Arthur M. Wilson

Person

Dallas, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Bonding pads for integrated circuits having copper interconnect met...
- Patent number 6,329,722
- Issue date Dec 11, 2001
- Texas Instruments Incorporated
- Wei-Yan Shih
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective slurries for the formation of conductive structures
- Patent number 6,251,789
- Issue date Jun 26, 2001
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a lift-off layer having controlled adhesion strength
- Patent number 5,944,975
- Issue date Aug 31, 1999
- Texas Instruments Incorporated
- Arthur M. Wilson
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Column-to-column isolation in fed display
- Patent number 5,672,933
- Issue date Sep 30, 1997
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solder bump transfer for microelectronics packaging and assembly
- Patent number 5,646,068
- Issue date Jul 8, 1997
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clustered field emission microtips adjacent stripe conductors
- Patent number 5,556,316
- Issue date Sep 17, 1996
- Texas Instruments Incorporated
- Robert H. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Field emission microtip clusters adjacent stripe conductors
- Patent number 5,557,159
- Issue date Sep 17, 1996
- Texas Instruments Incorporated
- Robert H. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clustered field emission microtips adjacent stripe conductors
- Patent number 5,536,993
- Issue date Jul 16, 1996
- Texas Instruments Incorporated
- Robert H. Taylor
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three dimensional assembly of integrated circuit chips
- Patent number 5,327,327
- Issue date Jul 5, 1994
- Texas Instruments Incorporated
- Dean L. Frew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabrication of probe card for testing of semiconductor d...
- Patent number 5,225,037
- Issue date Jul 6, 1993
- Texas Instruments Incorporated
- Richard A. Elder
- G01 - MEASURING TESTING
Information Patent Grant
Non-destructive burn-in test socket for integrated circuit die
- Patent number 5,123,850
- Issue date Jun 23, 1992
- Texas Instruments Incorporated
- Richard A. Elder
- G01 - MEASURING TESTING
Information Patent Grant
Integrated circuit product having a polyimide film interconnection...
- Patent number 4,890,157
- Issue date Dec 26, 1989
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing an integrated circuit product having a polyimi...
- Patent number 4,709,468
- Issue date Dec 1, 1987
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for etching sloped vias in polyimide insulators
- Patent number 4,369,090
- Issue date Jan 18, 1983
- Texas Instruments Incorporated
- Arthur M. Wilson
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maximum density interconnections for large scale integrated circuits
- Patent number 4,242,698
- Issue date Dec 30, 1980
- Texas Instruments Incorporated
- Prabhakar B. Ghate
- H01 - BASIC ELECTRIC ELEMENTS

Arthur M. Wilson

Person

Patents Grantslast 30 patents

Bonding pads for integrated circuits having copper interconnect met...

Selective slurries for the formation of conductive structures

Method of forming a lift-off layer having controlled adhesion strength

Column-to-column isolation in fed display

Solder bump transfer for microelectronics packaging and assembly

Clustered field emission microtips adjacent stripe conductors

Field emission microtip clusters adjacent stripe conductors

Clustered field emission microtips adjacent stripe conductors

Three dimensional assembly of integrated circuit chips

Method for fabrication of probe card for testing of semiconductor d...

Non-destructive burn-in test socket for integrated circuit die

Integrated circuit product having a polyimide film interconnection...

Method for producing an integrated circuit product having a polyimi...

Process for etching sloped vias in polyimide insulators

Maximum density interconnections for large scale integrated circuits