Patent Application
20110147066
1. Field
Technology for interconnecting integrated circuitry, packages and printed circuit boards.
2. Background
In metallurgy, “wetting” refers to the ability of a liquid to maintain contact with a solid surface. Wetting is an important factor in bonding two materials. When bonding a circuit package with a carrier (e.g., a printed circuit board), solder paste may be used to temporarily hold the solder balls (or solder bumps) on the circuit package to the board. A reflow process can be performed to melt the solder balls (or solder bumps), which form solder joints after the molten solder is cooled. The solder joints provide an electrical and mechanical connection between the package and the board.
During the reflow process, circuit packages often experience various degrees of warpage as the temperature changes. The changing degrees of warpage can be referred to as “dynamic warpage.” Dynamic warpage is often the cause of non-wet joints, which means the solder balls fail to properly adhere to the surface of the board. For example, during the surface mount (SMT) reflow, dynamic warpage usually results in insufficient time for the flux to clean off the oxide and residue layer on the solder balls to form proper solder joints. As such, the formation of non-wet solder joints may occur.
Further, dynamic warpage can result in an inadequate flux and solder ball contact. The inadequate flux and solder ball contact can cause non-uniform collapse of the solder balls during the reflow. Thus, solder balls that are not in contact with the board during a period of reflow may have an increased oxide surface layer. When the warpage changes to force these solder balls back in contact with the board, adjacent solder balls may be squeezed out and form a bridge, which is referred to as a solder bump bridge.
On a surface having poor wetting characteristics (e.g., a heavily oxidized solder surface), molten solder may spread during reflow and two adjacent solder bumps may melt into each other to form a solder bump bridge. Solder bump bridging may be the cause of a short circuit.
Conventionally, the problem of non-wet joint and solder bump bridging is solved by modifying the reflow process. For example, the volume of solder paste can be increased, or the heat profile of the reflow can be modified. However, the conventional solutions have had minimal success, with an increased risk for other issues, such as solder bridging.
Embodiments are illustrated by way of example and not by way of limitation in the figures of the accompanying drawings in which like references indicate similar elements. It should be noted that references to “an” or “one” embodiment in this disclosure are not necessarily to the same embodiment, and such references mean at least one.
According to one embodiment of the invention, pad 220 may include a layer 240 of surface-active dopants (e.g., Germanium (Ge), Boron (B) or Rhenium (Re)). The term “surface-active dopants” refers to dopants that diffuse to the surface upon the application of heat. For example, a ball attach (BA) reflow process may be performed to bond solder element 210 to the package substrate. During the BA reflow, circuit package 200 (including the package substrate, solder paste 230 and solder element 210) is heated above the melting temperature of the solder material (e.g., Sn-based alloy). The heat activates the surface-active dopants, which diffuse to the surface of solder element 210 and create an oxide passivation layer 250 as a protective barrier layer to prevent oxidation of solder element 210.
After the BA reflow, solder element 210 is bonded with pad 220. Oxide passivation layer 250 is formed on the surface of solder element 210 to prevent or reduce the formation of Sn oxide. Oxide passivation layer 250 is a passivation protective layer, which is made up of an oxide complex of the surface-active dopants (e.g., GeO, GeO2, etc.) that are bound to Sn and other alloying elements in the solder (e.g., Ag, Cu, etc.). Oxide passivation layer 250 prevents Sn oxidation which causes the defects mentioned above. The Cu layer remains in pad 220 after the BA reflow. The other metal layers (e.g., Ni, Pd and Au layers) that were previously within pad 220 before the BA reflow react with the molten solder. The reaction forms inter-metallic elements that may diffuse into the bulk of solder element 210.
A subsequent reflow process, such as a surface mount (SMT) reflow, may be performed to bond circuit package 200 to a carrier substrate 260 (e.g., a PCB). In some embodiments, the subsequent reflow process may be performed to bond circuit package 200 to another component substrate (e.g., a package-on-package assembly). Thus, it is understood that the SMT reflow described in the following may be a heating process for bonding components that are different from a circuit package and a PCB. A bonding material, such as a SMT solder paste 270, may be applied between solder element 210 and carrier substrate 260. SMT solder paste 270 may be a mixture of powdered solder and flux. The powdered solder may be a tin (Sn) based alloy, and the flux may be a type of resin acid. In one embodiment, SMT solder paste 270 may include the flux only.
During the SMT reflow, the assembly of circuit package 200, carrier substrate 260 and SMT solder paste 270 are heated above the melting temperature of the solder material. With oxide passivation layer 250 on the surface of solder element 210, rapid wetting and uniform solder joint formation can be achieved between circuit package 200 and carrier substrate 260. Further, as a result of rapid wetting, defects caused by solder bump bridging can be greatly reduced. Solder bump bridging is generally a byproduct of non-wet joints. Oxide passivation layer 250 helps to reduce the defects caused by solder bump bridging.
After the formation of the solder joint to carrier substrate 260, surface oxides and oxide passivation layer 250 can be removed by the flux in SMT solder paste 270. The solder joint forms a uniform contact without non-wetting defects and without solder bump bridging defects. The solder joint may be part of an array of solder joints 280 between circuit package 200 and carrier substrate 260. An example of such a solder joint in array 280 is shown in diagram 290.
Referring to
During the BA reflow, the surface-active dopants form oxide passivation layer 250. As mentioned above with reference to
Referring to
In an embodiment where surface-active dopants are added to solder paste 230, the surface-active dopants diffuse to the surface of solder element 210 during the BA reflow to form oxide passivation layer 250. Oxide passivation layer 250 prevents or reduces the oxidation of the solder material. Therefore, there is a reduced level of SnO on the surface of solder element 210 and in the solder joint between solder element 210 and pad 220. The reduction of SnO level, in turn, reduces the level of metal salt residue formed by the flux reacting with SnO. The reduction of metal salt residue improves the coalescence of the powdered solder in solder paste 230. As a result, during the BA reflow, volatiles 440 (e.g., gas) can escape more easily and a lesser amount of gas is entrapped in the solder joint to form voids.
Referring to
At block 510, circuit elements are formed within the substrate of circuit package 210 (i.e., package substrate). At block 520, a number of pads (e.g., pad 220) are formed within the package substrate, each pad including a stack of metal layers (e.g., Cu, Ni, Pd, Au, etc.). The metal layers can be deposited using a low temperature deposition technique, including but not limited to: chemical vapor deposition, sputtering, electrolytic deposition, and electro-less deposition. In one embodiment, one of the metal layers in the stack contains surface-active dopants, such as Ge, B, or Re.
At block 530, solder paste 230 (which includes powdered solder and flux, or only the flux) is applied on top of pad 220. At block 540, solder element 210 is placed on solder paste 230.
At block 550, a BA reflow is performed by heating circuit package 200 (including the package substrate and solder element 210) approximately 20° C. above the melting temperature of the solder material, which activates the flux as well as the surface-active dopants. The surface-active dopants segregate to the surface of solder element 210, creating a protective barrier layer (i.e., oxide passivation layer 250) against oxidation.
At block 560, SMT solder paste 270 is applied between solder element 210 and carrier substrate 260. At block 570, an SMT reflow is performed by heating circuit package 200 and carrier substrate 260 approximately 20° C. above the melting temperature of the solder material. During the heating process, the flux in SMT solder paste 270 removes the surface oxides and oxide passivation layer 250. Thus, at block 580, solder element 210 forms a uniform contact between circuit package 200 and carrier substrate 260, without non-wetting defects and without solder bump bridging defects.
It is understood that the method of
In one embodiment, the concentration of the surface-active dopants may be in the range of 1 to 10000 ppm after incorporated into the solder element 210 bulk. The concentration of the surface-active dopants deposited into pad 220 may range from a layer of pure dopant (i.e., 100%) to a few ppm. The layer can vary in thickness to accommodate the different concentrations. A typical thickness of oxide passivation layer 250 ranges from 1 to 20 Angstroms
Embodiments of the invention enable chip attach, ball attach, package-on-package and board SMT processes. With the embodiments described herein, non-wet solder joints and solder bump bridging can be greatly reduced, and rapid wetting can be greatly enhanced. Additionally, oxide passivation on the surface of solder elements can be controlled by choosing the type of dopants and the concentration level of the dopants.
Referring to
In the foregoing specification, specific embodiments have been described. It will, however, be evident that various modifications and changes can be made thereto without departing from the broader spirit and scope of the appended claims. The specification and drawings are, accordingly, to be regarded in an illustrative rather than a restrictive sense.
