Arvind Sundarrajan

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Sealing structure for workpiece to substrate bonding in a processin...
- Patent number 10,978,334
- Issue date Apr 13, 2021
- Applied Materials, Inc.
- Chin Hock Toh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 10,047,430
- Issue date Aug 14, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Electrostatic carrier for handling substrates for processing
- Patent number 9,740,111
- Issue date Aug 22, 2017
- Applied Materials, Inc.
- Arvind Sundarrajan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Hermetic CVD-cap with improved step coverage in high aspect ratio s...
- Patent number 9,362,111
- Issue date Jun 7, 2016
- Applied Materials, Inc.
- Zongbin Wang
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
BEOL interconnect with carbon nanotubes
- Patent number 9,305,838
- Issue date Apr 5, 2016
- Applied Materials, Inc.
- Pravin K. Narwankar
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Method for removing native oxide and associated residue from a subs...
- Patent number 8,951,913
- Issue date Feb 10, 2015
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for precleaning a substrate prior to metal silicide fabrica...
- Patent number 8,912,096
- Issue date Dec 16, 2014
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromagnet array in a sputter reactor
- Patent number 8,871,064
- Issue date Oct 28, 2014
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for removing native oxide and associated residue from a subs...
- Patent number 8,772,162
- Issue date Jul 8, 2014
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cu surface plasma treatment to improve gapfill window
- Patent number 8,764,961
- Issue date Jul 1, 2014
- Applied Materials, Inc.
- Qian Luo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of end point detection for substrate fabrication processes
- Patent number 8,747,686
- Issue date Jun 10, 2014
- Applied Materials, Inc.
- Bo Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,696,875
- Issue date Apr 15, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Patent number 8,668,816
- Issue date Mar 11, 2014
- Applied Materials Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods for contact clean
- Patent number 8,642,473
- Issue date Feb 4, 2014
- Applied Materials, Inc.
- Mei Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for removing native oxide and associated residue from a subs...
- Patent number 8,455,352
- Issue date Jun 4, 2013
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for reducing damage to substrate layers in deposition proce...
- Patent number 7,807,568
- Issue date Oct 5, 2010
- Applied Materials, Inc.
- Xinyu Fu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-step process for forming a metal barrier in a sputter reactor
- Patent number 7,686,926
- Issue date Mar 30, 2010
- Applied Materials, Inc.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Temperature control of a substrate
- Patent number 6,607,640
- Issue date Aug 19, 2003
- Applied Materials, Inc.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced cooling IMP coil support
- Patent number 6,580,057
- Issue date Jun 17, 2003
- Applied Materials, Inc.
- Richard Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pressure modulation method to obtain improved step coverage of seed...
- Patent number 6,458,251
- Issue date Oct 1, 2002
- Applied Materials, Inc.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Physical vapor deposition apparatus with deposition and DC target p...
- Patent number 6,454,919
- Issue date Sep 24, 2002
- Applied Materials, Inc.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Enhanced cooling IMP coil support
- Patent number 6,376,807
- Issue date Apr 23, 2002
- Applied Materials, Inc.
- Richard Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved chamber bake-out and cool-down
- Patent number 6,375,743
- Issue date Apr 23, 2002
- Applied Materials, Inc.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Methods and apparatus for ionized metal plasma copper deposition wi...
- Patent number 6,235,163
- Issue date May 22, 2001
- Applied Materials, Inc.
- Darryl Angelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for improved chamber bake-out and cool-down
- Patent number 6,193,811
- Issue date Feb 27, 2001
- Applied Materials, Inc.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for forming a multilayered aluminum-comprising structure on...
- Patent number 6,177,350
- Issue date Jan 23, 2001
- Applied Materials, Inc.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20180327893
- Publication date Nov 15, 2018
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SEALING STRUCTURE FOR WORKPIECE TO SUBSTRATE BONDING IN A PROCESSIN...
- Publication number 20160064267
- Publication date Mar 3, 2016
- Chin Hock Toh
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ELECTROSTATIC CARRIER FOR HANDLING SUBSTRATES FOR PROCESSING
- Publication number 20150331337
- Publication date Nov 19, 2015
- Arvind Sundarrajan
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
HERMETIC CVD-CAP WITH IMPROVED STEP COVERAGE IN HIGH ASPECT RATIO S...
- Publication number 20150235844
- Publication date Aug 20, 2015
- Applied Materials, Inc.
- Zongbin WANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20140305802
- Publication date Oct 16, 2014
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR REMOVING NATIVE OXIDE AND ASSOCIATED RESIDUE FROM A SUBS...
- Publication number 20140295665
- Publication date Oct 2, 2014
- Bo ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR REMOVING NATIVE OXIDE AND ASSOCIATED RESIDUE FROM A SUBS...
- Publication number 20130316533
- Publication date Nov 28, 2013
- Bo ZHENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL Interconnect With Carbon Nanotubes
- Publication number 20130228933
- Publication date Sep 5, 2013
- Applied Materials, Inc.
- Pravin K. Narwankar
- B82 - NANO-TECHNOLOGY
Information Patent Application
METHODS OF END POINT DETECTION FOR SUBSTRATE FABRICATION PROCESSES
- Publication number 20130193108
- Publication date Aug 1, 2013
- Applied Materials, Inc.
- Bo Zheng
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR PRECLEANING A SUBSTRATE PRIOR TO METAL SILICIDE FABRICA...
- Publication number 20120276740
- Publication date Nov 1, 2012
- Applied Materials, Inc.
- Bo Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR CONTACT CLEAN
- Publication number 20120225558
- Publication date Sep 6, 2012
- Applied Materials, Inc.
- MEI CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PRE-CLEAN CHAMBER WITH REDUCED ION CURRENT
- Publication number 20110315319
- Publication date Dec 29, 2011
- Applied Materials, Inc.
- JOHN C. FORSTER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electromagnet array in a sputter reactor
- Publication number 20100155223
- Publication date Jun 24, 2010
- Applied Materials, Inc.
- Tza-Jing GUNG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS FOR REDUCING DAMAGE TO SUBSTRATE LAYERS IN DEPOSITION PROCE...
- Publication number 20100105203
- Publication date Apr 29, 2010
- Applied Materials, Inc.
- XINYU FU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CU SURFACE PLASMA TREATMENT TO IMPROVE GAPFILL WINDOW
- Publication number 20100096273
- Publication date Apr 22, 2010
- Applied Materials, Inc.
- Qian Luo
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20090233438
- Publication date Sep 17, 2009
- Applied Materials, Inc.
- Peijun DING
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
RESPUTTERED COPPER SEED LAYER
- Publication number 20080190760
- Publication date Aug 14, 2008
- Applied Materials, Inc.
- XIANMIN TANG
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...
- Publication number 20080110747
- Publication date May 15, 2008
- Applied Materials, Inc.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Multi-step process for forming a metal barrier in a sputter reactor
- Publication number 20050263390
- Publication date Dec 1, 2005
- APPLIED MATERIALS, INC.
- Tza-Jing Gung
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050255691
- Publication date Nov 17, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Compensation of spacing between magnetron and sputter target
- Publication number 20050133361
- Publication date Jun 23, 2005
- APPLIED MATERIALS, INC.
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Self-ionized and inductively-coupled plasma for sputtering and resp...
- Publication number 20050006222
- Publication date Jan 13, 2005
- Peijun Ding
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Oblique ion milling of via metallization
- Publication number 20040222082
- Publication date Nov 11, 2004
- APPLIED MATERIALS, INC.
- Praburam Gopalraja
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Pressure modulation method to obtain improved step coverage of seed...
- Publication number 20030066747
- Publication date Apr 10, 2003
- APPLIED MATERIALS, INC.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Method of obtaining low temperature alpha-ta thin films using wafer...
- Publication number 20020142589
- Publication date Oct 3, 2002
- APPLIED MATERIALS, INC.
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Enhanced cooling IMP coil support
- Publication number 20020046990
- Publication date Apr 25, 2002
- APPLIED MATERIALS, INC.
- Richard Hong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for improved chamber bake-out and cool-down
- Publication number 20010029888
- Publication date Oct 18, 2001
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Temperature Control of a substrate
- Publication number 20010025783
- Publication date Oct 4, 2001
- Arvind Sundarrajan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Arvind Sundarrajan

Person

Patents Grantslast 30 patents

Sealing structure for workpiece to substrate bonding in a processin...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Electrostatic carrier for handling substrates for processing

Hermetic CVD-cap with improved step coverage in high aspect ratio s...

BEOL interconnect with carbon nanotubes

Method for removing native oxide and associated residue from a subs...

Methods for precleaning a substrate prior to metal silicide fabrica...

Electromagnet array in a sputter reactor

Method for removing native oxide and associated residue from a subs...

Cu surface plasma treatment to improve gapfill window

Methods of end point detection for substrate fabrication processes

Self-ionized and inductively-coupled plasma for sputtering and resp...

Self-ionized and inductively-coupled plasma for sputtering and resp...

Methods for contact clean

Method for removing native oxide and associated residue from a subs...

Methods for reducing damage to substrate layers in deposition proce...

Multi-step process for forming a metal barrier in a sputter reactor

Temperature control of a substrate

Enhanced cooling IMP coil support

Pressure modulation method to obtain improved step coverage of seed...

Physical vapor deposition apparatus with deposition and DC target p...

Enhanced cooling IMP coil support

Method for improved chamber bake-out and cool-down

Methods and apparatus for ionized metal plasma copper deposition wi...

Method for improved chamber bake-out and cool-down

Method for forming a multilayered aluminum-comprising structure on...

Patents Applicationslast 30 patents

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

SEALING STRUCTURE FOR WORKPIECE TO SUBSTRATE BONDING IN A PROCESSIN...

ELECTROSTATIC CARRIER FOR HANDLING SUBSTRATES FOR PROCESSING

HERMETIC CVD-CAP WITH IMPROVED STEP COVERAGE IN HIGH ASPECT RATIO S...

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

METHOD FOR REMOVING NATIVE OXIDE AND ASSOCIATED RESIDUE FROM A SUBS...

METHOD FOR REMOVING NATIVE OXIDE AND ASSOCIATED RESIDUE FROM A SUBS...

BEOL Interconnect With Carbon Nanotubes

METHODS OF END POINT DETECTION FOR SUBSTRATE FABRICATION PROCESSES

METHODS FOR PRECLEANING A SUBSTRATE PRIOR TO METAL SILICIDE FABRICA...

METHODS FOR CONTACT CLEAN

PRE-CLEAN CHAMBER WITH REDUCED ION CURRENT

Electromagnet array in a sputter reactor

METHODS FOR REDUCING DAMAGE TO SUBSTRATE LAYERS IN DEPOSITION PROCE...

CU SURFACE PLASMA TREATMENT TO IMPROVE GAPFILL WINDOW

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

RESPUTTERED COPPER SEED LAYER

SELF-IONIZED AND INDUCTIVELY-COUPLED PLASMA FOR SPUTTERING AND RESP...

Multi-step process for forming a metal barrier in a sputter reactor

Self-ionized and inductively-coupled plasma for sputtering and resp...

Compensation of spacing between magnetron and sputter target

Self-ionized and inductively-coupled plasma for sputtering and resp...

Oblique ion milling of via metallization

Pressure modulation method to obtain improved step coverage of seed...

Method of obtaining low temperature alpha-ta thin films using wafer...

Enhanced cooling IMP coil support

Method for improved chamber bake-out and cool-down

Temperature Control of a substrate