ARCHANA VENUGOPAL

Person

DALLAS, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Filler particles for polymers
- Patent number 12,139,569
- Issue date Nov 12, 2024
- Texas Instruments Incorporated
- Nazila Dadvand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermal routing trench by additive processing
- Patent number 11,996,343
- Issue date May 28, 2024
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High voltage avalanche diode for active clamp drivers
- Patent number 11,984,475
- Issue date May 14, 2024
- Texas Instruments Incorporated
- Henry Litzmann Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermally conductive wafer layer
- Patent number 11,854,933
- Issue date Dec 26, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High thermal conductivity vias by additive processing
- Patent number 11,676,880
- Issue date Jun 13, 2023
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layered SP2-bonded carbon tubes
- Patent number 11,390,527
- Issue date Jul 19, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Hexagonal boron nitride structures
- Patent number 11,370,662
- Issue date Jun 28, 2022
- Texas Instruments Incorporated
- Luigi Colombo
- C01 - INORGANIC CHEMISTRY
Information Patent Grant
Nanoparticle matrix for backside heat spreading
- Patent number 11,355,414
- Issue date Jun 7, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-super lattice for switchable arrays
- Patent number 11,309,388
- Issue date Apr 19, 2022
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of graphene and boron nitride hetero-structure device o...
- Patent number 11,296,237
- Issue date Apr 5, 2022
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Filler particles for polymers
- Patent number 11,254,775
- Issue date Feb 22, 2022
- Texas Instruments Incorporated
- Nazila Dadvand
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Lattice bump interconnect
- Patent number 11,145,598
- Issue date Oct 12, 2021
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of graphene and boron nitride hetero-structure device
- Patent number 11,081,593
- Issue date Aug 3, 2021
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-graphene structures forming a lattice of interconnected segments
- Patent number 11,063,120
- Issue date Jul 13, 2021
- Texas Instruments Incorporated
- Luigi Colombo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package thermal conduit
- Patent number 11,004,680
- Issue date May 11, 2021
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene FET with graphitic interface layer at contacts
- Patent number 10,923,567
- Issue date Feb 16, 2021
- Texas Instruments Incorporated
- Luigi Colombo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal routing trench by additive processing
- Patent number 10,861,763
- Issue date Dec 8, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit nanoparticle thermal routing structure in interc...
- Patent number 10,811,334
- Issue date Oct 20, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dissimilar material interface having lattices
- Patent number 10,804,201
- Issue date Oct 13, 2020
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect via with grown graphitic material
- Patent number 10,790,228
- Issue date Sep 29, 2020
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-super lattice for switchable arrays
- Patent number 10,748,999
- Issue date Aug 18, 2020
- Texas Instruments Incorporated
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to enable higher current density in integrated circuit re...
- Patent number 10,741,473
- Issue date Aug 11, 2020
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene FET with graphitic interface layer at contacts
- Patent number 10,593,763
- Issue date Mar 17, 2020
- Texas Instruments Incorporated
- Luigi Colombo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit nanoparticle thermal routing structure over inte...
- Patent number 10,529,641
- Issue date Jan 7, 2020
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of graphene and boron nitride hetero-structure device
- Patent number 10,490,673
- Issue date Nov 26, 2019
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure to enable higher current density in integrated circuit re...
- Patent number 10,475,725
- Issue date Nov 12, 2019
- Texas Instruments Incorporated
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of heat spreader for beol thermal management
- Patent number 10,468,324
- Issue date Nov 5, 2019
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integration of graphene and boron nitride hetero-structure device o...
- Patent number 10,304,967
- Issue date May 28, 2019
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect via with grown graphitic material
- Patent number 10,256,188
- Issue date Apr 9, 2019
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Graphene heterolayers for electronic applications
- Patent number 10,181,521
- Issue date Jan 15, 2019
- Texas Instruments Incorporated
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMOELECTRIC COOLING FOR PACKAGE LEVEL THERMAL MANAGEMENT
- Publication number 20240363484
- Publication date Oct 31, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER
- Publication number 20240321677
- Publication date Sep 26, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Jingjing Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20240312862
- Publication date Sep 19, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE AVALANCHE DIODE FOR ACTIVE CLAMP DRIVERS
- Publication number 20240282812
- Publication date Aug 22, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Henry Litzmann Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMALLY CONDUCTIVE WAFER LAYER
- Publication number 20240153841
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERLEAVED HIGH SIDE AND LOW SIDE POWER TRANSISTORS WITH VARIABLE...
- Publication number 20240153938
- Publication date May 9, 2024
- TEXAS INSTRUMENTS INCORPORATED
- Neil Gibson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DEEP TRENCH BYPASS CAPACITOR FOR ELECTROMAGNETIC INTERFERENCE NOISE...
- Publication number 20230411302
- Publication date Dec 21, 2023
- TEXAS INSTRUMENTS INCORPORATED
- James Todd
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL TEST CHIP WITH STACKABLE METAL BASED HEATER AND SENSOR
- Publication number 20230378023
- Publication date Nov 23, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Vinod Rai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING
- Publication number 20230307312
- Publication date Sep 28, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
GAS SENSOR WITH SUPERLATTICE STRUCTURE
- Publication number 20230243770
- Publication date Aug 3, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Archana VENUGOPAL
- B33 - ADDITIVE MANUFACTURING TECHNOLOGY
Information Patent Application
EMBEDDED THERMOELECTRIC COOLER USING THERMALLY ANISOTROPIC MESAS FO...
- Publication number 20230200238
- Publication date Jun 22, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH VOLTAGE AVALANCHE DIODE FOR ACTIVE CLAMP DRIVERS
- Publication number 20230170384
- Publication date Jun 1, 2023
- TEXAS INSTRUMENTS INCORPORATED
- Henry Litzmann Edwards
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEXAGONAL BORON NITRIDE STRUCTURES
- Publication number 20220250909
- Publication date Aug 11, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Luigi COLOMBO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
THERMALLY CONDUCTIVE WAFER LAYER
- Publication number 20220208640
- Publication date Jun 30, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILLER PARTICLES FOR POLYMERS
- Publication number 20220169773
- Publication date Jun 2, 2022
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT
- Publication number 20210272804
- Publication date Sep 2, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING
- Publication number 20210118762
- Publication date Apr 22, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADING
- Publication number 20210098331
- Publication date Apr 1, 2021
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen Cook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SUPER LATTICE FOR SWITCHABLE ARRAYS
- Publication number 20200381517
- Publication date Dec 3, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen COOK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LOW CONTACT RESISTANCE GRAPHENE DEVICE INTEGRATION
- Publication number 20200211849
- Publication date Jul 2, 2020
- TEXAS INSTRUMENTS INCORPORATED
- LUIGI COLOMBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-SUPER LATTICE FOR SWITCHABLE ARRAYS
- Publication number 20200203483
- Publication date Jun 25, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Benjamin Stassen COOK
- C01 - INORGANIC CHEMISTRY
Information Patent Application
GRAPHENE FET WITH GRAPHITIC INTERFACE LAYER AT CONTACTS
- Publication number 20200185498
- Publication date Jun 11, 2020
- TEXAS INSTRUMENTS INCORPORATED
- LUIGI COLOMBO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF GRAPHENE AND BORON NITRIDE HETERO-STRUCTURE DEVICE
- Publication number 20200075779
- Publication date Mar 5, 2020
- TEXAS INSTRUMENTS INCORPORATED
- ARCHANA VENUGOPAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRUCTURE TO ENABLE HIGHER CURRENT DENSITY IN INTEGRATED CIRCUIT RE...
- Publication number 20200051893
- Publication date Feb 13, 2020
- TEXAS INSTRUMENTS INCORPORATED
- Dhishan Kande
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integration of graphene and boron nitrite hetero-structure device o...
- Publication number 20190288122
- Publication date Sep 19, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATION OF GRAPHENE AND BORON NITRIDE HETERO-STRUCTURE DEVICE
- Publication number 20190273166
- Publication date Sep 5, 2019
- TEXAS INSTRUMENTS INCORPORATED
- ARCHANA VENUGOPAL
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT VIA WITH GROWN GRAPHITIC MATERIAL
- Publication number 20190229051
- Publication date Jul 25, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Archana Venugopal
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL-GRAPHENE STRUCTURES
- Publication number 20190207002
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Luigi COLOMBO
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
DISSIMILAR MATERIAL INTERFACE HAVING LATTICES
- Publication number 20190206793
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Archana VENUGOPAL
- C01 - INORGANIC CHEMISTRY
Information Patent Application
FILLER PARTICLES FOR POLYMERS
- Publication number 20190202958
- Publication date Jul 4, 2019
- TEXAS INSTRUMENTS INCORPORATED
- Nazila DADVAND
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

ARCHANA VENUGOPAL

Person

Patents Grantslast 30 patents

Filler particles for polymers

Thermal routing trench by additive processing

High voltage avalanche diode for active clamp drivers

Thermally conductive wafer layer

High thermal conductivity vias by additive processing

Multi-layered SP2-bonded carbon tubes

Hexagonal boron nitride structures

Nanoparticle matrix for backside heat spreading

Multi-super lattice for switchable arrays

Integration of graphene and boron nitride hetero-structure device o...

Filler particles for polymers

Lattice bump interconnect

Integration of graphene and boron nitride hetero-structure device

Metal-graphene structures forming a lattice of interconnected segments

Semiconductor device package thermal conduit

Graphene FET with graphitic interface layer at contacts

Thermal routing trench by additive processing

Integrated circuit nanoparticle thermal routing structure in interc...

Dissimilar material interface having lattices

Interconnect via with grown graphitic material

Multi-super lattice for switchable arrays

Structure to enable higher current density in integrated circuit re...

Graphene FET with graphitic interface layer at contacts

Integrated circuit nanoparticle thermal routing structure over inte...

Integration of graphene and boron nitride hetero-structure device

Structure to enable higher current density in integrated circuit re...

Integration of heat spreader for beol thermal management

Integration of graphene and boron nitride hetero-structure device o...

Interconnect via with grown graphitic material

Graphene heterolayers for electronic applications

Patents Applicationslast 30 patents

THERMOELECTRIC COOLING FOR PACKAGE LEVEL THERMAL MANAGEMENT

SEMICONDUCTOR DEVICES WITH THERMOELECTRIC COOLER

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING

HIGH VOLTAGE AVALANCHE DIODE FOR ACTIVE CLAMP DRIVERS

THERMALLY CONDUCTIVE WAFER LAYER

INTERLEAVED HIGH SIDE AND LOW SIDE POWER TRANSISTORS WITH VARIABLE...

DEEP TRENCH BYPASS CAPACITOR FOR ELECTROMAGNETIC INTERFERENCE NOISE...

THERMAL TEST CHIP WITH STACKABLE METAL BASED HEATER AND SENSOR

HIGH THERMAL CONDUCTIVITY VIAS BY ADDITIVE PROCESSING

GAS SENSOR WITH SUPERLATTICE STRUCTURE

EMBEDDED THERMOELECTRIC COOLER USING THERMALLY ANISOTROPIC MESAS FO...

HIGH VOLTAGE AVALANCHE DIODE FOR ACTIVE CLAMP DRIVERS

HEXAGONAL BORON NITRIDE STRUCTURES

THERMALLY CONDUCTIVE WAFER LAYER

FILLER PARTICLES FOR POLYMERS

SEMICONDCTOR DEVICE PACKAGE THERMAL CONDUIT

THERMAL ROUTING TRENCH BY ADDITIVE PROCESSING

NANOPARTICLE MATRIX FOR BACKSIDE HEAT SPREADING

MULTI-SUPER LATTICE FOR SWITCHABLE ARRAYS

LOW CONTACT RESISTANCE GRAPHENE DEVICE INTEGRATION

MULTI-SUPER LATTICE FOR SWITCHABLE ARRAYS

GRAPHENE FET WITH GRAPHITIC INTERFACE LAYER AT CONTACTS

INTEGRATION OF GRAPHENE AND BORON NITRIDE HETERO-STRUCTURE DEVICE

STRUCTURE TO ENABLE HIGHER CURRENT DENSITY IN INTEGRATED CIRCUIT RE...

Integration of graphene and boron nitrite hetero-structure device o...

INTEGRATION OF GRAPHENE AND BORON NITRIDE HETERO-STRUCTURE DEVICE

INTERCONNECT VIA WITH GROWN GRAPHITIC MATERIAL

METAL-GRAPHENE STRUCTURES

DISSIMILAR MATERIAL INTERFACE HAVING LATTICES

FILLER PARTICLES FOR POLYMERS