Arthur Woodworth

Person

Caterham on The Hill, GB

People

Patents Grantslast 30 patents

Information Patent Grant
High current capacity semiconductor device package and lead frame w...
- Patent number 6,667,547
- Issue date Dec 23, 2003
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High current capacity semiconductor device package and lead frame w...
- Patent number 6,476,481
- Issue date Nov 5, 2002
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor package
- Patent number 6,204,554
- Issue date Mar 20, 2001
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plural semiconductor die housed in common package with split heat sink
- Patent number 5,977,630
- Issue date Nov 2, 1999
- International Rectifier Corp.
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor package
- Patent number 5,905,304
- Issue date May 18, 1999
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame with waffled front and rear surfaces
- Patent number 5,902,959
- Issue date May 11, 1999
- International Rectifier Corporation
- Peter R. Ewer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-mount semiconductor package
- Patent number 5,763,949
- Issue date Jun 9, 1998
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface mount semiconductor package
- Patent number 5,760,472
- Issue date Jun 2, 1998
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
High current capacity semiconductor device package and lead frame w...
- Publication number 20030011051
- Publication date Jan 16, 2003
- International Rectifier Corporation
- Arthur Woodworth
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH CURRENT CAPACITY SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME W...
- Publication number 20010054752
- Publication date Dec 27, 2001
- ARTHUR WOODWORTH
- H01 - BASIC ELECTRIC ELEMENTS

Arthur Woodworth

Person

Patents Grantslast 30 patents

High current capacity semiconductor device package and lead frame w...

High current capacity semiconductor device package and lead frame w...

Surface mount semiconductor package

Plural semiconductor die housed in common package with split heat sink

Surface mount semiconductor package

Lead frame with waffled front and rear surfaces

Surface-mount semiconductor package

Surface mount semiconductor package

Patents Applicationslast 30 patents

High current capacity semiconductor device package and lead frame w...

HIGH CURRENT CAPACITY SEMICONDUCTOR DEVICE PACKAGE AND LEAD FRAME W...