Ashay A. Dani

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate integrated inductor with composite magnetic resin layer
- Patent number 11,335,616
- Issue date May 17, 2022
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 10,049,971
- Issue date Aug 14, 2018
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Package structure to enhance yield of TMI interconnections
- Patent number 9,613,933
- Issue date Apr 4, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 9,247,686
- Issue date Jan 26, 2016
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Functional material systems and processes for package-level interco...
- Patent number 9,024,453
- Issue date May 5, 2015
- Intel Corporation
- Rajen S. Sidhu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 8,703,286
- Issue date Apr 22, 2014
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Substrate metallization and ball attach metallurgy with a novel dop...
- Patent number 8,701,281
- Issue date Apr 22, 2014
- Intel Corporation
- Rajen S. Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat dissipating device with preselected designed interface for the...
- Patent number 7,996,989
- Issue date Aug 16, 2011
- Intel Corporation
- Ashay A. Dani
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 7,967,942
- Issue date Jun 28, 2011
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Phase change material containing fusible particles as thermally con...
- Patent number 7,960,019
- Issue date Jun 14, 2011
- Intel Corporation
- Salkumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,846,778
- Issue date Dec 7, 2010
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package thermal interface materials with dielectric obstructio...
- Patent number 7,776,657
- Issue date Aug 17, 2010
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reactive gettering in phase change solders to inhibit oxidation at...
- Patent number 7,727,815
- Issue date Jun 1, 2010
- Intel Corporation
- Chad A. Kumaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat dissipating device with preselected designed interface for the...
- Patent number 7,527,090
- Issue date May 5, 2009
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated heat spreader, heat sink or heat pipe with pre-attached...
- Patent number 7,473,995
- Issue date Jan 6, 2009
- Intel Corporation
- Christopher L. Rumer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package thermal interface materials with dielectric obstructio...
- Patent number 7,332,807
- Issue date Feb 19, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal interface material and electronic assembly having such a th...
- Patent number 7,311,967
- Issue date Dec 25, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material containing fusible particles as thermally con...
- Patent number 7,294,394
- Issue date Nov 13, 2007
- Intel Corporation
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Reworkable thermal interface material
- Patent number 7,253,523
- Issue date Aug 7, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polymer matrices for polymer solder hybrid materials
- Patent number 7,252,877
- Issue date Aug 7, 2007
- Intel Corporation
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Polymer solder hybrid interface material with improved solder fille...
- Patent number 7,030,483
- Issue date Apr 18, 2006
- Intel Corporation
- James C Matayabas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-layer polymer-solder hybrid thermal interface material for in...
- Patent number 7,014,093
- Issue date Mar 21, 2006
- Intel Corporation
- Sabina J. Houle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Gel thermal interface materials comprising fillers having low melti...
- Patent number 6,974,723
- Issue date Dec 13, 2005
- Intel Corporation
- James C. Matayabas, Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon wafer with soluble protective coating
- Patent number 6,974,726
- Issue date Dec 13, 2005
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Phase change material containing fusible particles as thermally con...
- Patent number 6,926,955
- Issue date Aug 9, 2005
- Intel Corporation
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Gel thermal interface materials comprising fillers having low melti...
- Patent number 6,841,867
- Issue date Jan 11, 2005
- Intel Corporation
- James C. Matayabas, Jr.
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...
- Publication number 20240222301
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL LAYER WITH ROUGHENED SURFACES
- Publication number 20240222136
- Publication date Jul 4, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES
- Publication number 20240222283
- Publication date Jul 4, 2024
- Intel Corporation
- Hongxia Feng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DRY FILM PHOTORESIST WET LAMINATION AND METHOD
- Publication number 20240203853
- Publication date Jun 20, 2024
- Intel Corporation
- Bohan Shan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...
- Publication number 20230317653
- Publication date Oct 5, 2023
- Intel Corporation
- Hongxia FENG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE INTEGRATED INDUCTOR
- Publication number 20210098326
- Publication date Apr 1, 2021
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETIC CORE/SHELL PARTICLES FOR INDUCTOR ARRAYS
- Publication number 20200203067
- Publication date Jun 25, 2020
- Intel Corporation
- Malavarayan Sankarasubramanian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20170207152
- Publication date Jul 20, 2017
- Intel Corporation
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Package Structure To Enhance Yield of TMI Interconnections
- Publication number 20150255415
- Publication date Sep 10, 2015
- Thomas J. De Bonis
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS
- Publication number 20140182763
- Publication date Jul 3, 2014
- Saikumar Jayaraman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...
- Publication number 20140175160
- Publication date Jun 26, 2014
- Rajen S. Sidhu
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS
- Publication number 20110194254
- Publication date Aug 11, 2011
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE METALLIZATION AND BALL ATTACH METALLURGY WITH A NOVEL DOP...
- Publication number 20110147066
- Publication date Jun 23, 2011
- Rajen S. Sidhu
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THE...
- Publication number 20080185713
- Publication date Aug 7, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIO...
- Publication number 20080064144
- Publication date Mar 13, 2008
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phase change material containing fusible particles as thermally con...
- Publication number 20070287005
- Publication date Dec 13, 2007
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Polymer matrices for polymer solder hybrid materials
- Publication number 20070251639
- Publication date Nov 1, 2007
- Saikumar Jayaraman
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip package thermal interface materials with dielectric obstructio...
- Publication number 20070158823
- Publication date Jul 12, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip package dielectric sheet for body-biasing
- Publication number 20070152325
- Publication date Jul 5, 2007
- Intel Corporation
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon wafer with non-soluble protective coating
- Publication number 20060289966
- Publication date Dec 28, 2006
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-layer polymer-solder hybrid thermal interface material for in...
- Publication number 20060124700
- Publication date Jun 15, 2006
- Intel Corporation
- Sabina J. Houle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Reactive gettering in phase change solders to inhibit oxidation at...
- Publication number 20060065974
- Publication date Mar 30, 2006
- Chad A. Kumaus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Phase change material containing fusible particles as thermally con...
- Publication number 20050214523
- Publication date Sep 29, 2005
- Saikumar Jayaraman
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Silicon wafer with soluable protective coating
- Publication number 20050139962
- Publication date Jun 30, 2005
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Gel thermal interface materials comprising fillers having low melti...
- Publication number 20050040507
- Publication date Feb 24, 2005
- James C. Matayabas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Reworkable thermal interface material
- Publication number 20050027055
- Publication date Feb 3, 2005
- Intel Corporation
- Ashay A. Dani
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Multi-layer polymer-solder hybrid thermal interface material for in...
- Publication number 20040262372
- Publication date Dec 30, 2004
- Intel Corporation
- Sabina J. Houle
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Heat dissipating device with preselected designed interface for the...
- Publication number 20040261980
- Publication date Dec 30, 2004
- Ashay A. Dani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polymer solder hybrid interface material with improved solder fille...
- Publication number 20040262740
- Publication date Dec 30, 2004
- James C. Matayabas
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated heat spreader with mechanical interlock designs
- Publication number 20040244952
- Publication date Dec 9, 2004
- Intel Corporation
- Sabina Houle
- H01 - BASIC ELECTRIC ELEMENTS

Ashay A. Dani

Person

Patents Grantslast 30 patents

Substrate integrated inductor with composite magnetic resin layer

Package structure to enhance yield of TMI interconnections

Package structure to enhance yield of TMI interconnections

Polymer matrices for polymer solder hybrid materials

Functional material systems and processes for package-level interco...

Polymer matrices for polymer solder hybrid materials

Substrate metallization and ball attach metallurgy with a novel dop...

Heat dissipating device with preselected designed interface for the...

Polymer matrices for polymer solder hybrid materials

Phase change material containing fusible particles as thermally con...

Integrated heat spreader, heat sink or heat pipe with pre-attached...

Chip package thermal interface materials with dielectric obstructio...

Reactive gettering in phase change solders to inhibit oxidation at...

Heat dissipating device with preselected designed interface for the...

Integrated heat spreader, heat sink or heat pipe with pre-attached...

Chip package thermal interface materials with dielectric obstructio...

Thermal interface material and electronic assembly having such a th...

Phase change material containing fusible particles as thermally con...

Reworkable thermal interface material

Polymer matrices for polymer solder hybrid materials

Polymer solder hybrid interface material with improved solder fille...

Multi-layer polymer-solder hybrid thermal interface material for in...

Gel thermal interface materials comprising fillers having low melti...

Silicon wafer with soluble protective coating

Phase change material containing fusible particles as thermally con...

Gel thermal interface materials comprising fillers having low melti...

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR OPTICAL THERMAL TREATMENT IN SEMICONDUCTO...

ELECTRICAL LAYER WITH ROUGHENED SURFACES

METHODS AND APPARATUS TO PREVENT OVER-ETCH IN SEMICONDUCTOR PACKAGES

DRY FILM PHOTORESIST WET LAMINATION AND METHOD

HYBRID BONDING A DIE TO A SUBSTRATE WITH VIAS CONNECTING METAL PADS...

SUBSTRATE INTEGRATED INDUCTOR

MAGNETIC CORE/SHELL PARTICLES FOR INDUCTOR ARRAYS

Package Structure To Enhance Yield of TMI Interconnections

Package Structure To Enhance Yield of TMI Interconnections

POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS

SOLDER PASTE MATERIAL TECHNOLOGY FOR ELIMINATION OF HIGH WARPAGE SU...

POLYMER MATRICES FOR POLYMER SOLDER HYBRID MATERIALS

SUBSTRATE METALLIZATION AND BALL ATTACH METALLURGY WITH A NOVEL DOP...

HEAT DISSIPATING DEVICE WITH PRESELECTED DESIGNED INTERFACE FOR THE...

CHIP PACKAGE THERMAL INTERFACE MATERIALS WITH DIELECTRIC OBSTRUCTIO...

Phase change material containing fusible particles as thermally con...

Polymer matrices for polymer solder hybrid materials

Chip package thermal interface materials with dielectric obstructio...

Chip package dielectric sheet for body-biasing

Silicon wafer with non-soluble protective coating

Multi-layer polymer-solder hybrid thermal interface material for in...

Reactive gettering in phase change solders to inhibit oxidation at...

Phase change material containing fusible particles as thermally con...

Silicon wafer with soluable protective coating

Gel thermal interface materials comprising fillers having low melti...

Reworkable thermal interface material

Multi-layer polymer-solder hybrid thermal interface material for in...

Heat dissipating device with preselected designed interface for the...

Polymer solder hybrid interface material with improved solder fille...

Integrated heat spreader with mechanical interlock designs