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Atapol Prajuckamol

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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    POWER MODULE WITH OVERLAPPING TERMINALS
    • Publication number 20240332148
    • Publication date Oct 3, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SANDWICH PACKAGE FOR MICROELECTRONICS
    • Publication number 20240290757
    • Publication date Aug 29, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240290758
    • Publication date Aug 29, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATES AND RELATED METHODS
    • Publication number 20240258181
    • Publication date Aug 1, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240203846
    • Publication date Jun 20, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240203845
    • Publication date Jun 20, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE
    • Publication number 20240162197
    • Publication date May 16, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240128240
    • Publication date Apr 18, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
    • Publication number 20240038632
    • Publication date Feb 1, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
    • Publication number 20230326901
    • Publication date Oct 12, 2023
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH GUIDE PIN
    • Publication number 20230317579
    • Publication date Oct 5, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER CIRCUIT MODULE
    • Publication number 20230052830
    • Publication date Feb 16, 2023
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415766
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415857
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415858
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415767
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
    • Publication number 20220246486
    • Publication date Aug 4, 2022
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
    • Publication number 20220199502
    • Publication date Jun 23, 2022
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220159853
    • Publication date May 19, 2022
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FIN FRAME ASSEMBLIES
    • Publication number 20210219448
    • Publication date Jul 15, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING LOW-STRESS SPACER
    • Publication number 20210193551
    • Publication date Jun 24, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTING CLIP DESIGN FOR PRESSURE SINTERING
    • Publication number 20210090975
    • Publication date Mar 25, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
    • Publication number 20210050272
    • Publication date Feb 18, 2021
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20210035956
    • Publication date Feb 4, 2021
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20210035892
    • Publication date Feb 4, 2021
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR BASEPLATES
    • Publication number 20200402887
    • Publication date Dec 24, 2020
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH GUIDE PIN
    • Publication number 20200373231
    • Publication date Nov 26, 2020
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE HOUSING
    • Publication number 20200358221
    • Publication date Nov 12, 2020
    • Semiconductor Components Industries, LLC
    • Jihwan KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FIN FRAME ASSEMBLIES
    • Publication number 20200344905
    • Publication date Oct 29, 2020
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    PRESS-FIT PIN FOR SEMICONDUCTOR PACKAGES AND RELATED METHODS
    • Publication number 20200274310
    • Publication date Aug 27, 2020
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS