Atsushi Shigeta

Person

Yokkaichi-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Processing end point detection method, polishing method, and polish...
- Patent number 10,207,390
- Issue date Feb 19, 2019
- TOSHIBA MEMORY CORPORATION
- Noburu Shimizu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing endpoint detection method
- Patent number 8,777,694
- Issue date Jul 15, 2014
- Ebara Corporation
- Shinrou Ohta
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 8,696,924
- Issue date Apr 15, 2014
- Ebara Corporation
- Mitsuo Tada
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method of organic film and method of...
- Patent number 8,685,857
- Issue date Apr 1, 2014
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing endpoint detection apparatus
- Patent number 8,568,199
- Issue date Oct 29, 2013
- Ebara Corporation
- Shinrou Ohta
- B24 - GRINDING POLISHING
Information Patent Grant
Processing end point detection method, polishing method, and polish...
- Patent number 8,554,356
- Issue date Oct 8, 2013
- Ebara Corporation
- Noburu Shimizu
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 8,506,362
- Issue date Aug 13, 2013
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate polishing apparatus
- Patent number 8,388,409
- Issue date Mar 5, 2013
- Ebara Corporation
- Hidetaka Nakao
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate treating method and substrate treating apparatus
- Patent number 8,152,598
- Issue date Apr 10, 2012
- Kabushiki Kaisha Toshiba
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Grant
Chemical mechanical polishing method and method of manufacturing se...
- Patent number 8,119,517
- Issue date Feb 21, 2012
- JSR Corporation
- Hirotaka Shida
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 8,114,776
- Issue date Feb 14, 2012
- Kabushiki Kaisha Toshiba
- Hajime Eda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method of fabricating semiconductor device
- Patent number 8,084,364
- Issue date Dec 27, 2011
- Kabushiki Kaisha Toshiba
- Shunsuke Doi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 7,767,472
- Issue date Aug 3, 2010
- Ebara Corporation
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus and polishing method
- Patent number 7,744,445
- Issue date Jun 29, 2010
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 7,700,489
- Issue date Apr 20, 2010
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Peripheral processing method and method of manufacturing a semicond...
- Patent number 7,638,439
- Issue date Dec 29, 2009
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chemical mechanical polishing method of organic film and method of...
- Patent number 7,452,819
- Issue date Nov 18, 2008
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,435,682
- Issue date Oct 14, 2008
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor device
- Patent number 7,416,942
- Issue date Aug 26, 2008
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor device
- Patent number 7,413,989
- Issue date Aug 19, 2008
- Kabushiki Kaisha Toshiba
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Grant
Method for chemically mechanically polishing organic film, method o...
- Patent number 7,402,521
- Issue date Jul 22, 2008
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing a substrate
- Patent number 7,241,205
- Issue date Jul 10, 2007
- Kabushiki Kaisha Toshiba
- Gen Toyota
- B24 - GRINDING POLISHING
Information Patent Grant
Method of processing a substrate
- Patent number 7,217,662
- Issue date May 15, 2007
- Kabushiki Kaisha Toshiba
- Gen Toyota
- B24 - GRINDING POLISHING
Information Patent Grant
Polishing apparatus
- Patent number 7,198,552
- Issue date Apr 3, 2007
- Ebara Corporation
- Toyomi Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Substrate processing method and substrate processing apparatus
- Patent number 7,014,529
- Issue date Mar 21, 2006
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Grant
Aqueous dispersion for chemical mechanical polishing, chemical mech...
- Patent number 7,005,382
- Issue date Feb 28, 2006
- JSR Corporation
- Kazuo Nishimoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus and a method of polishing and cleaning and dryi...
- Patent number 6,997,782
- Issue date Feb 14, 2006
- Ebara Corporation
- Toyomi Nishi
- B24 - GRINDING POLISHING
Information Patent Grant
Method of judging residual film by optical measurement
- Patent number 6,984,532
- Issue date Jan 10, 2006
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- G01 - MEASURING TESTING
Information Patent Grant
Method of inspecting process for manufacturing semiconductor device...
- Patent number 6,743,645
- Issue date Jun 1, 2004
- Kabushiki Kaisha Toshiba
- Takeo Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Polishing apparatus and method
- Patent number 6,500,051
- Issue date Dec 31, 2002
- Ebara Corporation
- Toyomi Nishi
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
POLISHING ENDPOINT DETECTION METHOD AND POLISHING ENDPOINT DETECTIO...
- Publication number 20140024294
- Publication date Jan 23, 2014
- Kabushiki Kaisha Toshiba
- Shinrou OHTA
- B24 - GRINDING POLISHING
Information Patent Application
PROCESSING END POINT DETECTION METHOD, POLISHING METHOD, AND POLISH...
- Publication number 20140004773
- Publication date Jan 2, 2014
- Kabushiki Kaisha Toshiba
- Noburu SHIMIZU
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20120202348
- Publication date Aug 9, 2012
- Kabushiki Kaisha Toshiba
- Mio TOMIYAMA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POLISHING ENDPOINT DETECTION METHOD AND POLISHING ENDPOINT DETECTIO...
- Publication number 20110081829
- Publication date Apr 7, 2011
- Shinrou OHTA
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20110076833
- Publication date Mar 31, 2011
- Hajime Eda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POLISHING APPARATUS AND POLISHING METHOD
- Publication number 20110003537
- Publication date Jan 6, 2011
- Dai Fukushima
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS
- Publication number 20100255757
- Publication date Oct 7, 2010
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Application
SEMICONDUCTOR MEMORY DEVICE
- Publication number 20100193850
- Publication date Aug 5, 2010
- Kabushiki Kaisha Toshiba
- Yoshiaki ASAO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE POLISHING APPARATUS
- Publication number 20100151770
- Publication date Jun 17, 2010
- Hidetaka Nakao
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF FABRICATING SEMICONDUCTOR DEVICE
- Publication number 20100015777
- Publication date Jan 21, 2010
- Kabushiki Kaisha Toshiba
- Shunsuke DOI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Processing end point detection method, polishing method,and polishi...
- Publication number 20100015889
- Publication date Jan 21, 2010
- Noburu Shimizu
- G05 - CONTROLLING REGULATING
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SE...
- Publication number 20090239373
- Publication date Sep 24, 2009
- JSR Corporation
- Hirotaka SHIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
CHEMICAL MECHANICAL POLISHING SLURRY AND SEMICONDUCTOR DEVICE MANUF...
- Publication number 20090176372
- Publication date Jul 9, 2009
- Gaku MINAMIHABA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20090156000
- Publication date Jun 18, 2009
- Yukiteru MATSUI
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS
- Publication number 20090124174
- Publication date May 14, 2009
- Dai FUKUSHIMA
- B24 - GRINDING POLISHING
Information Patent Application
Chemical mechanical polishing method of organic film and method of...
- Publication number 20090068841
- Publication date Mar 12, 2009
- Kabushiki Kaisha Toshiba
- Yukiteru Matsui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing apparatus and polishing method
- Publication number 20090017730
- Publication date Jan 15, 2009
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Application
SUBSTRATE PROCESSING METHOD
- Publication number 20080254719
- Publication date Oct 16, 2008
- Atsushi SHIGETA
- B24 - GRINDING POLISHING
Information Patent Application
Polishing method for semiconductor wafer and polishing apparatus fo...
- Publication number 20080113590
- Publication date May 15, 2008
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20070287364
- Publication date Dec 13, 2007
- Atsushi Shigeta
- B24 - GRINDING POLISHING
Information Patent Application
Peripheral processing method and method of manufacturing a semicond...
- Publication number 20070264822
- Publication date Nov 15, 2007
- Takeo Kubota
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Polishing apparatus and polishing method
- Publication number 20070239309
- Publication date Oct 11, 2007
- Mitsuo Tada
- B24 - GRINDING POLISHING
Information Patent Application
Method for manufacturing semiconductor device
- Publication number 20070224760
- Publication date Sep 27, 2007
- Yukiteru Matsui
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method of processing a substrate
- Publication number 20070178701
- Publication date Aug 2, 2007
- Kabushiki Kaisha Toshiba
- Gen Toyota
- B24 - GRINDING POLISHING
Information Patent Application
CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SE...
- Publication number 20070128874
- Publication date Jun 7, 2007
- JSR Corporation
- Hirotaka SHIDA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Methods for manufacturing semiconductor devices
- Publication number 20070111433
- Publication date May 17, 2007
- Shinichi Hirasawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for chemically mechanically polishing organic film, method o...
- Publication number 20070000872
- Publication date Jan 4, 2007
- Yukiteru Matsui
- B24 - GRINDING POLISHING
Information Patent Application
Substrate processing method and semiconductor device manufacturing...
- Publication number 20070000873
- Publication date Jan 4, 2007
- Takeo Kubota
- B24 - GRINDING POLISHING
Information Patent Application
Polishing apparatus
- Publication number 20060084369
- Publication date Apr 20, 2006
- Toyomi Nishi
- B08 - CLEANING
Information Patent Application
Substrate processing method and substrate processing apparatus
- Publication number 20060019417
- Publication date Jan 26, 2006
- Atsushi Shigeta
- B24 - GRINDING POLISHING

Atsushi Shigeta

Person

Patents Grantslast 30 patents

Processing end point detection method, polishing method, and polish...

Polishing endpoint detection method

Polishing apparatus and polishing method

Chemical mechanical polishing method of organic film and method of...

Polishing endpoint detection apparatus

Processing end point detection method, polishing method, and polish...

Polishing apparatus and polishing method

Substrate polishing apparatus

Substrate treating method and substrate treating apparatus

Chemical mechanical polishing method and method of manufacturing se...

Method of manufacturing semiconductor device

Method of fabricating semiconductor device

Substrate processing method and substrate processing apparatus

Polishing apparatus and polishing method

Method of manufacturing a semiconductor device

Peripheral processing method and method of manufacturing a semicond...

Chemical mechanical polishing method of organic film and method of...

Method of manufacturing semiconductor device

Method for manufacturing semiconductor device

Method of manufacturing semiconductor device

Method for chemically mechanically polishing organic film, method o...

Method of processing a substrate

Method of processing a substrate

Polishing apparatus

Substrate processing method and substrate processing apparatus

Aqueous dispersion for chemical mechanical polishing, chemical mech...

Polishing apparatus and a method of polishing and cleaning and dryi...

Method of judging residual film by optical measurement

Method of inspecting process for manufacturing semiconductor device...

Polishing apparatus and method

Patents Applicationslast 30 patents

POLISHING ENDPOINT DETECTION METHOD AND POLISHING ENDPOINT DETECTIO...

PROCESSING END POINT DETECTION METHOD, POLISHING METHOD, AND POLISH...

METHOD FOR FABRICATING SEMICONDUCTOR DEVICE

POLISHING ENDPOINT DETECTION METHOD AND POLISHING ENDPOINT DETECTIO...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

POLISHING APPARATUS AND POLISHING METHOD

SUBSTRATE PROCESSING METHOD AND SUBSTRATE PROCESSING APPARATUS

SEMICONDUCTOR MEMORY DEVICE

SUBSTRATE POLISHING APPARATUS

METHOD OF FABRICATING SEMICONDUCTOR DEVICE

Processing end point detection method, polishing method,and polishi...

CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SE...

CHEMICAL MECHANICAL POLISHING SLURRY AND SEMICONDUCTOR DEVICE MANUF...

METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

SUBSTRATE TREATING METHOD AND SUBSTRATE TREATING APPARATUS

Chemical mechanical polishing method of organic film and method of...

Polishing apparatus and polishing method

SUBSTRATE PROCESSING METHOD

Polishing method for semiconductor wafer and polishing apparatus fo...

Substrate processing method and substrate processing apparatus

Peripheral processing method and method of manufacturing a semicond...

Polishing apparatus and polishing method

Method for manufacturing semiconductor device

Method of processing a substrate

CHEMICAL MECHANICAL POLISHING METHOD AND METHOD OF MANUFACTURING SE...

Methods for manufacturing semiconductor devices

Method for chemically mechanically polishing organic film, method o...

Substrate processing method and semiconductor device manufacturing...

Polishing apparatus

Substrate processing method and substrate processing apparatus