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Patents Grantslast 30 patents

  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 12,362,266
    • Issue date Jul 15, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 12,355,009
    • Issue date Jul 8, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 12,347,755
    • Issue date Jul 1, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 12,347,812
    • Issue date Jul 1, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package system and related methods
    • Patent number 12,308,297
    • Issue date May 20, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Yushuang Yao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Substrates and related methods
    • Patent number 12,300,558
    • Issue date May 13, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Clip design and method of controlling clip position
    • Patent number 12,283,562
    • Issue date Apr 22, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Multiple substrate package systems and related methods
    • Patent number 12,211,775
    • Issue date Jan 28, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package system and related methods
    • Patent number 12,033,904
    • Issue date Jul 9, 2024
    • Semiconductor Components Industries, L.L.C.
    • Yushuang Yao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 11,955,412
    • Issue date Apr 9, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 11,948,870
    • Issue date Apr 2, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 11,908,840
    • Issue date Feb 20, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 11,894,347
    • Issue date Feb 6, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Connecting clip design for pressure sintering
    • Patent number 11,804,421
    • Issue date Oct 31, 2023
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package with guide pin
    • Patent number 11,710,687
    • Issue date Jul 25, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 11,672,087
    • Issue date Jun 6, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 11,469,163
    • Issue date Oct 11, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Low stress asymmetric dual side module
    • Patent number 11,462,515
    • Issue date Oct 4, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fin frame assemblies
    • Patent number 11,452,225
    • Issue date Sep 20, 2022
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Press-fit pin for semiconductor packages and related methods
    • Patent number 11,374,373
    • Issue date Jun 28, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong Chew
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package system and related methods
    • Patent number 11,342,237
    • Issue date May 24, 2022
    • Semiconductor Components Industries, LLC
    • Yushuang Yao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for forming a semiconductor package
    • Patent number 11,272,625
    • Issue date Mar 8, 2022
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device assemblies including low-stress spacer
    • Patent number 11,217,506
    • Issue date Jan 4, 2022
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Power module housing
    • Patent number 11,081,828
    • Issue date Aug 3, 2021
    • Semiconductor Components Industries, LLC
    • Jihwan Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Press-fit pin case
    • Patent number D922329
    • Issue date Jun 15, 2021
    • Semiconductor Components Industries, LLC
    • Jihwan Kim
    • D13 - Equipment for production, distribution, or transformation of energy
  • Information Patent Grant

    Semiconductor baseplates
    • Patent number 10,971,428
    • Issue date Apr 6, 2021
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Method for forming a semiconductor package
    • Patent number 10,971,429
    • Issue date Apr 6, 2021
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Fin frame assemblies
    • Patent number 10,966,335
    • Issue date Mar 30, 2021
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Method of making single reflow power pin connections
    • Patent number 10,897,821
    • Issue date Jan 19, 2021
    • Semiconductor Components Industries, LLC
    • Yushuang Yao
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Grant

    Package structure with multiple substrates
    • Patent number 10,861,767
    • Issue date Dec 8, 2020
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
    • Publication number 20250118640
    • Publication date Apr 10, 2025
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE WITH OVERLAPPING TERMINALS
    • Publication number 20240332148
    • Publication date Oct 3, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SANDWICH PACKAGE FOR MICROELECTRONICS
    • Publication number 20240290757
    • Publication date Aug 29, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240290758
    • Publication date Aug 29, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SUBSTRATES AND RELATED METHODS
    • Publication number 20240258181
    • Publication date Aug 1, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • B32 - LAYERED PRODUCTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240203846
    • Publication date Jun 20, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240203845
    • Publication date Jun 20, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SCALABLE POWER SEMICONDUCTOR DEVICE PACKAGE WITH LOW INDUCTANCE
    • Publication number 20240162197
    • Publication date May 16, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20240128240
    • Publication date Apr 18, 2024
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIRECT SUBSTRATE-SIDE COOLING IN POWER DEVICE MODULE
    • Publication number 20240038632
    • Publication date Feb 1, 2024
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CLIP DESIGN AND METHOD OF CONTROLLING CLIP POSITION
    • Publication number 20230326901
    • Publication date Oct 12, 2023
    • Semiconductor Components Industries, LLC
    • Atapol Prajuckamol
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH GUIDE PIN
    • Publication number 20230317579
    • Publication date Oct 5, 2023
    • SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER CIRCUIT MODULE
    • Publication number 20230052830
    • Publication date Feb 16, 2023
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415766
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415857
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415858
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20220415767
    • Publication date Dec 29, 2022
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
    • Publication number 20220246486
    • Publication date Aug 4, 2022
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTIPLE SUBSTRATE PACKAGE SYSTEMS AND RELATED METHODS
    • Publication number 20220199502
    • Publication date Jun 23, 2022
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220159853
    • Publication date May 19, 2022
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FIN FRAME ASSEMBLIES
    • Publication number 20210219448
    • Publication date Jul 15, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    SEMICONDUCTOR DEVICE ASSEMBLIES INCLUDING LOW-STRESS SPACER
    • Publication number 20210193551
    • Publication date Jun 24, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CONNECTING CLIP DESIGN FOR PRESSURE SINTERING
    • Publication number 20210090975
    • Publication date Mar 25, 2021
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE SYSTEM AND RELATED METHODS
    • Publication number 20210050272
    • Publication date Feb 18, 2021
    • Semiconductor Components Industries, LLC
    • Yushuang YAO
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20210035956
    • Publication date Feb 4, 2021
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    LOW STRESS ASYMMETRIC DUAL SIDE MODULE
    • Publication number 20210035892
    • Publication date Feb 4, 2021
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR BASEPLATES
    • Publication number 20200402887
    • Publication date Dec 24, 2020
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE WITH GUIDE PIN
    • Publication number 20200373231
    • Publication date Nov 26, 2020
    • Semiconductor Components Industries, LLC
    • Chee Hiong CHEW
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER MODULE HOUSING
    • Publication number 20200358221
    • Publication date Nov 12, 2020
    • Semiconductor Components Industries, LLC
    • Jihwan KIM
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    FIN FRAME ASSEMBLIES
    • Publication number 20200344905
    • Publication date Oct 29, 2020
    • Semiconductor Components Industries, LLC
    • Atapol PRAJUCKAMOL
    • H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR