Ashley Rebelo

Person

Emmaus, PA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer integrated transmission line circuits having a metal ro...
- Patent number 8,981,864
- Issue date Mar 17, 2015
- LSI Corporation
- Daniel L. Gerlach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of generating a leadframe IC package model, a leadframe mode...
- Patent number 8,370,777
- Issue date Feb 5, 2013
- LSI Corporation
- Donald E. Hawk
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Method and article of manufacture for wire bonding with staggered d...
- Patent number 8,084,857
- Issue date Dec 27, 2011
- Agere Systems
- Gavin Appel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit with staggered differential wire bond pairs
- Patent number 7,675,168
- Issue date Mar 9, 2010
- Agere Systems Inc.
- Gavin Appel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package for high-speed signals
- Patent number 7,671,450
- Issue date Mar 2, 2010
- Agere Systems Inc.
- Ellis E. Nease
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding method and related device for high-frequency applications
- Patent number 7,667,321
- Issue date Feb 23, 2010
- Agere Systems Inc.
- Ashley Rebelo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTI-LAYER INTEGRATED TRANSMISSION LINE CIRCUITS HAVING IMPROVED S...
- Publication number 20130285769
- Publication date Oct 31, 2013
- LSI Corporation
- Daniel L. Gerlach
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN
- Publication number 20130161805
- Publication date Jun 27, 2013
- LSI Corporation
- Clifford R. Fishley
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF GENERATING A LEADFRAME IC PACKAGE MODEL, A LEADFRAME MODE...
- Publication number 20100318340
- Publication date Dec 16, 2010
- LSI Corporation
- Donald E. Hawk, JR.
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
METHOD AND ARTICLE OF MANUFACTURE FOR WIRE BONDING WITH STAGGERED D...
- Publication number 20100120198
- Publication date May 13, 2010
- Gavin Appel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Circuit Package for High-Speed Signals
- Publication number 20090152689
- Publication date Jun 18, 2009
- Agere Systems Inc.
- Ellis E. Nease
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Wire bonding method and related device for high-frequency applications
- Publication number 20080227284
- Publication date Sep 18, 2008
- Agere Systems, Inc.
- Ashley Rebelo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated circuit with staggered differential wire bond pairs
- Publication number 20060192300
- Publication date Aug 31, 2006
- Gavin Appel
- H01 - BASIC ELECTRIC ELEMENTS

Ashley Rebelo

Person

Patents Grantslast 30 patents

Multi-layer integrated transmission line circuits having a metal ro...

Method of generating a leadframe IC package model, a leadframe mode...

Method and article of manufacture for wire bonding with staggered d...

Integrated circuit with staggered differential wire bond pairs

Integrated circuit package for high-speed signals

Wire bonding method and related device for high-frequency applications

Patents Applicationslast 30 patents

MULTI-LAYER INTEGRATED TRANSMISSION LINE CIRCUITS HAVING IMPROVED S...

INTEGRATED CIRCUIT (IC) LEADFRAME DESIGN

METHOD OF GENERATING A LEADFRAME IC PACKAGE MODEL, A LEADFRAME MODE...

METHOD AND ARTICLE OF MANUFACTURE FOR WIRE BONDING WITH STAGGERED D...

Integrated Circuit Package for High-Speed Signals

Wire bonding method and related device for high-frequency applications

Integrated circuit with staggered differential wire bond pairs