Atsushi Maruyama

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Nagano-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 9,953,961
- Issue date Apr 24, 2018
- Fuji Electric Co., Ltd.
- Takeshi Yokoyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Connector and resin-sealed semiconductor device
- Patent number 9,252,086
- Issue date Feb 2, 2016
- Fuji Electric Co., Ltd.
- Atsushi Maruyama
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Lead frame for resin-molded semiconductor device
- Patent number 6,818,971
- Issue date Nov 16, 2004
- Fuji Electric Co., Ltd.
- Yoshinori Oda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for assembling semiconductor devices with lead frame contain...
- Patent number 5,395,800
- Issue date Mar 7, 1995
- Fuji Electric Co., Ltd.
- Atsushi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Assembly lead frame with common lead arrangement for semiconductor...
- Patent number 5,309,017
- Issue date May 3, 1994
- Fuji Electric Co., Ltd.
- Atsushi Maruyama
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
- Publication number 20150028467
- Publication date Jan 29, 2015
- Fuji Electric Co., Ltd.
- Takeshi YOKOYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CONNECTOR AND RESIN-SEALED SEMICONDUCTOR DEVICE
- Publication number 20130181334
- Publication date Jul 18, 2013
- FUJI ELECTRIC CO., LTD
- Atsushi MARUYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
JIG FOR PRINTED SUBSTRATE INSPECTION AND PRINTED SUBSTRATE INSPECTI...
- Publication number 20080218188
- Publication date Sep 11, 2008
- Shinko Electric Industries Co., Ltd.
- Koji ARAI
- G01 - MEASURING TESTING
Information Patent Application
Printed wiring board and method for fabricating the same
- Publication number 20070045847
- Publication date Mar 1, 2007
- Shinko Electric Industries Co., Ltd.
- Koji Arai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Lead frame for resin-molded semiconductor device
- Publication number 20030141579
- Publication date Jul 31, 2003
- Yoshinori Oda
- H01 - BASIC ELECTRIC ELEMENTS