Arnaud Castex

Person

Grenoble, FR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing a semiconductor-on-insulator substrate
- Patent number 12,230,533
- Issue date Feb 18, 2025
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 12,101,080
- Issue date Sep 24, 2024
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 11,637,542
- Issue date Apr 25, 2023
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator substrate for rf applications
- Patent number 11,626,319
- Issue date Apr 11, 2023
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 11,595,020
- Issue date Feb 28, 2023
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor-on-insulator substrate for RF applications
- Patent number 10,886,162
- Issue date Jan 5, 2021
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heterostructure and method of fabrication
- Patent number 10,826,459
- Issue date Nov 3, 2020
- Soitec
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for producing composite structure with metal/metal bonding
- Patent number 9,905,531
- Issue date Feb 27, 2018
- Soitec
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for assessing inhomogeneous deformations in multi...
- Patent number 9,733,075
- Issue date Aug 15, 2017
- Sony Semiconductors Solutions Corporation
- Marcel Broekaart
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Method for bonding by means of molecular adhesion
- Patent number 9,548,202
- Issue date Jan 17, 2017
- Soitec
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for bonding together two wafers by molecular a...
- Patent number 9,004,135
- Issue date Apr 14, 2015
- Soitec
- Arnaud Castex
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of fabricating a multilayer structure with circuit layer tra...
- Patent number 8,932,938
- Issue date Jan 13, 2015
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of bonding by molecular bonding
- Patent number 8,927,320
- Issue date Jan 6, 2015
- Soitec
- Chrystelle Lagahe Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonding method with reduction in overlay misalignment
- Patent number 8,575,002
- Issue date Nov 5, 2013
- Soitec
- Marcel Broekaart
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Surface treatment for molecular bonding
- Patent number 8,202,785
- Issue date Jun 19, 2012
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of initiating molecular bonding
- Patent number 8,163,570
- Issue date Apr 24, 2012
- Soitec
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20240396520
- Publication date Nov 28, 2024
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20230275559
- Publication date Aug 31, 2023
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR RF APPLICATIONS
- Publication number 20230238274
- Publication date Jul 27, 2023
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE
- Publication number 20220139768
- Publication date May 5, 2022
- SOITEC
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR SUBSTATE FOR RF APPLICATIONS
- Publication number 20210057269
- Publication date Feb 25, 2021
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20210058058
- Publication date Feb 25, 2021
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20200280298
- Publication date Sep 3, 2020
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR RF APPLICATIONS
- Publication number 20190115248
- Publication date Apr 18, 2019
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HETEROSTRUCTURE AND METHOD OF FABRICATION
- Publication number 20180159498
- Publication date Jun 7, 2018
- SOITEC
- Arnaud Castex
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD FOR BONDING BY MEANS OF MOLECULAR ADHESION
- Publication number 20150235851
- Publication date Aug 20, 2015
- SOITEC
- Marcel Broekaart
- B32 - LAYERED PRODUCTS
Information Patent Application
METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING
- Publication number 20150179603
- Publication date Jun 25, 2015
- SOITEC
- Ionut Radu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD AND APPARATUS FOR BONDING TOGETHER TWO WAFERS BY MOLECULAR A...
- Publication number 20130105061
- Publication date May 2, 2013
- Arnaud Castex
- B32 - LAYERED PRODUCTS
Information Patent Application
THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAY...
- Publication number 20130093033
- Publication date Apr 18, 2013
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR ASSESSING INHOMOGENEOUS DEFORMATIONS IN MULTI...
- Publication number 20130054154
- Publication date Feb 28, 2013
- SOITEC
- Marcel Broekaart
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR BONDING TWO SUBSTRATES
- Publication number 20120322229
- Publication date Dec 20, 2012
- SOITEC
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF BONDING BY MOLECULAR BONDING
- Publication number 20120164778
- Publication date Jun 28, 2012
- SOITEC
- Chrystelle Lagahe Blanchard
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT BONDING METHOD WITH REDUCTION IN OVERLAY MISALIGNMENT
- Publication number 20120077329
- Publication date Mar 29, 2012
- Marcel Broekaart
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A MULTILAYER STRUCTURE WITH CIRCUIT LAYER TRA...
- Publication number 20120028440
- Publication date Feb 2, 2012
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES COMPRISING DIRECT BONDI...
- Publication number 20110287604
- Publication date Nov 24, 2011
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAY...
- Publication number 20110278691
- Publication date Nov 17, 2011
- S.O.I TEC SILICON ON INSULATOR TECHNOLOGIES
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SURFACE TREATMENT FOR MOLECULAR BONDING
- Publication number 20110189834
- Publication date Aug 4, 2011
- S.O.I. Tec Silicon on Insulator Technologies Parc Technologique dws Fontaines
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF INITIATING MOLECULAR BONDING
- Publication number 20110045611
- Publication date Feb 24, 2011
- S.O.I.TEC SILICON ON INSULATOR TECHNOLOGIES
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR BONDING TWO SUBSTRATES
- Publication number 20100155882
- Publication date Jun 24, 2010
- Arnaud Castex
- H01 - BASIC ELECTRIC ELEMENTS

Arnaud Castex

Person

Patents Grantslast 30 patents

Method for manufacturing a semiconductor-on-insulator substrate

Heterostructure and method of fabrication

Heterostructure and method of fabrication

Semiconductor-on-insulator substrate for rf applications

Heterostructure and method of fabrication

Semiconductor-on-insulator substrate for RF applications

Heterostructure and method of fabrication

Method for producing composite structure with metal/metal bonding

System and method for assessing inhomogeneous deformations in multi...

Method for bonding by means of molecular adhesion

Method and apparatus for bonding together two wafers by molecular a...

Method of fabricating a multilayer structure with circuit layer tra...

Method of bonding by molecular bonding

Direct bonding method with reduction in overlay misalignment

Surface treatment for molecular bonding

Method of initiating molecular bonding

Patents Applicationslast 30 patents

HETEROSTRUCTURE AND METHOD OF FABRICATION

HETEROSTRUCTURE AND METHOD OF FABRICATION

SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR RF APPLICATIONS

METHOD FOR MANUFACTURING A SEMICONDUCTOR-ON-INSULATOR SUBSTRATE

SEMICONDUCTOR-ON-INSULATOR SUBSTATE FOR RF APPLICATIONS

HETEROSTRUCTURE AND METHOD OF FABRICATION

HETEROSTRUCTURE AND METHOD OF FABRICATION

SEMICONDUCTOR-ON-INSULATOR SUBSTRATE FOR RF APPLICATIONS

HETEROSTRUCTURE AND METHOD OF FABRICATION

METHOD FOR BONDING BY MEANS OF MOLECULAR ADHESION

METHOD FOR PRODUCING COMPOSITE STRUCTURE WITH METAL/METAL BONDING

METHOD AND APPARATUS FOR BONDING TOGETHER TWO WAFERS BY MOLECULAR A...

THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAY...

SYSTEM AND METHOD FOR ASSESSING INHOMOGENEOUS DEFORMATIONS IN MULTI...

METHOD FOR BONDING TWO SUBSTRATES

METHOD OF BONDING BY MOLECULAR BONDING

DIRECT BONDING METHOD WITH REDUCTION IN OVERLAY MISALIGNMENT

METHOD OF FABRICATING A MULTILAYER STRUCTURE WITH CIRCUIT LAYER TRA...

METHODS OF FORMING SEMICONDUCTOR STRUCTURES COMPRISING DIRECT BONDI...

THREE DIMENSIONAL STRUCTURES HAVING IMPROVED ALIGNMENTS BETWEEN LAY...

SURFACE TREATMENT FOR MOLECULAR BONDING

METHOD OF INITIATING MOLECULAR BONDING

METHOD FOR BONDING TWO SUBSTRATES