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Anton Legen
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Munich, DE
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Patents Grants
last 30 patents
Information
Patent Grant
Assembly device and assembly method for a cooling element
Patent number
7,796,393
Issue date
Sep 14, 2010
Qimonda AG
Anton Legen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Semiconductor device comprising a housing and a semiconductor chip...
Patent number
7,781,900
Issue date
Aug 24, 2010
Infineon Technologies AG
Manuel Carmona
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for connection of an integrated circuit to a substrate, and...
Patent number
7,517,727
Issue date
Apr 14, 2009
Infineon Technologies AG
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for mounting a chip on a base and arrangement produced by th...
Patent number
7,368,322
Issue date
May 6, 2008
Infineon Technologies AG
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate-based housing component with a semiconductor chip
Patent number
7,256,070
Issue date
Aug 14, 2007
Infineon Technologies AG
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Self-supporting connecting element for a semiconductor chip
Patent number
7,253,514
Issue date
Aug 7, 2007
Infineon Technologies, AG
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic device having a stack of semiconductor chips and method...
Patent number
6,894,381
Issue date
May 17, 2005
Infineon Technologies AG
Wolfgang Hetzel
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
HEAT SINK FOR AN ELECTRONIC DEVICE
Publication number
20090290301
Publication date
Nov 26, 2009
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEM INCLUDING AN ELECTRONIC MODULE WITH A HEAT SPREADER
Publication number
20090251857
Publication date
Oct 8, 2009
QIMONDA AG
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CLIP FOR ATTACHING PANELS
Publication number
20090175016
Publication date
Jul 9, 2009
Qimonda AG
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Assembly Device and Assembly Method for a Cooling Element
Publication number
20090135565
Publication date
May 28, 2009
Anton Legen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
METHOD AND APPARATUS FOR HEAT TRANSFER
Publication number
20090129012
Publication date
May 21, 2009
Anton Legen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
MEMORY MODULE HEAT SINK
Publication number
20090109613
Publication date
Apr 30, 2009
QIMONDA AG
Anton Legen
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
SYSTEM HAVING A HEAT TRANSFER APPARATUS
Publication number
20090002951
Publication date
Jan 1, 2009
QIMONDA AG
Anton Legen
F28 - HEAT EXCHANGE IN GENERAL
Information
Patent Application
Semiconductor Device Comprising a Housing and a Semiconductor Chip...
Publication number
20080111231
Publication date
May 15, 2008
Manuel Carmona
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
COMBINATION HEAT DISSIPATION DEVICE WITH TERMINATION AND A METHOD O...
Publication number
20080032446
Publication date
Feb 7, 2008
Steve Wood
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Memory Module Including a Cooling Element, Method for Producing the...
Publication number
20070217160
Publication date
Sep 20, 2007
QIMONDA AG
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for connection of an integrated circuit to a substrate, and...
Publication number
20060163717
Publication date
Jul 27, 2006
Harry Hedler
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based housing component with a semiconductor chip
Publication number
20060049503
Publication date
Mar 9, 2006
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based BGA package, in particular FBGA package
Publication number
20060017149
Publication date
Jan 26, 2006
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Method for mounting a chip on a base and arrangement produced by th...
Publication number
20060017156
Publication date
Jan 26, 2006
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Substrate-based die package with BGA or BGA-like components
Publication number
20050285247
Publication date
Dec 29, 2005
Martin Reiss
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Arrangement for increasing the reliability of substrate-based BGA p...
Publication number
20050285266
Publication date
Dec 29, 2005
Martin Reiss
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Connecting elements on semiconductor chips for semiconductor compon...
Publication number
20050156308
Publication date
Jul 21, 2005
Anton Legen
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Electronic device having a stack of semiconductor chips and method...
Publication number
20040159954
Publication date
Aug 19, 2004
Infineon Technologies AG
Wolfgang Hetzel
H01 - BASIC ELECTRIC ELEMENTS