Anthony Yi Sheng Sun

Person

Singapore, SG

People

Patents Grantslast 30 patents

Information Patent Grant
High density chip scale leadframe package and method of manufacturi...
- Patent number 8,129,222
- Issue date Mar 6, 2012
- United Test and Assembly Test Center Ltd.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with under bump metallization aligned with op...
- Patent number 8,030,768
- Issue date Oct 4, 2011
- United Test & Assembly Center Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of making the same
- Patent number 7,948,095
- Issue date May 24, 2011
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structurally-enhanced integrated circuit package and method of manu...
- Patent number 7,830,006
- Issue date Nov 9, 2010
- United Test and Assembly Center, Ltd.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die IC package and manufacturing method
- Patent number 7,816,775
- Issue date Oct 19, 2010
- United Test & Assembly Center Limited
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked die packages
- Patent number 7,723,833
- Issue date May 25, 2010
- United Test & Assembly Center Ltd.
- Gaurav Mehta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package and method of manufacture
- Patent number 7,678,610
- Issue date Mar 16, 2010
- UTAC - United Test and Assembly Test Center Ltd.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe enhancement and method of producing a multi-row semicondu...
- Patent number 7,476,569
- Issue date Jan 13, 2009
- United Test & Assembly Center Ltd.
- Danny Vallejo Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe enhancement and method of producing a multi-row semicondu...
- Patent number 7,375,416
- Issue date May 20, 2008
- United Test & Assembly Center Ltd.
- Danny Vallejo Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded high density electronic packaging structure for high perform...
- Patent number 7,361,995
- Issue date Apr 22, 2008
- Xilinx, Inc.
- Kim Yong Goh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density chip scale leadframe package and method of manufacturi...
- Patent number 7,345,357
- Issue date Mar 18, 2008
- United Test & Assembly Center Ltd.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High performance chip scale leadframe package with thermal dissipat...
- Patent number 7,323,769
- Issue date Jan 29, 2008
- United Test & Assembly Center Ltd.
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20100109169
- Publication date May 6, 2010
- United Test & Assembly Center Ltd.
- Ravi Kanth KOLAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME
- Publication number 20090200662
- Publication date Aug 13, 2009
- United Test & Assembly Center Ltd.
- Catherine Bee Liang Ng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip Scale Package and Method of Assembling the Same
- Publication number 20080290509
- Publication date Nov 27, 2008
- UNITED TEST AND ASSEMBLY CENTER
- Hien Boon Tan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BUMP ON VIA-PACKAGING AND METHODOLOGIES
- Publication number 20080284015
- Publication date Nov 20, 2008
- United Test and Assembly Center, Ltd.
- Roel Robles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE
- Publication number 20080251938
- Publication date Oct 16, 2008
- UTAC - United Test and Assembly Center LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDU...
- Publication number 20080199985
- Publication date Aug 21, 2008
- UNITED TEST AND ASSEMBLY CENTER LTD.
- Danny Vallejo Retuta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Die Ic Package and Manufacturing Method
- Publication number 20080150103
- Publication date Jun 26, 2008
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Thermally enhanced semiconductor package and method of producing th...
- Publication number 20070164425
- Publication date Jul 19, 2007
- UNITED TEST AND ASSEMBLY CENTER LTD.
- Ravi Kanth Kolan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package and method of manufacture
- Publication number 20060192292
- Publication date Aug 31, 2006
- UTAC -UNITED TEST AND ASSEMBLY TEST CENTER LTD.
- Chuen Khiang Wang
- H01 - BASIC ELECTRIC ELEMENTS

Anthony Yi Sheng Sun

Person

Patents Grantslast 30 patents

High density chip scale leadframe package and method of manufacturi...

Semiconductor package with under bump metallization aligned with op...

Semiconductor package and method of making the same

Structurally-enhanced integrated circuit package and method of manu...

Multi-die IC package and manufacturing method

Stacked die packages

Semiconductor chip package and method of manufacture

Leadframe enhancement and method of producing a multi-row semicondu...

Leadframe enhancement and method of producing a multi-row semicondu...

Molded high density electronic packaging structure for high perform...

High density chip scale leadframe package and method of manufacturi...

High performance chip scale leadframe package with thermal dissipat...

Patents Applicationslast 30 patents

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

SEMICONDUCTOR PACKAGE AND METHOD OF MAKING THE SAME

Chip Scale Package and Method of Assembling the Same

BUMP ON VIA-PACKAGING AND METHODOLOGIES

SEMICONDUCTOR CHIP PACKAGE AND METHOD OF MANUFACTURE

LEADFRAME ENHANCEMENT AND METHOD OF PRODUCING A MULTI-ROW SEMICONDU...

Multi-Die Ic Package and Manufacturing Method

Thermally enhanced semiconductor package and method of producing th...

Semiconductor chip package and method of manufacture