BAOZHEN LI

Person

South Burlington, VT, US

People

Patents Grantslast 30 patents

Information Patent Grant
Long channel and short channel vertical FET co-integration for vert...
- Patent number 12,062,657
- Issue date Aug 13, 2024
- International Business Machines Corporation
- Terence B. Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal-insulator-metal capacitor structure supporting different volt...
- Patent number 11,908,888
- Issue date Feb 20, 2024
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
RRAM structures in the BEOL
- Patent number 11,877,458
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Baozhen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,875,987
- Issue date Jan 16, 2024
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MIM capacitor structures
- Patent number 11,688,680
- Issue date Jun 27, 2023
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Three-dimensional metal-insulator-metal capacitor embedded in seal...
- Patent number 11,676,892
- Issue date Jun 13, 2023
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of phase change memory cell in integrated circuit
- Patent number 11,647,681
- Issue date May 9, 2023
- International Business Machines Corporation
- Baozhen Li
Information Patent Grant
Reliable resistive random access memory
- Patent number 11,489,118
- Issue date Nov 1, 2022
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Footing flare pedestal structure
- Patent number 11,302,639
- Issue date Apr 12, 2022
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and memory structures formed in the BEOL
- Patent number 11,282,788
- Issue date Mar 22, 2022
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Switchable metal insulator metal capacitor
- Patent number 11,276,748
- Issue date Mar 15, 2022
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
E-fuse co-processed with MIM capacitor
- Patent number 11,257,750
- Issue date Feb 22, 2022
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Long channel and short channel vertical FET co-integration for vert...
- Patent number 11,251,179
- Issue date Feb 15, 2022
- International Business Machines Corporation
- Terence B. Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
On integrated circuit (IC) device simultaneously formed capacitor a...
- Patent number 11,244,850
- Issue date Feb 8, 2022
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom conductive structure with a limited top contact area
- Patent number 11,239,278
- Issue date Feb 1, 2022
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhancement of iso-via reliability
- Patent number 11,227,796
- Issue date Jan 18, 2022
- ELPIS TECHNOLOGIES INC.
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect architecture with enhanced reliability
- Patent number 11,205,588
- Issue date Dec 21, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bilayer barrier for interconnect and memory structures formed in th...
- Patent number 11,195,751
- Issue date Dec 7, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded small via anti-fuse device
- Patent number 11,177,213
- Issue date Nov 16, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalization repair in semiconductor wafers
- Patent number 11,171,064
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metalization repair in semiconductor wafers
- Patent number 11,171,063
- Issue date Nov 9, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnect and memory structures having reduced topography variat...
- Patent number 11,164,878
- Issue date Nov 2, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical fuse with metal line migration
- Patent number 11,152,300
- Issue date Oct 19, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor via structure with lower electrical resistance
- Patent number 11,145,543
- Issue date Oct 12, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated circuit (IC) device integral capacitor and anti-fuse
- Patent number 11,145,591
- Issue date Oct 12, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bottom electrode structure and method of forming the same
- Patent number 11,133,462
- Issue date Sep 28, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sub-ground rule e-Fuse structure
- Patent number 11,121,082
- Issue date Sep 14, 2021
- International Business Machines Corporation
- Andrew T. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EFuse structure with multiple links
- Patent number 11,101,213
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electromigration test structures for void localization
- Patent number 11,099,230
- Issue date Aug 24, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Contacts having a geometry to reduce resistance
- Patent number 11,062,993
- Issue date Jul 13, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SHORT CIRCUIT DETECTION IN A READ/WRITE ASSIST CAPACITOR OF A MEMORY
- Publication number 20240355382
- Publication date Oct 24, 2024
- International Business Machines Corporation
- Noam Jungmann
- G11 - INFORMATION STORAGE
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR EMBEDDED IN SEAL...
- Publication number 20230231707
- Publication date Jul 20, 2023
- International Business Machines Corporation
- Baozhen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR EMBEDDED IN SEAL...
- Publication number 20230084798
- Publication date Mar 16, 2023
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MIM CAPACITOR STRUCTURES
- Publication number 20220139820
- Publication date May 5, 2022
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LONG CHANNEL AND SHORT CHANNEL VERTICAL FET CO-INTEGRATION FOR VERT...
- Publication number 20220139909
- Publication date May 5, 2022
- International Business Machines Corporation
- Terence B. Hook
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON INTEGRATED CIRCUIT (IC) DEVICE CAPACITOR BETWEEN METAL LINES
- Publication number 20210287984
- Publication date Sep 16, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RRAM STRUCTURES IN THE BEOL
- Publication number 20210280638
- Publication date Sep 9, 2021
- International Business Machines Corporation
- Baozhen Li
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
CONTACTS HAVING A GEOMETRY TO REDUCE RESISTANCE
- Publication number 20210272902
- Publication date Sep 2, 2021
- International Business Machines Corporation
- Lawrence A. Clevenger
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID INTERCONNECT WITH A RELIABILITY LINER IN WIDE FEATURES
- Publication number 20210257299
- Publication date Aug 19, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
E-FUSE CO-PROCESSED WITH MIM CAPACITOR
- Publication number 20210249348
- Publication date Aug 12, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT AND MEMORY STRUCTURES HAVING REDUCED TOPOGRAPHY VARIAT...
- Publication number 20210242216
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM CONDUCTIVE STRUCTURE WITH A LIMITED TOP CONTACT AREA
- Publication number 20210242278
- Publication date Aug 5, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED SMALL VIA ANTI-FUSE DEVICE
- Publication number 20210233843
- Publication date Jul 29, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EFUSE STRUCTURE WITH MULTIPLE LINKS
- Publication number 20210233844
- Publication date Jul 29, 2021
- International Business Machines Corporation
- BAOZHEN LI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOOTING FLARE PEDESTAL STRUCTURE
- Publication number 20210225774
- Publication date Jul 22, 2021
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ON INTEGRATED CIRCUIT (IC) DEVICE SIMULTANEOUSLY FORMED CAPACITOR A...
- Publication number 20210151345
- Publication date May 20, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED CIRCUIT (IC) DEVICE INTEGRAL CAPACITOR AND ANTI-FUSE
- Publication number 20210151373
- Publication date May 20, 2021
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BILAYER BARRIER FOR INTERCONNECT AND MEMORY STRUCTURES FORMED IN TH...
- Publication number 20210082751
- Publication date Mar 18, 2021
- International Business Machines Corporation
- Chih-Chao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SWITCHABLE METAL INSULATOR METAL CAPACITOR
- Publication number 20210036096
- Publication date Feb 4, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT AND MEMORY STRUCTURES FORMED IN THE BEOL
- Publication number 20210028107
- Publication date Jan 28, 2021
- International Business Machines Corporation
- Chih-Chao YANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF PHASE CHANGE MEMORY CELL IN INTEGRATED CIRCUIT
- Publication number 20210020836
- Publication date Jan 21, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECT ARCHITECTURE WITH ENHANCED RELIABILITY
- Publication number 20210013097
- Publication date Jan 14, 2021
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BEOL ELECTRICAL FUSE AND METHOD OF FORMING THE SAME
- Publication number 20200402907
- Publication date Dec 24, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BACK END OF LINE (BEOL) TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB)...
- Publication number 20200395294
- Publication date Dec 17, 2020
- International Business Machines Corporation
- Jim Shih-Chun Liang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BOTTOM ELECTRODE STRUCTURE AND METHOD OF FORMING THE SAME
- Publication number 20200388757
- Publication date Dec 10, 2020
- International Business Machines Corporation
- Chih-Chao Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUB-GROUND RULE E-FUSE STRUCTURE
- Publication number 20200335440
- Publication date Oct 22, 2020
- International Business Machines Corporation
- Andrew T. Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATION OF PHASE CHANGE MEMORY CELL IN INTEGRATED CIRCUIT
- Publication number 20200295261
- Publication date Sep 17, 2020
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FABRICATING VIAS WITH LOWER RESISTANCE
- Publication number 20200286780
- Publication date Sep 10, 2020
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RELIABLE RESISTIVE RANDOM ACCESS MEMORY
- Publication number 20200287136
- Publication date Sep 10, 2020
- International Business Machines Corporation
- Baozhen Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CIRCULAR RING SHAPED ANTIFUSE DEVICE
- Publication number 20200219811
- Publication date Jul 9, 2020
- International Business Machines Corporation
- Chih-Chao YANG
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Long channel and short channel vertical FET co-integration for vert...

Metal-insulator-metal capacitor structure supporting different volt...

RRAM structures in the BEOL

Contacts having a geometry to reduce resistance

MIM capacitor structures

Three-dimensional metal-insulator-metal capacitor embedded in seal...

Fabrication of phase change memory cell in integrated circuit

Reliable resistive random access memory

Footing flare pedestal structure

Interconnect and memory structures formed in the BEOL

Switchable metal insulator metal capacitor

E-fuse co-processed with MIM capacitor

Long channel and short channel vertical FET co-integration for vert...

On integrated circuit (IC) device simultaneously formed capacitor a...

Bottom conductive structure with a limited top contact area

Enhancement of iso-via reliability

Interconnect architecture with enhanced reliability

Bilayer barrier for interconnect and memory structures formed in th...

Embedded small via anti-fuse device

Metalization repair in semiconductor wafers

Metalization repair in semiconductor wafers

Interconnect and memory structures having reduced topography variat...

Electrical fuse with metal line migration

Semiconductor via structure with lower electrical resistance

Integrated circuit (IC) device integral capacitor and anti-fuse

Bottom electrode structure and method of forming the same

Sub-ground rule e-Fuse structure

EFuse structure with multiple links

Electromigration test structures for void localization

Contacts having a geometry to reduce resistance

Patents Applicationslast 30 patents

SHORT CIRCUIT DETECTION IN A READ/WRITE ASSIST CAPACITOR OF A MEMORY

THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR EMBEDDED IN SEAL...

THREE-DIMENSIONAL METAL-INSULATOR-METAL CAPACITOR EMBEDDED IN SEAL...

MIM CAPACITOR STRUCTURES

LONG CHANNEL AND SHORT CHANNEL VERTICAL FET CO-INTEGRATION FOR VERT...

ON INTEGRATED CIRCUIT (IC) DEVICE CAPACITOR BETWEEN METAL LINES

RRAM STRUCTURES IN THE BEOL

CONTACTS HAVING A GEOMETRY TO REDUCE RESISTANCE

HYBRID INTERCONNECT WITH A RELIABILITY LINER IN WIDE FEATURES

E-FUSE CO-PROCESSED WITH MIM CAPACITOR

INTERCONNECT AND MEMORY STRUCTURES HAVING REDUCED TOPOGRAPHY VARIAT...

BOTTOM CONDUCTIVE STRUCTURE WITH A LIMITED TOP CONTACT AREA

EMBEDDED SMALL VIA ANTI-FUSE DEVICE

EFUSE STRUCTURE WITH MULTIPLE LINKS

FOOTING FLARE PEDESTAL STRUCTURE

ON INTEGRATED CIRCUIT (IC) DEVICE SIMULTANEOUSLY FORMED CAPACITOR A...

INTEGRATED CIRCUIT (IC) DEVICE INTEGRAL CAPACITOR AND ANTI-FUSE

BILAYER BARRIER FOR INTERCONNECT AND MEMORY STRUCTURES FORMED IN TH...

SWITCHABLE METAL INSULATOR METAL CAPACITOR

INTERCONNECT AND MEMORY STRUCTURES FORMED IN THE BEOL

FABRICATION OF PHASE CHANGE MEMORY CELL IN INTEGRATED CIRCUIT

INTERCONNECT ARCHITECTURE WITH ENHANCED RELIABILITY

BEOL ELECTRICAL FUSE AND METHOD OF FORMING THE SAME

BACK END OF LINE (BEOL) TIME DEPENDENT DIELECTRIC BREAKDOWN (TDDB)...

BOTTOM ELECTRODE STRUCTURE AND METHOD OF FORMING THE SAME

SUB-GROUND RULE E-FUSE STRUCTURE

FABRICATION OF PHASE CHANGE MEMORY CELL IN INTEGRATED CIRCUIT

FABRICATING VIAS WITH LOWER RESISTANCE

RELIABLE RESISTIVE RANDOM ACCESS MEMORY

CIRCULAR RING SHAPED ANTIFUSE DEVICE