Claims
- 1. A method for forming a multilayer microelectronic wiring module, comprising the steps of:
- forming a plurality of thermoplastic polymer sheets;
- inserting a plurality of metal pieces into each of said plurality of thermoplastic polymer sheets to form vias therein;
- forming a conductive wiring pattern on at least certain ones of said plurality of thermoplastic polymer sheets;
- stacking said plurality of thermoplastic polymer sheets with said vias in at least certain sheets aligned with vias in an adjacent sheet; and
- applying heat or pressure or both heat and pressure to said stacked thermoplastic polymersheets to bond said sheets to form a microelctronic wiring module.
- 2. A method for forming a multilayer microelectronic wiring module as in claim 1, wherein said thermoplastic polymer sheets comprise a thermoplastic liquid crystal polymer.
- 3. A method for forming a multilayer microelectronic wiring module as in claim 2, wherein said thermoplastic liquid crystal polymer in each sheet has a flow direction along an axis and the flow directions in two adjacent sheets are aligned along different axes.
- 4. A method for forming a multilayer microelectronic wiring module as in claim 1, wherein aligned vias are bonded together by compression bonding.
- 5. A method for forming a multilayer microelectronic wiring module as in claim 1, wherein said aligned vias are bonded together by reflow soldering.
- 6. A multilayer microelectronic wiring module comprising in combination:
- a plurality of thermoplastic polymer sheets having conductive vias embedded therein and comprising a thermoplastic liquid crystal polymer, said thermoplastic, liquid crystal polymer in each sheet having an irregular pattern of flow in a direction along an axis;
- at least certain ones of said plurality of thermoplastic polymer sheets having a wiring pattern formed on a surface thereof;
- said plurality of thermoplastic polymer sheets being bonded together by an application of heat or pressure or both heat and pressure to form a wiring module with certain of said conductive vias in one thermoplastic polymer sheet joined to certain of said conductive vias in an adjacent thermoplastic polymer sheet.
- 7. A multilayer electronic wiring module comprising in combination:
- plurality of molded thermoplastic polymer sheets having conductive vias molded in situ in each sheet and comprising a thermoplastic liquid crystal polymer, said thermoplastic liquid crystal polymer in each sheet having an irregular pattern of flow in a direction along an axis;
- at least some of said plurality of thermoplastic polymer sheets having a wiring pattern formed on a surface thereof;
- said plurality of thermoplastic polymer sheets being bonded together by an application of heat or pressure or both heat and pressure to form a wiring module with certain of said conductive vias in one sheet joined to certain of said conductive vias in an adjacent sheet.
Parent Case Info
This application is a divisional of co-pending application Ser. No. 07/863,627, filed on Apr. 3, 1992, now issued as U.S. Pat. No. 5,259,110.
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4802061 |
Portugall et al. |
Jan 1989 |
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4963428 |
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Divisions (1)
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Number |
Date |
Country |
Parent |
863627 |
Apr 1992 |
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