Arthur Unrau

Person

Geseke, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Arrangement for forming a connection
- Patent number 12,272,669
- Issue date Apr 8, 2025
- Infineon Technologies AG
- Arthur Unrau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device having a soldered joint with one or more inter...
- Patent number 12,166,005
- Issue date Dec 10, 2024
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Housing, semiconductor module and methods for producing the same
- Patent number 12,148,718
- Issue date Nov 19, 2024
- Infineon Technologies AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a module with solder body having elevated edge
- Patent number 11,942,335
- Issue date Mar 26, 2024
- Infineon Technologies AG
- Achim Muecke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Baseplate for a semiconductor module and method for producing a bas...
- Patent number 11,935,811
- Issue date Mar 19, 2024
- Infineon Technologies AG
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch soldering of different elements in power module
- Patent number 11,798,924
- Issue date Oct 24, 2023
- Infineon Technologies AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power semiconductor device and method for fabricating a power semic...
- Patent number 11,652,028
- Issue date May 16, 2023
- Infineon Technologies AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Preform diffusion soldering
- Patent number 11,605,608
- Issue date Mar 14, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing a module with solder body having elevated edge
- Patent number 11,538,694
- Issue date Dec 27, 2022
- Infineon Technologies AG
- Achim Muecke
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Batch diffusion soldering and electronic devices produced by batch...
- Patent number 11,158,602
- Issue date Oct 26, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR FORMING A LID OF A HOUSING
- Publication number 20240429181
- Publication date Dec 26, 2024
- INFINEON TECHNOLOGIES AG
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20240047439
- Publication date Feb 8, 2024
- INFINEON TECHNOLOGIES AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...
- Publication number 20230369175
- Publication date Nov 16, 2023
- INFINEON TECHNOLOGIES AG
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Terminal Element or Bus Bar, and Power Semiconductor Module Arrange...
- Publication number 20230170286
- Publication date Jun 1, 2023
- INFINEON TECHNOLOGIES AG
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...
- Publication number 20230130092
- Publication date Apr 27, 2023
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE
- Publication number 20230080004
- Publication date Mar 16, 2023
- INFINEON TECHNOLOGIES AG
- Achim MUECKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME
- Publication number 20220310536
- Publication date Sep 29, 2022
- Johannes Uhlig
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ARRANGEMENT FOR FORMING A CONNECTION
- Publication number 20220238478
- Publication date Jul 28, 2022
- Arthur Unrau
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASEPLATE FOR A SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A BAS...
- Publication number 20220051964
- Publication date Feb 17, 2022
- Arthur Unrau
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Soldering of Different Elements in Power Module
- Publication number 20210391310
- Publication date Dec 16, 2021
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...
- Publication number 20210375824
- Publication date Dec 2, 2021
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A POWER SEMIC...
- Publication number 20210242111
- Publication date Aug 5, 2021
- INFINEON TECHNOLOGIES AG
- Andre Wedi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE
- Publication number 20210166952
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Achim MUECKE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Preform Diffusion Soldering
- Publication number 20210143120
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Batch Diffusion Soldering and Electronic Devices Produced by Batch...
- Publication number 20210143123
- Publication date May 13, 2021
- Infineon Technologies Austria AG
- Kirill Trunov
- H01 - BASIC ELECTRIC ELEMENTS

Arthur Unrau

Person

Patents Grantslast 30 patents

Arrangement for forming a connection

Semiconductor device having a soldered joint with one or more inter...

Housing, semiconductor module and methods for producing the same

Manufacturing a module with solder body having elevated edge

Baseplate for a semiconductor module and method for producing a bas...

Batch soldering of different elements in power module

Power semiconductor device and method for fabricating a power semic...

Preform diffusion soldering

Manufacturing a module with solder body having elevated edge

Batch diffusion soldering and electronic devices produced by batch...

Patents Applicationslast 30 patents

METHOD FOR FORMING A LID OF A HOUSING

Batch Soldering of Different Elements in Power Module

POWER SEMICONDUCTOR MODULE ARRANGEMENT AND METHOD FOR PRODUCING THE...

Terminal Element or Bus Bar, and Power Semiconductor Module Arrange...

SEMICONDUCTOR DEVICE HAVING A SOLDERED JOINT WITH ONE OR MORE INTER...

MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE

HOUSING, SEMICONDUCTOR MODULE AND METHODS FOR PRODUCING THE SAME

ARRANGEMENT FOR FORMING A CONNECTION

BASEPLATE FOR A SEMICONDUCTOR MODULE AND METHOD FOR PRODUCING A BAS...

Batch Soldering of Different Elements in Power Module

ELECTRONIC DEVICE HAVING A SOLDERED JOINT BETWEEN A METAL REGION OF...

POWER SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING A POWER SEMIC...

MANUFACTURING A MODULE WITH SOLDER BODY HAVING ELEVATED EDGE

Preform Diffusion Soldering

Batch Diffusion Soldering and Electronic Devices Produced by Batch...