication number 20240347228
- Publication date Oct 17, 2024
- 3M Innovative Properties Company
- John T. Cowher
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Laminated integrated circuit package
- Publication number 20010052647
- Publication date Dec 20, 2001
- 3M Innovative Properties Company
- Anthony R. Plepys
- H01 - BASIC ELECTRIC ELEMENTS