Balasubramanian Sivagnanam

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Singapore, SG

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Patents Grantslast 30 patents

Information Patent Grant
Die pillar structures and a method of their formation
- Patent number 7,462,942
- Issue date Dec 9, 2008
- Advanpack Solutions PTE LTD
- Kim Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
THERMAL BONDING PROCESS FOR CHIP PACKAGING
- Publication number 20080248610
- Publication date Oct 9, 2008
- Advanpack Solutions Pte Ltd
- Hwee Seng Chew
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pillar structures
- Publication number 20050077624
- Publication date Apr 14, 2005
- Advanpack Solutions Pte. Ltd.
- Kim Hwee Tan
- H01 - BASIC ELECTRIC ELEMENTS