Baosuo Zhou

Person

Boise, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Block-to-block isolation and deep contact using pillars in a memory...
- Patent number 12,120,878
- Issue date Oct 15, 2024
- Intel Corporation
- Deepak Thimmegowda
- G11 - INFORMATION STORAGE
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 11,935,756
- Issue date Mar 19, 2024
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 11,335,563
- Issue date May 17, 2022
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt etch back
- Patent number 10,784,086
- Issue date Sep 22, 2020
- Lam Research Corporation
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 10,607,844
- Issue date Mar 31, 2020
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 10,096,483
- Issue date Oct 9, 2018
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cobalt etch back
- Patent number 9,870,899
- Issue date Jan 16, 2018
- Lam Research Corporation
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 9,761,457
- Issue date Sep 12, 2017
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integrated circuit fabrication with protective coating...
- Patent number 9,679,781
- Issue date Jun 13, 2017
- Micron Technology, Inc.
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of planarizing an upper surface of a semiconductor substrate...
- Patent number 9,589,853
- Issue date Mar 7, 2017
- Lam Research Corporation
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to etch copper barrier film
- Patent number 9,570,320
- Issue date Feb 14, 2017
- Lam Research Corporation
- Meihua Shen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming patterns on substrates
- Patent number 9,330,934
- Issue date May 3, 2016
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 9,305,782
- Issue date Apr 5, 2016
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified pitch doubling process flow
- Patent number 9,184,159
- Issue date Nov 10, 2015
- Micron Technology, Inc.
- Ardavan Niroomand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integrated circuit fabrication with protective coating...
- Patent number 9,003,651
- Issue date Apr 14, 2015
- Micron Technology, Inc.
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a plurality of spaced features
- Patent number 8,980,752
- Issue date Mar 17, 2015
- Micron Technology, Inc.
- Farrell Good
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming high density patterns
- Patent number 8,871,648
- Issue date Oct 28, 2014
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pitch reduction technology using alternating spacer depositions dur...
- Patent number 8,852,851
- Issue date Oct 7, 2014
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to reduce the critical dimension of semiconductor devices a...
- Patent number 8,836,083
- Issue date Sep 16, 2014
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of patterning a material
- Patent number 8,530,352
- Issue date Sep 10, 2013
- Micron Technology, Inc.
- Vishal Sipani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a plurality of spaced features
- Patent number 8,492,278
- Issue date Jul 23, 2013
- Micron Technology, Inc.
- Farrell Good
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for integrated circuit fabrication with protective coating...
- Patent number 8,479,384
- Issue date Jul 9, 2013
- Micron Technology, Inc.
- Mirzafer Abatchev
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of patterning materials
- Patent number 8,389,407
- Issue date Mar 5, 2013
- Micron Technology, Inc.
- Vishal Sipani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods to reduce the critical dimension of semiconductor devices a...
- Patent number 8,338,304
- Issue date Dec 25, 2012
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified pitch doubling process flow
- Patent number 8,338,959
- Issue date Dec 25, 2012
- Micron Technology, Inc.
- Ardavan Niroomand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming high density patterns
- Patent number 8,324,107
- Issue date Dec 4, 2012
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming openings
- Patent number 8,216,939
- Issue date Jul 10, 2012
- Micron Technology, Inc.
- Vishal Sipani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Simplified pitch doubling process flow
- Patent number 8,030,217
- Issue date Oct 4, 2011
- Micron Technology, Inc.
- Ardavan Niroomand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming and planarizing adjacent regions of an integrate...
- Patent number 8,011,090
- Issue date Sep 6, 2011
- Micron Technology, Inc.
- Mirzafer Abatchev
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Trim process for critical dimension control for integrated circuits
- Patent number 7,910,483
- Issue date Mar 22, 2011
- Micron Technology, Inc.
- Mirzafer K Abatchev
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
BLOCK-TO-BLOCK ISOLATION AND DEEP CONTACT USING PILLARS IN A MEMORY...
- Publication number 20230036595
- Publication date Feb 2, 2023
- Intel Corporation
- Deepak THIMMEGOWDA
- G11 - INFORMATION STORAGE
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20220254644
- Publication date Aug 11, 2022
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20200203171
- Publication date Jun 25, 2020
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20180286693
- Publication date Oct 4, 2018
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT ETCH BACK
- Publication number 20180102236
- Publication date Apr 12, 2018
- LAM RESEARCH CORPORATION
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20170372913
- Publication date Dec 28, 2017
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
COBALT ETCH BACK
- Publication number 20160314985
- Publication date Oct 27, 2016
- LAM RESEARCH CORPORATION
- Jialing Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20160203993
- Publication date Jul 14, 2016
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NOVEL METHOD TO ETCH COPPER BARRIER FILM
- Publication number 20160104630
- Publication date Apr 14, 2016
- LAM RESEARCH CORPORATION
- Meihua SHEN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATED CIRCUIT FABRICATION WITH PROTECTIVE COATING...
- Publication number 20150287610
- Publication date Oct 8, 2015
- Micron Technology, Inc.
- MIRZAFER ABATCHEV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...
- Publication number 20150249016
- Publication date Sep 3, 2015
- LAM RESEARCH CORPORATION
- Monica Titus
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Pitch Reduction Technology Using Alternating Spacer Depositions Dur...
- Publication number 20150021744
- Publication date Jan 22, 2015
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Plurality of Spaced Features
- Publication number 20130309858
- Publication date Nov 21, 2013
- Micron Technology, Inc.
- Farrell Good
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR INTEGRATED CIRCUIT FABRICATION WITH PROTECTIVE COATING...
- Publication number 20130295770
- Publication date Nov 7, 2013
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Openings And Methods Of Patterning A Material
- Publication number 20130164944
- Publication date Jun 27, 2013
- Micron Technology, Inc.
- Vishal Sipani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLIFIED PITCH DOUBLING PROCESS FLOW
- Publication number 20130105937
- Publication date May 2, 2013
- Micron Technology, Inc.
- Ardavan Niroomand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING HIGH DENSITY PATTERNS
- Publication number 20130089977
- Publication date Apr 11, 2013
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO REDUCE THE CRITICAL DIMENSION OF SEMICONDUCTOR DEVICES A...
- Publication number 20130009283
- Publication date Jan 10, 2013
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Patterning Materials
- Publication number 20120244708
- Publication date Sep 27, 2012
- Micron Technology, Inc.
- Vishal Sipani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Openings And Methods Of Patterning A Material
- Publication number 20120045896
- Publication date Feb 23, 2012
- Vishal Sipani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLIFIED PITCH DOUBLING PROCESS FLOW
- Publication number 20110316114
- Publication date Dec 29, 2011
- Micron Technology, Inc.
- Ardavan Niroomand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE COATING FOR PLANARIZATION
- Publication number 20110294294
- Publication date Dec 1, 2011
- Micron Technology, Inc.
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method Of Forming A Plurality Of Spaced Features
- Publication number 20110244674
- Publication date Oct 6, 2011
- Farrell Good
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS TO REDUCE THE CRITICAL DIMENSION OF SEMICONDUCTOR DEVICES A...
- Publication number 20110006402
- Publication date Jan 13, 2011
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods Of Forming Patterns On Substrates
- Publication number 20100291771
- Publication date Nov 18, 2010
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SIMPLIFIED PITCH DOUBLING PROCESS FLOW
- Publication number 20100216307
- Publication date Aug 26, 2010
- Micron Technology, Inc.
- Ardavan Niroomand
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRIM PROCESS FOR CRITICAL DIMENSION CONTROL FOR INTEGRATED CIRCUITS
- Publication number 20100173498
- Publication date Jul 8, 2010
- Micron Technology, Inc.
- Mirzafer K. Abatchev
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING HIGH DENSITY PATTERNS
- Publication number 20100112818
- Publication date May 6, 2010
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING HIGH DENSITY PATTERNS
- Publication number 20090149026
- Publication date Jun 11, 2009
- Micron Technology, Inc.
- Baosuo Zhou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROTECTIVE COATING FOR PLANARIZATION
- Publication number 20080261349
- Publication date Oct 23, 2008
- Micron Technology, Inc.
- Mirzafer Abatchev
- H01 - BASIC ELECTRIC ELEMENTS

Baosuo Zhou

Person

Patents Grantslast 30 patents

Block-to-block isolation and deep contact using pillars in a memory...

Pitch reduction technology using alternating spacer depositions dur...

Pitch reduction technology using alternating spacer depositions dur...

Cobalt etch back

Pitch reduction technology using alternating spacer depositions dur...

Pitch reduction technology using alternating spacer depositions dur...

Cobalt etch back

Pitch reduction technology using alternating spacer depositions dur...

Methods for integrated circuit fabrication with protective coating...

Method of planarizing an upper surface of a semiconductor substrate...

Method to etch copper barrier film

Methods of forming patterns on substrates

Pitch reduction technology using alternating spacer depositions dur...

Simplified pitch doubling process flow

Methods for integrated circuit fabrication with protective coating...

Method of forming a plurality of spaced features

Method for forming high density patterns

Pitch reduction technology using alternating spacer depositions dur...

Methods to reduce the critical dimension of semiconductor devices a...

Methods of patterning a material

Method of forming a plurality of spaced features

Methods for integrated circuit fabrication with protective coating...

Methods of patterning materials

Methods to reduce the critical dimension of semiconductor devices a...

Simplified pitch doubling process flow

Method for forming high density patterns

Methods of forming openings

Simplified pitch doubling process flow

Method for forming and planarizing adjacent regions of an integrate...

Trim process for critical dimension control for integrated circuits

Patents Applicationslast 30 patents

BLOCK-TO-BLOCK ISOLATION AND DEEP CONTACT USING PILLARS IN A MEMORY...

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

COBALT ETCH BACK

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

COBALT ETCH BACK

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

NOVEL METHOD TO ETCH COPPER BARRIER FILM

METHODS FOR INTEGRATED CIRCUIT FABRICATION WITH PROTECTIVE COATING...

METHOD OF PLANARIZING AN UPPER SURFACE OF A SEMICONDUCTOR SUBSTRATE...

Pitch Reduction Technology Using Alternating Spacer Depositions Dur...

Method of Forming a Plurality of Spaced Features

METHODS FOR INTEGRATED CIRCUIT FABRICATION WITH PROTECTIVE COATING...

Methods Of Forming Openings And Methods Of Patterning A Material

SIMPLIFIED PITCH DOUBLING PROCESS FLOW

METHOD FOR FORMING HIGH DENSITY PATTERNS

METHODS TO REDUCE THE CRITICAL DIMENSION OF SEMICONDUCTOR DEVICES A...

Methods Of Patterning Materials

Methods Of Forming Openings And Methods Of Patterning A Material

SIMPLIFIED PITCH DOUBLING PROCESS FLOW

PROTECTIVE COATING FOR PLANARIZATION

Method Of Forming A Plurality Of Spaced Features

METHODS TO REDUCE THE CRITICAL DIMENSION OF SEMICONDUCTOR DEVICES A...

Methods Of Forming Patterns On Substrates

SIMPLIFIED PITCH DOUBLING PROCESS FLOW

TRIM PROCESS FOR CRITICAL DIMENSION CONTROL FOR INTEGRATED CIRCUITS

METHOD FOR FORMING HIGH DENSITY PATTERNS

METHOD FOR FORMING HIGH DENSITY PATTERNS

PROTECTIVE COATING FOR PLANARIZATION