Banerjee Koushik

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Heat spreader and stiffener having a stiffener extension
- Patent number 7,045,890
- Issue date May 16, 2006
- Intel Corporation
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for polygonal heat slug
- Patent number 6,459,563
- Issue date Oct 1, 2002
- Intel Corporation
- Robert J. Chroneos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,440,770
- Issue date Aug 27, 2002
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallization removal under the laser mark area for substrates
- Patent number 6,403,891
- Issue date Jun 11, 2002
- Intel Corporation
- Koushik Banerjee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Heat slug design which facilitates mounting of discrete components...
- Patent number 6,256,189
- Issue date Jul 3, 2001
- Intel Corporation
- Robert J. Chroneos
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad functional layout on die to improve package manufacturabil...
- Patent number 6,214,638
- Issue date Apr 10, 2001
- Intle Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package which contains two in plane voltage buss...
- Patent number 6,043,559
- Issue date Mar 28, 2000
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit package
- Patent number 6,031,283
- Issue date Feb 29, 2000
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Thermal bus bar design for an electronic cartridge
- Patent number 5,990,549
- Issue date Nov 23, 1999
- Intel Corporation
- Chia-Pin Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bond pad functional layout on die to improve package manufacturabil...
- Patent number 5,895,977
- Issue date Apr 20, 1999
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Design for mounting discrete components inside an integrated circui...
- Patent number 5,811,880
- Issue date Sep 22, 1998
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for plating a bond finger of an intergrated circuit package
- Patent number 5,787,575
- Issue date Aug 4, 1998
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Staggered bond finger design for fine pitch integrated circuit pack...
- Patent number 5,734,559
- Issue date Mar 31, 1998
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structure of a thermally and electrically enhanced plastic ball gri...
- Patent number 5,557,502
- Issue date Sep 17, 1996
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
An electronic package that has a die coupled to a lead frame by a d...
- Patent number 5,444,602
- Issue date Aug 22, 1995
- Intel Corporation
- Koushik Banerjee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus of coupling a die to a lead frame with a tape...
- Patent number 5,345,363
- Issue date Sep 6, 1994
- Intel Corporation
- Bidyut Bhattacharyya
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Arrangements to increase structural rigidity of semiconductor package
- Publication number 20030062618
- Publication date Apr 3, 2003
- Hong Xie
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus for polygonal heat slug
- Publication number 20020023766
- Publication date Feb 28, 2002
- Robert J. Chroneos
- H01 - BASIC ELECTRIC ELEMENTS

Banerjee Koushik

Person

Patents Grantslast 30 patents

Heat spreader and stiffener having a stiffener extension

Method and apparatus for polygonal heat slug

Integrated circuit package

Metallization removal under the laser mark area for substrates

Heat slug design which facilitates mounting of discrete components...

Bond pad functional layout on die to improve package manufacturabil...

Integrated circuit package which contains two in plane voltage buss...

Integrated circuit package

Thermal bus bar design for an electronic cartridge

Bond pad functional layout on die to improve package manufacturabil...

Design for mounting discrete components inside an integrated circui...

Method for plating a bond finger of an intergrated circuit package

Staggered bond finger design for fine pitch integrated circuit pack...

Structure of a thermally and electrically enhanced plastic ball gri...

An electronic package that has a die coupled to a lead frame by a d...

Method and apparatus of coupling a die to a lead frame with a tape...

Patents Applicationslast 30 patents

Arrangements to increase structural rigidity of semiconductor package

Method and apparatus for polygonal heat slug