Armin Tilke

Person

Beacon, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Silicon-on-insulator chip having multiple crystal orientations
- Patent number 10,217,812
- Issue date Feb 26, 2019
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating isolation regions of semiconductor devices a...
- Patent number 8,936,995
- Issue date Jan 20, 2015
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mixed orientation semiconductor device and method
- Patent number 8,530,355
- Issue date Sep 10, 2013
- Infineon Technologies AG
- Jiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating isolation regions of semiconductor devices a...
- Patent number 8,501,632
- Issue date Aug 6, 2013
- Infineon Technologies AG
- Chris Stapelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon-on-insulator chip having multiple crystal orientations
- Patent number 8,319,285
- Issue date Nov 27, 2012
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation structures and methods of formation thereof
- Patent number 8,258,028
- Issue date Sep 4, 2012
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of operating embedded flash memory devices
- Patent number 8,031,532
- Issue date Oct 4, 2011
- Infineon Technologies AG
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device formed in a recrystallized layer
- Patent number 7,858,964
- Issue date Dec 28, 2010
- Infineon Technologies AG
- Roman Knoefler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded flash memory devices on SOI substrates and methods of manu...
- Patent number 7,687,347
- Issue date Mar 30, 2010
- Infineon Technologies AG
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Deep trench isolation structures and methods of formation thereof
- Patent number 7,679,130
- Issue date Mar 16, 2010
- Infineon Technologies AG
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded flash memory devices on SOI substrates and methods of manu...
- Patent number 7,495,279
- Issue date Feb 24, 2009
- Infineon Technologies AG
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct channel stress
- Patent number 7,488,670
- Issue date Feb 10, 2009
- Infineon Technologies AG
- Roman Knoefler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single damascene with disposable stencil and method therefore
- Patent number 7,452,804
- Issue date Nov 18, 2008
- Infineon Technologies AG
- Michael Beck
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SILICON-ON-INSULATOR CHIP HAVING MULTIPLE CRYSTAL ORIENTATIONS
- Publication number 20130082350
- Publication date Apr 4, 2013
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep Trench Isolation Structures and Methods of Formation Thereof
- Publication number 20100203703
- Publication date Aug 12, 2010
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Operating Embedded Flash Memory Devices
- Publication number 20100149882
- Publication date Jun 17, 2010
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device formed in a Recrystallized Layer
- Publication number 20090146146
- Publication date Jun 11, 2009
- Roman Knoefler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded Flash Memory Devices on SOI Substrates and Methods of Manu...
- Publication number 20090135655
- Publication date May 28, 2009
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating isolation regions of semiconductor devices a...
- Publication number 20070205489
- Publication date Sep 6, 2007
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Mixed orientation semiconductor device and method
- Publication number 20070148921
- Publication date Jun 28, 2007
- Jiang Yan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon-on-insulator chip having multiple crystal orientations
- Publication number 20070145481
- Publication date Jun 28, 2007
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of fabricating isolation regions of semiconductor devices a...
- Publication number 20070141852
- Publication date Jun 21, 2007
- Chris Stapelmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Embedded flash memory devices on SOI substrates and methods of manu...
- Publication number 20070057307
- Publication date Mar 15, 2007
- Danny Pak-Chum Shum
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Isolation for semiconductor devices
- Publication number 20070059897
- Publication date Mar 15, 2007
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Single damascene with disposable stencil and method therefore
- Publication number 20070042588
- Publication date Feb 22, 2007
- Michael Beck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Direct channel stress
- Publication number 20070012960
- Publication date Jan 18, 2007
- Roman Knoefler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Deep trench isolation structures and methods of formation thereof
- Publication number 20060267134
- Publication date Nov 30, 2006
- Armin Tilke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for fabricating a sublithographic contact structure in a mem...
- Publication number 20060189045
- Publication date Aug 24, 2006
- Danny Pak-Chum Shum
- G11 - INFORMATION STORAGE

Armin Tilke

Person

Patents Grantslast 30 patents

Silicon-on-insulator chip having multiple crystal orientations

Methods of fabricating isolation regions of semiconductor devices a...

Mixed orientation semiconductor device and method

Methods of fabricating isolation regions of semiconductor devices a...

Silicon-on-insulator chip having multiple crystal orientations

Deep trench isolation structures and methods of formation thereof

Methods of operating embedded flash memory devices

Semiconductor device formed in a recrystallized layer

Embedded flash memory devices on SOI substrates and methods of manu...

Deep trench isolation structures and methods of formation thereof

Embedded flash memory devices on SOI substrates and methods of manu...

Direct channel stress

Single damascene with disposable stencil and method therefore

Patents Applicationslast 30 patents

SILICON-ON-INSULATOR CHIP HAVING MULTIPLE CRYSTAL ORIENTATIONS

Deep Trench Isolation Structures and Methods of Formation Thereof

Methods of Operating Embedded Flash Memory Devices

Semiconductor Device formed in a Recrystallized Layer

Embedded Flash Memory Devices on SOI Substrates and Methods of Manu...

Methods of fabricating isolation regions of semiconductor devices a...

Mixed orientation semiconductor device and method

Silicon-on-insulator chip having multiple crystal orientations

Methods of fabricating isolation regions of semiconductor devices a...

Embedded flash memory devices on SOI substrates and methods of manu...

Isolation for semiconductor devices

Single damascene with disposable stencil and method therefore

Direct channel stress

Deep trench isolation structures and methods of formation thereof

Method for fabricating a sublithographic contact structure in a mem...