Ashim Dutta

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Dual layer top contact for magnetic tunnel junction stack
- Patent number 12,219,881
- Issue date Feb 4, 2025
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
MRAM device with wrap-around top electrode
- Patent number 12,207,561
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE
Information Patent Grant
Additive interconnect formation
- Patent number 12,183,630
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped contact within memory region
- Patent number 12,144,263
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,133,473
- Issue date Oct 29, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Airgap isolation for back-end-of-the-line semiconductor interconnec...
- Patent number 12,125,790
- Issue date Oct 22, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,120,963
- Issue date Oct 15, 2024
- International Business Machines Corporation
- Lili Cheng
Information Patent Grant
MRAM cell embedded in a metal layer
- Patent number 12,058,942
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Dielectric fill for tight pitch MRAM pillar array
- Patent number 11,955,152
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
High density two-tier MRAM structure
- Patent number 11,937,435
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Forming self-aligned multi-metal interconnects
- Patent number 11,923,311
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive top via as a bottom electrode contact for an embedded m...
- Patent number 11,910,722
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
Decoupled interconnect structures
- Patent number 11,876,047
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density resistive random-access memory array with self-aligned...
- Patent number 11,856,878
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Dexin Kong
Information Patent Grant
Nonmetallic liner around a magnetic tunnel junction
- Patent number 11,849,647
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Tao Li
Information Patent Grant
Placing top vias at line ends by selective growth of via mask from...
- Patent number 11,830,807
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-based memory hardmask smoothing and stress reduction
- Patent number 11,812,668
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Michael Rizzolo
Information Patent Grant
Selective encapsulation for metal electrodes of embedded memory dev...
- Patent number 11,778,929
- Issue date Oct 3, 2023
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Embedded memory pillar
- Patent number 11,751,492
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Dexin Kong
Information Patent Grant
Fabrication of embedded memory devices utilizing a self assembled m...
- Patent number 11,744,083
- Issue date Aug 29, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverse tone pillar printing method using organic planarizing layer...
- Patent number 11,699,592
- Issue date Jul 11, 2023
- International Business Machines Corporation
- Nelson Felix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV pattern transfer using graded hardmask
- Patent number 11,681,213
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Nelson Felix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of back-end-of-line interconnects
- Patent number 11,682,558
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding MRAM device in advanced interconnects
- Patent number 11,621,294
- Issue date Apr 4, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct extreme ultraviolet lithography on hard mask with reverse tone
- Patent number 11,501,969
- Issue date Nov 15, 2022
- International Business Machines Corporation
- Yann Mignot
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded memory devices
- Patent number 11,502,242
- Issue date Nov 15, 2022
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Patterning material film stack with hard mask layer configured to s...
- Patent number 11,500,293
- Issue date Nov 15, 2022
- International Business Machines Corporation
- Ekmini Anuja De Silva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fully aligned via for interconnect
- Patent number 11,495,538
- Issue date Nov 8, 2022
- International Business Machines Corporation
- Ruilong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedding magneto-resistive random-access memory devices between me...
- Patent number 11,462,583
- Issue date Oct 4, 2022
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Two-bit magnetoresistive random-access memory device architecture
- Patent number 11,437,083
- Issue date Sep 6, 2022
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421064
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCASPULATED MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE
- Publication number 20240324469
- Publication date Sep 26, 2024
- International Business Machines Corporation
- SON NGUYEN
Information Patent Application
AIR GAP IN BEOL INTERCONNECT
- Publication number 20240312834
- Publication date Sep 19, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE CONTACT
- Publication number 20240206345
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM WITH A MULTI-COMPONENT, MULTI-LAYER BOTTOM ELECTRODE
- Publication number 20240206346
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE
- Publication number 20240188446
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE
Information Patent Application
TOP CONTACT STRUCTURE FOR EMBEDDED MRAM
- Publication number 20240130242
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Ailian Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED EMBEDDED MEMORY ARRAY
- Publication number 20240099035
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Wu-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ENCAPSULATION FOR METAL ELECTRODES OF EMBEDDED MEMORY DEV...
- Publication number 20230403951
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Ashim DUTTA
Information Patent Application
FABRICATION OF EMBEDDED MEMORY DEVICES UTILIZING A SELF ASSEMBLED M...
- Publication number 20230363179
- Publication date Nov 9, 2023
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR STRUCTURE IN INTEGRATED CIRCUIT
- Publication number 20230361158
- Publication date Nov 9, 2023
- International Business Machines Corporation
- Huimei ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE INTERCONNECT FORMATION
- Publication number 20230290682
- Publication date Sep 14, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY METAL HARDMASK STRUCTURE
- Publication number 20230217836
- Publication date Jul 6, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED INTERCONNECTS
- Publication number 20230197506
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK-END-OF-LINE THIN FILM RESISTOR
- Publication number 20230197606
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Baozhen LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM BOTTOM ELECTRODE CONTACT WITH TAPER PROFILE
- Publication number 20230189660
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION
- Publication number 20230187284
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MODIFIED TOP ELECTRODE CONTACT FOR MRAM EMBEDDING IN ADVANCED LOGIC...
- Publication number 20230186962
- Publication date Jun 15, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LAYERED BOTTOM ELECTRODE DIELECTRIC FOR EMBEDDED MRAM
- Publication number 20230189534
- Publication date Jun 15, 2023
- International Business Machines Corporation
- ASHIM DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBTRACTIVE TOP VIA AS A BOTTOM ELECTRODE CONTACT FOR AN EMBEDDED M...
- Publication number 20230180618
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILL FOR TIGHT PITCH MRAM PILLAR ARRAY
- Publication number 20230178129
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADVANCED METAL INTERCONNECT
- Publication number 20230178431
- Publication date Jun 8, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TALL BOTTOM ELECTRODE STRUCTURE IN EMBEDDED MAGNETORESISTIVE RANDOM...
- Publication number 20230172073
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE PAD WITH BUILT-IN INTERCONNECT STRUCTURE
- Publication number 20230170266
- Publication date Jun 1, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) WITH PRESERVED UNDERLY...
- Publication number 20230165156
- Publication date May 25, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED MAGNETORESISTIVE RANDOM ACCESS MEMORY TOP ELECTRODE STRUCTURE
- Publication number 20230157181
- Publication date May 18, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH-DENSITY RESISTIVE RANDOM-ACCESS MEMORY ARRAY WITH SELF-ALIGNED...
- Publication number 20230147958
- Publication date May 11, 2023
- International Business Machines Corporation
- Dexin Kong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH DENSITY TWO-TIER MRAM STRUCTURE
- Publication number 20230133023
- Publication date May 4, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM CELL EMBEDDED IN A METAL LAYER
- Publication number 20230136650
- Publication date May 4, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONTACT STRUCTURE FORMATION FOR MEMORY DEVICES
- Publication number 20230109077
- Publication date Apr 6, 2023
- International Business Machines Corporation
- Lili Cheng
- H01 - BASIC ELECTRIC ELEMENTS

Ashim Dutta

Person

Patents Grantslast 30 patents

Dual layer top contact for magnetic tunnel junction stack

MRAM device with wrap-around top electrode

Additive interconnect formation

Stepped contact within memory region

Contact structure formation for memory devices

Airgap isolation for back-end-of-the-line semiconductor interconnec...

Contact structure formation for memory devices

MRAM cell embedded in a metal layer

Dielectric fill for tight pitch MRAM pillar array

High density two-tier MRAM structure

Forming self-aligned multi-metal interconnects

Subtractive top via as a bottom electrode contact for an embedded m...

Decoupled interconnect structures

High-density resistive random-access memory array with self-aligned...

Nonmetallic liner around a magnetic tunnel junction

Placing top vias at line ends by selective growth of via mask from...

Pillar-based memory hardmask smoothing and stress reduction

Selective encapsulation for metal electrodes of embedded memory dev...

Embedded memory pillar

Fabrication of embedded memory devices utilizing a self assembled m...

Inverse tone pillar printing method using organic planarizing layer...

EUV pattern transfer using graded hardmask

Fabrication of back-end-of-line interconnects

Embedding MRAM device in advanced interconnects

Direct extreme ultraviolet lithography on hard mask with reverse tone

Embedded memory devices

Patterning material film stack with hard mask layer configured to s...

Fully aligned via for interconnect

Embedding magneto-resistive random-access memory devices between me...

Two-bit magnetoresistive random-access memory device architecture

Patents Applicationslast 30 patents

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

ENCASPULATED MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE

AIR GAP IN BEOL INTERCONNECT

MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE CONTACT

MRAM WITH A MULTI-COMPONENT, MULTI-LAYER BOTTOM ELECTRODE

MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE

TOP CONTACT STRUCTURE FOR EMBEDDED MRAM

DOUBLE-SIDED EMBEDDED MEMORY ARRAY

SELECTIVE ENCAPSULATION FOR METAL ELECTRODES OF EMBEDDED MEMORY DEV...

FABRICATION OF EMBEDDED MEMORY DEVICES UTILIZING A SELF ASSEMBLED M...

RESISTOR STRUCTURE IN INTEGRATED CIRCUIT

ADDITIVE INTERCONNECT FORMATION

MEMORY METAL HARDMASK STRUCTURE

DECOUPLED INTERCONNECTS

BACK-END-OF-LINE THIN FILM RESISTOR

MRAM BOTTOM ELECTRODE CONTACT WITH TAPER PROFILE

IN-SITU FEEDBACK FOR LOCALIZED COMPENSATION

MODIFIED TOP ELECTRODE CONTACT FOR MRAM EMBEDDING IN ADVANCED LOGIC...

LAYERED BOTTOM ELECTRODE DIELECTRIC FOR EMBEDDED MRAM

SUBTRACTIVE TOP VIA AS A BOTTOM ELECTRODE CONTACT FOR AN EMBEDDED M...

DIELECTRIC FILL FOR TIGHT PITCH MRAM PILLAR ARRAY

ADVANCED METAL INTERCONNECT

TALL BOTTOM ELECTRODE STRUCTURE IN EMBEDDED MAGNETORESISTIVE RANDOM...

PROBE PAD WITH BUILT-IN INTERCONNECT STRUCTURE

MAGNETORESISTIVE RANDOM-ACCESS MEMORY (MRAM) WITH PRESERVED UNDERLY...

EMBEDDED MAGNETORESISTIVE RANDOM ACCESS MEMORY TOP ELECTRODE STRUCTURE

HIGH-DENSITY RESISTIVE RANDOM-ACCESS MEMORY ARRAY WITH SELF-ALIGNED...

HIGH DENSITY TWO-TIER MRAM STRUCTURE

MRAM CELL EMBEDDED IN A METAL LAYER

CONTACT STRUCTURE FORMATION FOR MEMORY DEVICES