Antonius Hendrikus Jozef Kamphuis

Person

Lent, NL

People

Patents Grantslast 30 patents

Information Patent Grant
Technique for handling diced wafers of integrated circuits
- Patent number 11,881,425
- Issue date Jan 23, 2024
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and system for regulating plasma dicing rates
- Patent number 11,721,586
- Issue date Aug 8, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Technique for handling diced wafers of integrated circuits
- Patent number 11,658,056
- Issue date May 23, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Technique for handling diced wafers of integrated circuits
- Patent number 11,508,606
- Issue date Nov 22, 2022
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatuses and methods for coupling a waveguide structure to an in...
- Patent number 11,380,634
- Issue date Jul 5, 2022
- NXP B.V.
- Antonius Johannes Matheus de Graauw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package comprising an encapsulated and conduct...
- Patent number 11,133,578
- Issue date Sep 28, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Magnetic shielding structure for MRAM array
- Patent number 10,998,489
- Issue date May 4, 2021
- NXP B.V.
- Franciscus Petrus Widdershoven
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical control modules for integrated circuit device patterning an...
- Patent number 10,942,444
- Issue date Mar 9, 2021
- NXP USA, INC.
- Leendertjan Mekking
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Integrated circuit saw bow break point
- Patent number 10,896,878
- Issue date Jan 19, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conformal dummy die
- Patent number 10,643,957
- Issue date May 5, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-die and antenna array device
- Patent number 10,593,635
- Issue date Mar 17, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of making a plurality of packaged semiconductor devices
- Patent number 10,431,476
- Issue date Oct 1, 2019
- NXP B.V.
- Jetse de Witte
- G01 - MEASURING TESTING
Information Patent Grant
Multi-die array device
- Patent number 10,431,575
- Issue date Oct 1, 2019
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
ON-CHIP SHIELDED DEVICE
- Publication number 20240138129
- Publication date Apr 25, 2024
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR
- Publication number 20240088068
- Publication date Mar 14, 2024
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND SYSTEM FOR REGULATING PLASMA DICING RATES
- Publication number 20230326796
- Publication date Oct 12, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT
- Publication number 20230290737
- Publication date Sep 14, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RF COMPONENT AND METHOD
- Publication number 20230189492
- Publication date Jun 15, 2023
- NXP B.V.
- Philipp Franz Freidl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
- Publication number 20230061529
- Publication date Mar 2, 2023
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR
- Publication number 20230017646
- Publication date Jan 19, 2023
- NXP USA, Inc.
- Michael B. Vincent
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GROUNDING ASSEMBLY FOR A SEMICONDUCTOR DEVICE
- Publication number 20220384943
- Publication date Dec 1, 2022
- NXP B.V.
- Mustafa Acar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SINGLE DIE DESIGN FOR DIFFERENT POLARIZATIONS
- Publication number 20220311137
- Publication date Sep 29, 2022
- NXP B.V.
- Jan Willem Bergman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
UNIFORM MULTI-PACKAGE ANTENNA ARRAY
- Publication number 20220263222
- Publication date Aug 18, 2022
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and System for Regulating Plasma Dicing Rates
- Publication number 20210193524
- Publication date Jun 24, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- G01 - MEASURING TESTING
Information Patent Application
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
- Publication number 20210134647
- Publication date May 6, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS
- Publication number 20210134648
- Publication date May 6, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and Apparatus for Coupling a Waveguide Structure to an Integ...
- Publication number 20210075081
- Publication date Mar 11, 2021
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Saw Bow Break Point
- Publication number 20200402918
- Publication date Dec 24, 2020
- NXP B.V.
- Antonius Hendrikus Jozef Kamphuis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUSES AND METHODS FOR COUPLING A WAVEGUIDE STRUCTURE TO AN IN...
- Publication number 20200365535
- Publication date Nov 19, 2020
- NXP B.V.
- Antonius Johannes Matheus de Graauw
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL CONTROL MODULES FOR INTEGRATED CIRCUIT DEVICE PATTERNING AN...
- Publication number 20200348587
- Publication date Nov 5, 2020
- NXP USA, Inc.
- Leendertjan Mekking
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
MAGNETIC SHIELDING STRUCTURE FOR MRAM ARRAY
- Publication number 20200227624
- Publication date Jul 16, 2020
- NXP B.V.
- Franciscus Petrus WIDDERSHOVEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONFORMAL DUMMY DIE
- Publication number 20200066653
- Publication date Feb 27, 2020
- NXP B.V.
- Antonius Hendrikus Jozef KAMPHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE AND ANTENNA ARRAY DEVICE
- Publication number 20190304934
- Publication date Oct 3, 2019
- NXP B.V.
- Antonius Hendrikus Jozef KAMPHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-DIE ARRAY DEVICE
- Publication number 20190189606
- Publication date Jun 20, 2019
- NXP B.V.
- Antonius Hendrikus Jozef KAMPHUIS
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MAKING A PLURALITY OF PACKAGED SEMICONDUCTOR DEVICES
- Publication number 20180301353
- Publication date Oct 18, 2018
- NXP B.V.
- Jetse de Witte
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip transfer method and apparatus
- Publication number 20070137031
- Publication date Jun 21, 2007
- Johannes Wilhelmus Dorotheus Bosch
- H01 - BASIC ELECTRIC ELEMENTS

Antonius Hendrikus Jozef Kamphuis

Person

Patents Grantslast 30 patents

Technique for handling diced wafers of integrated circuits

Method and system for regulating plasma dicing rates

Technique for handling diced wafers of integrated circuits

Technique for handling diced wafers of integrated circuits

Apparatuses and methods for coupling a waveguide structure to an in...

Semiconductor device package comprising an encapsulated and conduct...

Magnetic shielding structure for MRAM array

Optical control modules for integrated circuit device patterning an...

Integrated circuit saw bow break point

Conformal dummy die

Multi-die and antenna array device

Method of making a plurality of packaged semiconductor devices

Multi-die array device

Patents Applicationslast 30 patents

ON-CHIP SHIELDED DEVICE

SEMICONDUCTOR DEVICE WITH THROUGH PACKAGE VIA AND METHOD THEREFOR

METHOD AND SYSTEM FOR REGULATING PLASMA DICING RATES

FLIP CHIP DEVICE THROUGH PACKAGE VIA PLACEMENT

RF COMPONENT AND METHOD

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

SEMICONDUCTOR DEVICE WITH SELF-ALIGNED WAVEGUIDE AND METHOD THEREFOR

GROUNDING ASSEMBLY FOR A SEMICONDUCTOR DEVICE

SINGLE DIE DESIGN FOR DIFFERENT POLARIZATIONS

UNIFORM MULTI-PACKAGE ANTENNA ARRAY

Method and System for Regulating Plasma Dicing Rates

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

TECHNIQUE FOR HANDLING DICED WAFERS OF INTEGRATED CIRCUITS

Method and Apparatus for Coupling a Waveguide Structure to an Integ...

Integrated Circuit Saw Bow Break Point

APPARATUSES AND METHODS FOR COUPLING A WAVEGUIDE STRUCTURE TO AN IN...

OPTICAL CONTROL MODULES FOR INTEGRATED CIRCUIT DEVICE PATTERNING AN...

MAGNETIC SHIELDING STRUCTURE FOR MRAM ARRAY

CONFORMAL DUMMY DIE

MULTI-DIE AND ANTENNA ARRAY DEVICE

MULTI-DIE ARRAY DEVICE

METHOD OF MAKING A PLURALITY OF PACKAGED SEMICONDUCTOR DEVICES

Chip transfer method and apparatus