Bai-Yao Lou

Person

Taipei City, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Passive component structure and manufacturing method thereof
- Patent number 9,761,555
- Issue date Sep 12, 2017
- Xintec Inc.
- Jiun-Yen Lai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,449,897
- Issue date Sep 20, 2016
- Xintec Inc.
- Bai-Yao Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 9,293,394
- Issue date Mar 22, 2016
- Xintec Inc.
- Bai-Yao Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module and the method of packaging the same
- Patent number 9,088,206
- Issue date Jul 21, 2015
- Ho-Yin Yiu
- H02 - GENERATION CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
Information Patent Grant
Wafer packaging method
- Patent number 9,023,676
- Issue date May 5, 2015
- Xintec Inc.
- Chih-Hao Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Capacitive coupler packaging structure
- Patent number 8,791,768
- Issue date Jul 29, 2014
- Ho-Yin Yiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 8,778,798
- Issue date Jul 15, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,742,564
- Issue date Jun 3, 2014
- Bai-Yao Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and fabrication method thereof
- Patent number 8,710,680
- Issue date Apr 29, 2014
- Shu-Ming Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package
- Patent number 8,604,578
- Issue date Dec 10, 2013
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package and method for fabricating the same
- Patent number 8,541,877
- Issue date Sep 24, 2013
- Chia-Lun Tsai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for forming the same
- Patent number 8,431,946
- Issue date Apr 30, 2013
- Hsin-Chih Chiu
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Chip package
- Patent number 8,384,174
- Issue date Feb 26, 2013
- Hsin-Chih Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package and method for fabricating the same
- Patent number 8,207,615
- Issue date Jun 26, 2012
- Bai-Yao Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and fabrication methods thereof
- Patent number 7,888,236
- Issue date Feb 15, 2011
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BUMP STRUCTURE HAVING FIRST PORTION OF COPPER AND SECOND PORTION OF...
- Publication number 20170179058
- Publication date Jun 22, 2017
- LITE-ON SEMICONDUCTOR CORPORATION
- Bai-Yao Lou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20160380024
- Publication date Dec 29, 2016
- XINTEC INC.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PASSIVE COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF
- Publication number 20150214162
- Publication date Jul 30, 2015
- XINTEC INC.
- Jiun-Yen LAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140252642
- Publication date Sep 11, 2014
- Xintec Inc.
- Bai-Yao LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20140231966
- Publication date Aug 21, 2014
- Xintec Inc.
- Bai-Yao LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WAFER PACKAGING METHOD
- Publication number 20140213010
- Publication date Jul 31, 2014
- XINTEC INC.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20140193950
- Publication date Jul 10, 2014
- Xintec Inc.
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF
- Publication number 20140191350
- Publication date Jul 10, 2014
- XINTEC INC.
- Chih-Hao CHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE AND THE METHOD OF PACKAGING THE SAME
- Publication number 20120194148
- Publication date Aug 2, 2012
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CAPACITIVE COUPLER PACKAGING STRUCTURE
- Publication number 20120194301
- Publication date Aug 2, 2012
- Ho-Yin YIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20120181672
- Publication date Jul 19, 2012
- Bai-Yao LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20120097999
- Publication date Apr 26, 2012
- Hsin-Chih CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FORMING THE SAME
- Publication number 20110291139
- Publication date Dec 1, 2011
- Hsin-Chih CHIU
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20110233782
- Publication date Sep 29, 2011
- Shu-Ming CHANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE
- Publication number 20110233770
- Publication date Sep 29, 2011
- Hsin-Chih CHIU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110175236
- Publication date Jul 21, 2011
- Bai-Yao LOU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME
- Publication number 20110140267
- Publication date Jun 16, 2011
- Chia-Lun TSAI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and fabrication methods thereof
- Publication number 20080286938
- Publication date Nov 20, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Han-Ping Pu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with protection structure against damage during...
- Publication number 20060125059
- Publication date Jun 15, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Wei Chen
- H01 - BASIC ELECTRIC ELEMENTS

Bai-Yao Lou

Person

Patents Grantslast 30 patents

Passive component structure and manufacturing method thereof

Chip package and method for forming the same

Chip package and method for forming the same

Power module and the method of packaging the same

Wafer packaging method

Capacitive coupler packaging structure

Electronic device package and fabrication method thereof

Chip package and method for forming the same

Electronic device package and fabrication method thereof

Chip package

Electronic device package and method for fabricating the same

Chip package and method for forming the same

Chip package

Chip package and method for fabricating the same

Semiconductor device and fabrication methods thereof

Patents Applicationslast 30 patents

BUMP STRUCTURE HAVING FIRST PORTION OF COPPER AND SECOND PORTION OF...

IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF

PASSIVE COMPONENT STRUCTURE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

WAFER PACKAGING METHOD

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

IMAGE SENSOR CHIP PACKAGE AND FABRICATING METHOD THEREOF

POWER MODULE AND THE METHOD OF PACKAGING THE SAME

CAPACITIVE COUPLER PACKAGING STRUCTURE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FORMING THE SAME

ELECTRONIC DEVICE PACKAGE AND FABRICATION METHOD THEREOF

CHIP PACKAGE

CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME

ELECTRONIC DEVICE PACKAGE AND METHOD FOR FABRICATING THE SAME

Semiconductor device and fabrication methods thereof

Semiconductor wafer with protection structure against damage during...