Ashim Dutta

Person

Albany, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Fabrication of embedded memory devices utilizing a self assembled m...
- Patent number 12,363,913
- Issue date Jul 15, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced metal interconnect
- Patent number 12,341,066
- Issue date Jun 24, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe pad with built-in interconnect structure
- Patent number 12,327,770
- Issue date Jun 10, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Tall bottom electrode structure in embedded magnetoresistive random...
- Patent number 12,324,358
- Issue date Jun 3, 2025
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Modified top electrode contact for MRAM embedding in advanced logic...
- Patent number 12,277,960
- Issue date Apr 15, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded metal contamination removal from BEOL wafers
- Patent number 12,272,545
- Issue date Apr 8, 2025
- International Business Machines Corporation
- Devika Sil
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective patterning of vias with hardmasks
- Patent number 12,243,771
- Issue date Mar 4, 2025
- Interational Business Machines Corporation
- John C. Arnold
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual layer top contact for magnetic tunnel junction stack
- Patent number 12,219,881
- Issue date Feb 4, 2025
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
MRAM device with wrap-around top electrode
- Patent number 12,207,561
- Issue date Jan 21, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE
Information Patent Grant
Additive interconnect formation
- Patent number 12,183,630
- Issue date Dec 31, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stepped contact within memory region
- Patent number 12,144,263
- Issue date Nov 12, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,133,473
- Issue date Oct 29, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Airgap isolation for back-end-of-the-line semiconductor interconnec...
- Patent number 12,125,790
- Issue date Oct 22, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contact structure formation for memory devices
- Patent number 12,120,963
- Issue date Oct 15, 2024
- International Business Machines Corporation
- Lili Cheng
Information Patent Grant
MRAM cell embedded in a metal layer
- Patent number 12,058,942
- Issue date Aug 6, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Dielectric fill for tight pitch MRAM pillar array
- Patent number 11,955,152
- Issue date Apr 9, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
High density two-tier MRAM structure
- Patent number 11,937,435
- Issue date Mar 19, 2024
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Forming self-aligned multi-metal interconnects
- Patent number 11,923,311
- Issue date Mar 5, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Subtractive top via as a bottom electrode contact for an embedded m...
- Patent number 11,910,722
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Ashim Dutta
- G11 - INFORMATION STORAGE
Information Patent Grant
Decoupled interconnect structures
- Patent number 11,876,047
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High-density resistive random-access memory array with self-aligned...
- Patent number 11,856,878
- Issue date Dec 26, 2023
- International Business Machines Corporation
- Dexin Kong
Information Patent Grant
Nonmetallic liner around a magnetic tunnel junction
- Patent number 11,849,647
- Issue date Dec 19, 2023
- International Business Machines Corporation
- Tao Li
Information Patent Grant
Placing top vias at line ends by selective growth of via mask from...
- Patent number 11,830,807
- Issue date Nov 28, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pillar-based memory hardmask smoothing and stress reduction
- Patent number 11,812,668
- Issue date Nov 7, 2023
- International Business Machines Corporation
- Michael Rizzolo
Information Patent Grant
Selective encapsulation for metal electrodes of embedded memory dev...
- Patent number 11,778,929
- Issue date Oct 3, 2023
- International Business Machines Corporation
- Ashim Dutta
Information Patent Grant
Embedded memory pillar
- Patent number 11,751,492
- Issue date Sep 5, 2023
- International Business Machines Corporation
- Dexin Kong
Information Patent Grant
Fabrication of embedded memory devices utilizing a self assembled m...
- Patent number 11,744,083
- Issue date Aug 29, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inverse tone pillar printing method using organic planarizing layer...
- Patent number 11,699,592
- Issue date Jul 11, 2023
- International Business Machines Corporation
- Nelson Felix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EUV pattern transfer using graded hardmask
- Patent number 11,681,213
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Nelson Felix
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of back-end-of-line interconnects
- Patent number 11,682,558
- Issue date Jun 20, 2023
- International Business Machines Corporation
- Chi-Chun Liu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BIMETALLIC FUSE ELEMENT BETWEEN METAL LEVELS
- Publication number 20250218935
- Publication date Jul 3, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FORKSHEET DEVICE WITH WRAPPED CONTACT
- Publication number 20250203936
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Ruilong Xie
Information Patent Application
MEMORY DEVICES WITH ENCAPSULATION LAYERS AND METAL VIA
- Publication number 20250204267
- Publication date Jun 19, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
Information Patent Application
DOUBLE-SIDED MEMORY DEVICE USING A SHARED TRANSISTOR
- Publication number 20250194104
- Publication date Jun 12, 2025
- International Business Machines Corporation
- Ashim Dutta
Information Patent Application
AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA
- Publication number 20250125192
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRICAL FUSE STRUCTURE
- Publication number 20250125285
- Publication date Apr 17, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-TAPERED MRAM DEVICE STRUCTURE
- Publication number 20250120324
- Publication date Apr 10, 2025
- International Business Machines Corporation
- Oscar van der Straten
- G11 - INFORMATION STORAGE
Information Patent Application
METAL SPACER 3D-MIM CAPACITOR
- Publication number 20250113498
- Publication date Apr 3, 2025
- International Business Machines Corporation
- Shravana Kumar Katakam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THREE-DIMENSIONAL RESISTORS
- Publication number 20250107113
- Publication date Mar 27, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPERED ANTIFUSE
- Publication number 20250096123
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ANTIFUSE AND RESISTOR
- Publication number 20250096125
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
VERTICAL ANTIFUSE
- Publication number 20250096122
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HORIZONTAL ANTIFUSE
- Publication number 20250096124
- Publication date Mar 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SCALABLE THIN-FILM RESISTOR STRUCTURE
- Publication number 20250087392
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR-SHAPED RESISTOR
- Publication number 20250089347
- Publication date Mar 13, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRENCH LINER FUSE
- Publication number 20250062225
- Publication date Feb 20, 2025
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)
- Publication number 20240421064
- Publication date Dec 19, 2024
- International Business Machines Corporation
- Chanro Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENCASPULATED MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE
- Publication number 20240324469
- Publication date Sep 26, 2024
- International Business Machines Corporation
- SON NGUYEN
Information Patent Application
AIR GAP IN BEOL INTERCONNECT
- Publication number 20240312834
- Publication date Sep 19, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE CONTACT
- Publication number 20240206345
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM WITH A MULTI-COMPONENT, MULTI-LAYER BOTTOM ELECTRODE
- Publication number 20240206346
- Publication date Jun 20, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE
- Publication number 20240188446
- Publication date Jun 6, 2024
- International Business Machines Corporation
- Shravana Kumar Katakam
- G11 - INFORMATION STORAGE
Information Patent Application
TOP CONTACT STRUCTURE FOR EMBEDDED MRAM
- Publication number 20240130242
- Publication date Apr 18, 2024
- International Business Machines Corporation
- Ailian Zhao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DOUBLE-SIDED EMBEDDED MEMORY ARRAY
- Publication number 20240099035
- Publication date Mar 21, 2024
- International Business Machines Corporation
- Wu-Chang Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SELECTIVE ENCAPSULATION FOR METAL ELECTRODES OF EMBEDDED MEMORY DEV...
- Publication number 20230403951
- Publication date Dec 14, 2023
- International Business Machines Corporation
- Ashim DUTTA
Information Patent Application
FABRICATION OF EMBEDDED MEMORY DEVICES UTILIZING A SELF ASSEMBLED M...
- Publication number 20230363179
- Publication date Nov 9, 2023
- International Business Machines Corporation
- Ashim DUTTA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RESISTOR STRUCTURE IN INTEGRATED CIRCUIT
- Publication number 20230361158
- Publication date Nov 9, 2023
- International Business Machines Corporation
- Huimei ZHOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ADDITIVE INTERCONNECT FORMATION
- Publication number 20230290682
- Publication date Sep 14, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY METAL HARDMASK STRUCTURE
- Publication number 20230217836
- Publication date Jul 6, 2023
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DECOUPLED INTERCONNECTS
- Publication number 20230197506
- Publication date Jun 22, 2023
- International Business Machines Corporation
- Saumya Sharma
- H01 - BASIC ELECTRIC ELEMENTS

Ashim Dutta

Person

Patents Grantslast 30 patents

Fabrication of embedded memory devices utilizing a self assembled m...

Advanced metal interconnect

Probe pad with built-in interconnect structure

Tall bottom electrode structure in embedded magnetoresistive random...

Modified top electrode contact for MRAM embedding in advanced logic...

Embedded metal contamination removal from BEOL wafers

Selective patterning of vias with hardmasks

Dual layer top contact for magnetic tunnel junction stack

MRAM device with wrap-around top electrode

Additive interconnect formation

Stepped contact within memory region

Contact structure formation for memory devices

Airgap isolation for back-end-of-the-line semiconductor interconnec...

Contact structure formation for memory devices

MRAM cell embedded in a metal layer

Dielectric fill for tight pitch MRAM pillar array

High density two-tier MRAM structure

Forming self-aligned multi-metal interconnects

Subtractive top via as a bottom electrode contact for an embedded m...

Decoupled interconnect structures

High-density resistive random-access memory array with self-aligned...

Nonmetallic liner around a magnetic tunnel junction

Placing top vias at line ends by selective growth of via mask from...

Pillar-based memory hardmask smoothing and stress reduction

Selective encapsulation for metal electrodes of embedded memory dev...

Embedded memory pillar

Fabrication of embedded memory devices utilizing a self assembled m...

Inverse tone pillar printing method using organic planarizing layer...

EUV pattern transfer using graded hardmask

Fabrication of back-end-of-line interconnects

Patents Applicationslast 30 patents

BIMETALLIC FUSE ELEMENT BETWEEN METAL LEVELS

FORKSHEET DEVICE WITH WRAPPED CONTACT

MEMORY DEVICES WITH ENCAPSULATION LAYERS AND METAL VIA

DOUBLE-SIDED MEMORY DEVICE USING A SHARED TRANSISTOR

AIR GAP STRUCTURE IN INTERCONNECT WITH TOP VIA

ELECTRICAL FUSE STRUCTURE

MULTI-TAPERED MRAM DEVICE STRUCTURE

METAL SPACER 3D-MIM CAPACITOR

THREE-DIMENSIONAL RESISTORS

TAPERED ANTIFUSE

ANTIFUSE AND RESISTOR

VERTICAL ANTIFUSE

HORIZONTAL ANTIFUSE

SCALABLE THIN-FILM RESISTOR STRUCTURE

CIRCULAR-SHAPED RESISTOR

TRENCH LINER FUSE

METAL INSULATOR METAL CAPACITOR (MIM CAPACITOR)

ENCASPULATED MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE

AIR GAP IN BEOL INTERCONNECT

MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE CONTACT

MRAM WITH A MULTI-COMPONENT, MULTI-LAYER BOTTOM ELECTRODE

MRAM DEVICE WITH WRAP-AROUND TOP ELECTRODE

TOP CONTACT STRUCTURE FOR EMBEDDED MRAM

DOUBLE-SIDED EMBEDDED MEMORY ARRAY

SELECTIVE ENCAPSULATION FOR METAL ELECTRODES OF EMBEDDED MEMORY DEV...

FABRICATION OF EMBEDDED MEMORY DEVICES UTILIZING A SELF ASSEMBLED M...

RESISTOR STRUCTURE IN INTEGRATED CIRCUIT

ADDITIVE INTERCONNECT FORMATION

MEMORY METAL HARDMASK STRUCTURE

DECOUPLED INTERCONNECTS