Arthur Bross

Person

Poughkeepsie, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multilayer microelectronic wiring module and method for forming the...
- Patent number 5,517,751
- Issue date May 21, 1996
- International Business Machines Corporation
- Arthur Bross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High density electronic connector and method of assembly
- Patent number 5,410,807
- Issue date May 2, 1995
- International Business Machines Corporation
- Arthur Bross
- G01 - MEASURING TESTING
Information Patent Grant
Via and pad structure for thermoplastic substrates and method and a...
- Patent number 5,401,911
- Issue date Mar 28, 1995
- International Business Machines Corporation
- Herbert Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dynamic gating of polymers for isotropic properties
- Patent number 5,399,305
- Issue date Mar 21, 1995
- International Business Machines Corporation
- Arthur Bross
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method and product for extruding materials that exhibit anisotropic...
- Patent number 5,362,360
- Issue date Nov 8, 1994
- International Business Machines Corporation
- Arthur Bross
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High density electronic connector and method of assembly
- Patent number 5,338,208
- Issue date Aug 16, 1994
- International Business Machines Corporation
- Arthur Bross
- G01 - MEASURING TESTING
Information Patent Grant
Apparatus for extruding materials that exhibit anisotropic properti...
- Patent number 5,326,245
- Issue date Jul 5, 1994
- International Business Machines Corporation
- Arthur Bross
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Array of pinless connectors and a carrier therefor
- Patent number 5,324,205
- Issue date Jun 28, 1994
- International Business Machines Corporation
- Umar M. U. Ahmad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for extruding materials that exhibit anisotropic properti...
- Patent number 5,312,238
- Issue date May 17, 1994
- International Business Machines Corporation
- Arthur Bross
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Method of direct transferring of electrically conductive elements i...
- Patent number 5,305,523
- Issue date Apr 26, 1994
- International Business Machines Corporation
- Arthur Bross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Single step electrical/mechanical connection process for connecting...
- Patent number 5,303,862
- Issue date Apr 19, 1994
- International Business Machines Corporation
- Arthur Bross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a high density connector system
- Patent number 5,276,964
- Issue date Jan 11, 1994
- International Business Machines Corporation
- Herbert R. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a multilayer microelectronic wiring module
- Patent number 5,259,110
- Issue date Nov 9, 1993
- International Business Machines Corporation
- Arthur Bross
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming dual height solder interconnections
- Patent number 5,251,806
- Issue date Oct 12, 1993
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for dynamic gating of polymers for producing molded artic...
- Patent number 5,244,378
- Issue date Sep 14, 1993
- International Business Machines Corporation
- Arthur Bross
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
High density probe
- Patent number 5,225,777
- Issue date Jul 6, 1993
- International Business Machines Corporation
- Arthur Bross
- G01 - MEASURING TESTING
Information Patent Grant
High density connector system
- Patent number 5,205,738
- Issue date Apr 27, 1993
- International Business Machines Corporation
- Herbert R. Anderson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder mass having conductive encapsulating arrangement
- Patent number 5,130,779
- Issue date Jul 14, 1992
- International Business Machines Corporation
- Birendra N. Agarwala
- H01 - BASIC ELECTRIC ELEMENTS

Arthur Bross

Person

Patents Grantslast 30 patents

Multilayer microelectronic wiring module and method for forming the...

High density electronic connector and method of assembly

Via and pad structure for thermoplastic substrates and method and a...

Dynamic gating of polymers for isotropic properties

Method and product for extruding materials that exhibit anisotropic...

High density electronic connector and method of assembly

Apparatus for extruding materials that exhibit anisotropic properti...

Array of pinless connectors and a carrier therefor

Apparatus for extruding materials that exhibit anisotropic properti...

Method of direct transferring of electrically conductive elements i...

Single step electrical/mechanical connection process for connecting...

Method of manufacturing a high density connector system

Method for forming a multilayer microelectronic wiring module

Method of forming dual height solder interconnections

Apparatus for dynamic gating of polymers for producing molded artic...

High density probe

High density connector system

Solder mass having conductive encapsulating arrangement