Arun Virupaksha Gowda

Person

Niskayuna, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device package and method of forming
- Patent number 12,034,033
- Issue date Jul 9, 2024
- GE Aviation Systems LLC
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 11,605,609
- Issue date Mar 14, 2023
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay module and method of assembling
- Patent number 11,551,993
- Issue date Jan 10, 2023
- GE Aviation Systems LLC
- David Richard Esler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 11,177,204
- Issue date Nov 16, 2021
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,770,444
- Issue date Sep 8, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,700,035
- Issue date Jun 30, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect devices for electronic packaging assemblies
- Patent number RE48015
- Issue date May 26, 2020
- General Electric Company
- Gamal Refai-Ahmed
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,607,929
- Issue date Mar 31, 2020
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 10,607,957
- Issue date Mar 31, 2020
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 10,553,556
- Issue date Feb 4, 2020
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power electronics package and method of manufacturing thereof
- Patent number 10,453,786
- Issue date Oct 22, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stacked electronics package and method of manufacturing thereof
- Patent number 10,312,194
- Issue date Jun 4, 2019
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,269,688
- Issue date Apr 23, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and reconstituted semiconductor wafer havin...
- Patent number 10,204,881
- Issue date Feb 12, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 10,186,477
- Issue date Jan 22, 2019
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a self-aligning interconnect assembly an...
- Patent number 10,163,773
- Issue date Dec 25, 2018
- General Electric Company
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded electronics package
- Patent number 10,141,203
- Issue date Nov 27, 2018
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic packages with pre-defined via patterns and methods of ma...
- Patent number 10,141,251
- Issue date Nov 27, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional stacked integrated circuit devices and methods of...
- Patent number 10,068,879
- Issue date Sep 4, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Overlay circuit structure for interconnecting light emitting semico...
- Patent number 10,070,531
- Issue date Sep 4, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 9,966,371
- Issue date May 8, 2018
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package having a multi-thickness conductor layer and me...
- Patent number 9,966,361
- Issue date May 8, 2018
- General Electric Company
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with embedded through-connect structure and met...
- Patent number 9,953,913
- Issue date Apr 24, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronics package with embedded through-connect and resistor stru...
- Patent number 9,953,917
- Issue date Apr 24, 2018
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded electronics package
- Patent number 9,847,236
- Issue date Dec 19, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ultra-thin embedded semiconductor device package and method of manu...
- Patent number 9,806,051
- Issue date Oct 31, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure and method of making same
- Patent number 9,704,788
- Issue date Jul 11, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical interconnect structure for an embedded semiconductor dev...
- Patent number 9,653,438
- Issue date May 16, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power overlay structure having wirebonds and method of manufacturin...
- Patent number 9,613,843
- Issue date Apr 4, 2017
- General Electric Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package and method of making same
- Patent number 9,613,932
- Issue date Apr 4, 2017
- General Electric Company
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
POWER OVERLAY PACKAGE FOR A SEMICONDUCTOR DEVICE
- Publication number 20240266270
- Publication date Aug 8, 2024
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC CONNECTION ASSEMBLY
- Publication number 20230420901
- Publication date Dec 28, 2023
- GE AVIATION SYSTEMS LLC
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FORMING
- Publication number 20230238423
- Publication date Jul 27, 2023
- GE AVIATION SYSTEMS LLC
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY MODULE WITH THERMAL STORAGE
- Publication number 20230238301
- Publication date Jul 27, 2023
- GE AVIATION SYSTEMS LLC
- Rinaldo Luigi Miorini
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY MODULE AND METHOD OF ASSEMBLING
- Publication number 20220070996
- Publication date Mar 3, 2022
- GE AVIATION SYSTEMS LLC
- David Richard Esler
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20200185349
- Publication date Jun 11, 2020
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20190311981
- Publication date Oct 10, 2019
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A SELF-ALIGNING INTERCONNECT ASSEMBLY AN...
- Publication number 20190148279
- Publication date May 16, 2019
- GENERAL ELECTRIC COMPANY
- Christopher James Kapusta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180247924
- Publication date Aug 30, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180240779
- Publication date Aug 23, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130747
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130783
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130732
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20180130762
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130770
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...
- Publication number 20180130731
- Publication date May 10, 2018
- GENERAL ELECTRIC COMPANY
- Risto Ilkka Tuominen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE
- Publication number 20180082857
- Publication date Mar 22, 2018
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT DEVICES AND METHODS OF ASSEMBLING THE SAME
- Publication number 20180082981
- Publication date Mar 22, 2018
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...
- Publication number 20180033762
- Publication date Feb 1, 2018
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DIE BACKSIDE DEVICES AND METHODS OF FABRICATION THEREOF
- Publication number 20170373011
- Publication date Dec 28, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20170263539
- Publication date Sep 14, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE
- Publication number 20170250093
- Publication date Aug 31, 2017
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF
- Publication number 20170207160
- Publication date Jul 20, 2017
- General Electronic Company
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...
- Publication number 20170200692
- Publication date Jul 13, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME
- Publication number 20170077014
- Publication date Mar 16, 2017
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MA...
- Publication number 20160183376
- Publication date Jun 23, 2016
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...
- Publication number 20160104666
- Publication date Apr 14, 2016
- GENERAL ELECTRIC COMPANY
- Arun Virupaksha Gowda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...
- Publication number 20160056136
- Publication date Feb 25, 2016
- GENERAL ELECTRIC COMPANY
- Paul Alan McConnelee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...
- Publication number 20150380356
- Publication date Dec 31, 2015
- GENERAL ELECTRIC COMPANY
- Shakti Singh Chauhan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT DEVICES FOR ELECTRONIC PACKAGING ASSEMBLIES
- Publication number 20150348952
- Publication date Dec 3, 2015
- GENERAL ELECTRIC COMPANY
- Gamal Refai-Ahmed
- H01 - BASIC ELECTRIC ELEMENTS

Arun Virupaksha Gowda

Person

Patents Grantslast 30 patents

Semiconductor device package and method of forming

Ultra-thin embedded semiconductor device package and method of manu...

Power overlay module and method of assembling

Power electronics package and method of manufacturing thereof

Electronics package having a multi-thickness conductor layer and me...

Stacked electronics package and method of manufacturing thereof

Interconnect devices for electronic packaging assemblies

Electronics package having a self-aligning interconnect assembly an...

Ultra-thin embedded semiconductor device package and method of manu...

Electronics package having a multi-thickness conductor layer and me...

Power electronics package and method of manufacturing thereof

Stacked electronics package and method of manufacturing thereof

Power overlay structure and method of making same

Power overlay structure and reconstituted semiconductor wafer havin...

Power overlay structure and method of making same

Electronics package having a self-aligning interconnect assembly an...

Electrical interconnect structure for an embedded electronics package

Electronic packages with pre-defined via patterns and methods of ma...

Three-dimensional stacked integrated circuit devices and methods of...

Overlay circuit structure for interconnecting light emitting semico...

Electronics package having a multi-thickness conductor layer and me...

Electronics package having a multi-thickness conductor layer and me...

Electronics package with embedded through-connect structure and met...

Electronics package with embedded through-connect and resistor stru...

Electrical interconnect structure for an embedded electronics package

Ultra-thin embedded semiconductor device package and method of manu...

Power overlay structure and method of making same

Electrical interconnect structure for an embedded semiconductor dev...

Power overlay structure having wirebonds and method of manufacturin...

Integrated circuit package and method of making same

Patents Applicationslast 30 patents

POWER OVERLAY PACKAGE FOR A SEMICONDUCTOR DEVICE

ELECTRONIC CONNECTION ASSEMBLY

SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF FORMING

POWER OVERLAY MODULE WITH THERMAL STORAGE

POWER OVERLAY MODULE AND METHOD OF ASSEMBLING

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONICS PACKAGE HAVING A SELF-ALIGNING INTERCONNECT ASSEMBLY AN...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

STACKED ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

ELECTRONICS PACKAGE HAVING A MULTI-THICKNESS CONDUCTOR LAYER AND ME...

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE

INTEGRATED CIRCUIT DEVICES AND METHODS OF ASSEMBLING THE SAME

ULTRA-THIN EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANU...

SEMICONDUCTOR DIE BACKSIDE DEVICES AND METHODS OF FABRICATION THEREOF

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED ELECTRONICS PACKAGE

POWER ELECTRONICS PACKAGE AND METHOD OF MANUFACTURING THEREOF

POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...

POWER OVERLAY STRUCTURE AND METHOD OF MAKING SAME

ELECTRONIC PACKAGES WITH PRE-DEFINED VIA PATTERNS AND METHODS OF MA...

POWER OVERLAY STRUCTURE HAVING WIREBONDS AND METHOD OF MANUFACTURIN...

ELECTRICAL INTERCONNECT STRUCTURE FOR AN EMBEDDED SEMICONDUCTOR DEV...

EMBEDDED SEMICONDUCTOR DEVICE PACKAGE AND METHOD OF MANUFACTURING T...

INTERCONNECT DEVICES FOR ELECTRONIC PACKAGING ASSEMBLIES