Barry Lin

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Kaohsiung, TW

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,224,232
- Issue date Feb 11, 2025
- SILICONIX INCORPORATED
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having side wall plating
- Patent number 12,211,704
- Issue date Jan 28, 2025
- Siliconix incorporated
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe circuit and method therefor
- Patent number 8,648,458
- Issue date Feb 11, 2014
- NXP B.V.
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for manufacturing resistor-networks with higher circuit den...
- Patent number 5,850,171
- Issue date Dec 15, 1998
- CYNTEC Company
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD OF FORMING COMPONENTS FOR SEMICONDU...
- Publication number 20250062196
- Publication date Feb 20, 2025
- Vishay Silliconix LLC
- Lim CHEE CHIAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING A SEMICONDUCTOR DEVICE, AND A STRUCTURE FORMED B...
- Publication number 20250046685
- Publication date Feb 6, 2025
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SIDE WALL PLATING
- Publication number 20220181239
- Publication date Jun 9, 2022
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE HAVING SIDE WALL PLATING
- Publication number 20220172961
- Publication date Jun 2, 2022
- Siliconix Incorporated
- Barry LIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Leadframe Circuit and Method Therefor
- Publication number 20110147903
- Publication date Jun 23, 2011
- Barry Lin
- H01 - BASIC ELECTRIC ELEMENTS