Barrett M. Faneuf

Person

Lakewood, WA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Jam for integration reliability of ruler form factor component
- Patent number 12,160,971
- Issue date Dec 3, 2024
- Intel Corporation
- Kristin L. Weldon
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 12,131,977
- Issue date Oct 29, 2024
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Electronic systems with inverted circuit board with heat sink to ch...
- Patent number 11,842,943
- Issue date Dec 12, 2023
- Intel Corporation
- Barrett M. Faneuf
- G11 - INFORMATION STORAGE
Information Patent Grant
Liquid coolant based thermal energy management for containers recei...
- Patent number 11,266,043
- Issue date Mar 1, 2022
- Intel Corporation
- Annie Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
System to reduce coolant use in an array of circuit boards
- Patent number 11,184,997
- Issue date Nov 23, 2021
- Intel Corporation
- Joseph Andrew Broderick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Mechanism with folded wrapping to seal components immersed in coolant
- Patent number 10,945,353
- Issue date Mar 9, 2021
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Expansion card having synergistic cooling, structural and volume re...
- Patent number 9,606,589
- Issue date Mar 28, 2017
- Intel Corporation
- Mark J. Gallina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Modular capillary pumped loop cooling system
- Patent number 7,770,630
- Issue date Aug 10, 2010
- Intel Corporation
- Jason B. Chesser
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Frame-level thermal interface component for transfer of heat from a...
- Patent number 7,233,491
- Issue date Jun 19, 2007
- Intel Corporation
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Systems to cool multiple electrical components
- Patent number 7,149,086
- Issue date Dec 12, 2006
- Intel Corporation
- Barrett Faneuf
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Frame-level thermal interface component for transfer of heat from a...
- Patent number 7,133,283
- Issue date Nov 7, 2006
- Intel Corporation
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Baffles for high capacity air-cooling systems for electronics appar...
- Patent number 7,079,388
- Issue date Jul 18, 2006
- Intel Corporation
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Modular capillary pumped loop cooling system
- Patent number 6,981,543
- Issue date Jan 3, 2006
- Intel Corporation
- Jason B. Chesser
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Electronics rack assemblies and associated components
- Patent number 6,839,237
- Issue date Jan 4, 2005
- Intel Corporation
- William E. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer system having a plurality of server units transferring hea...
- Patent number 6,836,407
- Issue date Dec 28, 2004
- Intel Corporation
- Barrett M. Faneuf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
High capacity air-cooling systems for electronic apparatus and asso...
- Patent number 6,813,149
- Issue date Nov 2, 2004
- Intel Corporation
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Computer system having a chassis-level capillary pump loop transfer...
- Patent number 6,776,221
- Issue date Aug 17, 2004
- Intel Corporation
- Stephen W. Montgomery
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Cooling method and apparatus for handheld devices
- Patent number 6,741,465
- Issue date May 25, 2004
- Intel Corporation
- Ven R. Holalkere
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer system which locks a server unit subassembly in a selected...
- Patent number 6,700,785
- Issue date Mar 2, 2004
- Intel Corporation
- William E. Berry
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Computer system having a chassis-level thermal interface component...
- Patent number 6,693,797
- Issue date Feb 17, 2004
- Intel Corporation
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chassis-level thermal interface component for transfer of heat from...
- Patent number 6,643,132
- Issue date Nov 4, 2003
- Intel Corporation
- Barrett M. Faneuf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Rack-mounted server and associated methods
- Patent number 6,560,114
- Issue date May 6, 2003
- Intel Corporation
- William E. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20240063082
- Publication date Feb 22, 2024
- Intel Corporation
- Barrett M. Faneuf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS
- Publication number 20220196507
- Publication date Jun 23, 2022
- Intel Corporation
- Prabhakar SUBRAHMANYAM
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
JAM FOR INTEGRATION RELIABILITY OF RULER FORM FACTOR COMPONENT
- Publication number 20210084787
- Publication date Mar 18, 2021
- Intel Corporation
- Kristin L. WELDON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...
- Publication number 20210043537
- Publication date Feb 11, 2021
- Intel Corporation
- Barrett M. FANEUF
- G11 - INFORMATION STORAGE
Information Patent Application
MECHANISM WITH FOLDED WRAPPING TO SEAL COMPONENTS IMMERSED IN COOLANT
- Publication number 20190090344
- Publication date Mar 21, 2019
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLANT BASED THERMAL ENERGY MANAGEMENT FOR CONTAINERS RECEI...
- Publication number 20190045656
- Publication date Feb 7, 2019
- Intel Corporation
- Annie Chen
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SYSTEM TO REDUCE COOLANT USE IN AN ARRAY OF CIRCUIT BOARDS
- Publication number 20190045661
- Publication date Feb 7, 2019
- Intel Corporation
- Joseph Andrew Broderick
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LIQUID COOLING INTERFACE FOR FIELD REPLACEABLE ELECTRONIC COMPONENT
- Publication number 20180059744
- Publication date Mar 1, 2018
- Intel Corporation
- MICHAEL S. BRAZEL
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HEAT EXCHANGER PUCK
- Publication number 20180058777
- Publication date Mar 1, 2018
- Intel Corporation
- AARON P. ANDERSON
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
EXPANSION CARD HAVING SYNERGISTIC COOLING, STRUCTURAL AND VOLUME RE...
- Publication number 20150234437
- Publication date Aug 20, 2015
- Mark J. Gallina
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
GASKETTED THERMAL INTERFACE
- Publication number 20150184053
- Publication date Jul 2, 2015
- SHANKAR KRISHNAN
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Copper-elastomer hybrid thermal interface material to cool under-su...
- Publication number 20080160330
- Publication date Jul 3, 2008
- David Song
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Frame-level thermal interface component for transfer of heat from a...
- Publication number 20060193114
- Publication date Aug 31, 2006
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for manufacturing thermal interface device hav...
- Publication number 20060163622
- Publication date Jul 27, 2006
- Stephen W. Montgomery
- B82 - NANO-TECHNOLOGY
Information Patent Application
Systems to cool multiple electrical components
- Publication number 20060126294
- Publication date Jun 15, 2006
- Barrett Faneuf
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
High capacity air-cooling systems for electronic apparatus
- Publication number 20050030712
- Publication date Feb 10, 2005
- Intel Corporation
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Apparatus and method for manufacturing thermal interface device hav...
- Publication number 20040266063
- Publication date Dec 30, 2004
- Stephen W. Montgomery
- B82 - NANO-TECHNOLOGY
Information Patent Application
Modular capillary pumped loop cooling system
- Publication number 20040040695
- Publication date Mar 4, 2004
- Intel Corporation
- Jason B. Chesser
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Cooling method and apparatus for handheld devices
- Publication number 20030184967
- Publication date Oct 2, 2003
- Ven R. Holalkere
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Rack-mounted server and associated methods
- Publication number 20030161114
- Publication date Aug 28, 2003
- Intel Corporation
- William E. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CHASSIS-LEVEL THERMAL INTERFACE COMPONENT FOR TRANSFER OF HEAT FROM...
- Publication number 20030128515
- Publication date Jul 10, 2003
- Barrett M. Faneuf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Computer system having a chassis-level thermal interface component...
- Publication number 20030128517
- Publication date Jul 10, 2003
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Computer system having a plurality of server units transferring hea...
- Publication number 20030128508
- Publication date Jul 10, 2003
- Barrett M. Faneuf
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Frame-level thermal interface component for transfer of heat from a...
- Publication number 20030128516
- Publication date Jul 10, 2003
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Computer system which locks a server unit subassembly in a selected...
- Publication number 20030128525
- Publication date Jul 10, 2003
- William E. Berry
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Computer system having a chassis-level capillary pump loop transfer...
- Publication number 20030051860
- Publication date Mar 20, 2003
- Intel Corporation
- Stephen W. Montgomery
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
Modular capillary pumped loop cooling system
- Publication number 20030051859
- Publication date Mar 20, 2003
- Jason B. Chesser
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
High capacity air-cooling system for electronic apparatus and assoc...
- Publication number 20030002254
- Publication date Jan 2, 2003
- Intel Corporation
- Barrett M. Faneuf
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rack-mounted server and associated methods
- Publication number 20030002261
- Publication date Jan 2, 2003
- Intel Corporation
- William E. Berry
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Barrett M. Faneuf

Person

Patents Grantslast 30 patents

Jam for integration reliability of ruler form factor component

Electronic systems with inverted circuit board with heat sink to ch...

Electronic systems with inverted circuit board with heat sink to ch...

Liquid coolant based thermal energy management for containers recei...

System to reduce coolant use in an array of circuit boards

Mechanism with folded wrapping to seal components immersed in coolant

Expansion card having synergistic cooling, structural and volume re...

Modular capillary pumped loop cooling system

Frame-level thermal interface component for transfer of heat from a...

Systems to cool multiple electrical components

Frame-level thermal interface component for transfer of heat from a...

Baffles for high capacity air-cooling systems for electronics appar...

Modular capillary pumped loop cooling system

Electronics rack assemblies and associated components

Computer system having a plurality of server units transferring hea...

High capacity air-cooling systems for electronic apparatus and asso...

Computer system having a chassis-level capillary pump loop transfer...

Cooling method and apparatus for handheld devices

Computer system which locks a server unit subassembly in a selected...

Computer system having a chassis-level thermal interface component...

Chassis-level thermal interface component for transfer of heat from...

Rack-mounted server and associated methods

Patents Applicationslast 30 patents

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

LIQUID COOLING SYSTEM LEAK DETECTION IMPROVEMENTS

JAM FOR INTEGRATION RELIABILITY OF RULER FORM FACTOR COMPONENT

ELECTRONIC SYSTEMS WITH INVERTED CIRCUIT BOARD WITH HEAT SINK TO CH...

MECHANISM WITH FOLDED WRAPPING TO SEAL COMPONENTS IMMERSED IN COOLANT

LIQUID COOLANT BASED THERMAL ENERGY MANAGEMENT FOR CONTAINERS RECEI...

SYSTEM TO REDUCE COOLANT USE IN AN ARRAY OF CIRCUIT BOARDS

LIQUID COOLING INTERFACE FOR FIELD REPLACEABLE ELECTRONIC COMPONENT

HEAT EXCHANGER PUCK

EXPANSION CARD HAVING SYNERGISTIC COOLING, STRUCTURAL AND VOLUME RE...

GASKETTED THERMAL INTERFACE

Copper-elastomer hybrid thermal interface material to cool under-su...

Frame-level thermal interface component for transfer of heat from a...

Apparatus and method for manufacturing thermal interface device hav...

Systems to cool multiple electrical components

High capacity air-cooling systems for electronic apparatus

Apparatus and method for manufacturing thermal interface device hav...

Modular capillary pumped loop cooling system

Cooling method and apparatus for handheld devices

Rack-mounted server and associated methods

CHASSIS-LEVEL THERMAL INTERFACE COMPONENT FOR TRANSFER OF HEAT FROM...

Computer system having a chassis-level thermal interface component...

Computer system having a plurality of server units transferring hea...

Frame-level thermal interface component for transfer of heat from a...

Computer system which locks a server unit subassembly in a selected...

Computer system having a chassis-level capillary pump loop transfer...

Modular capillary pumped loop cooling system

High capacity air-cooling system for electronic apparatus and assoc...

Rack-mounted server and associated methods