Barry M. Miles

Person

Chandler, AZ, US

People

Patents Grantslast 30 patents

Information Patent Grant
Moisture enhanced ball grid array package
- Patent number 6,242,802
- Issue date Jun 5, 2001
- Motorola, Inc.
- Barry M. Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Making solder ball mounting pads on substrates
- Patent number 6,201,305
- Issue date Mar 13, 2001
- Amkor Technology, Inc.
- Robert F. Darveaux
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded plastic ball grid array package
- Patent number 5,831,832
- Issue date Nov 3, 1998
- Motorola, Inc.
- Joseph G. Gillette
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Moisture relief for chip carriers
- Patent number 5,721,450
- Issue date Feb 24, 1998
- Motorola, Inc.
- Barry M. Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Low profile exposed die chip carrier package
- Patent number 5,696,666
- Issue date Dec 9, 1997
- Motorola, Inc.
- Barry M. Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadless integrated circuit package
- Patent number 5,535,101
- Issue date Jul 9, 1996
- Motorola, Inc.
- Barry M. Miles
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a liquid crystal display device in which a...
- Patent number 5,515,188
- Issue date May 7, 1996
- Motorola, Inc.
- Barry M. Miles
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Moisture relief for chip carrier
- Patent number 5,296,738
- Issue date Mar 22, 1994
- Motorola, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for adhering polyimide to a substrate
- Patent number 5,198,264
- Issue date Mar 30, 1993
- Motorola, Inc.
- Leonard F. Altman
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Grant
Transfer molded semiconductor device package with integral shield
- Patent number 5,166,772
- Issue date Nov 24, 1992
- Motorola, Inc.
- Keith D. Soldner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transfer molded semiconductor package with improved adhesion
- Patent number 5,153,385
- Issue date Oct 6, 1992
- Motorola, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible film chip carrier having a flexible film substrate and mea...
- Patent number 5,134,462
- Issue date Jul 28, 1992
- Motorola, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Grounding an ultra high density pad array chip carrier
- Patent number 5,077,633
- Issue date Dec 31, 1991
- Motorola Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Shielded electrical circuit
- Patent number 5,031,027
- Issue date Jul 9, 1991
- Motorola, Inc.
- Dale W. Dorinski
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Flip-chip package for integrated circuits
- Patent number 5,019,673
- Issue date May 28, 1991
- Motorola, Inc.
- Frank J. Juskey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fabrication of pad array carriers from a universal interconnect str...
- Patent number 5,006,673
- Issue date Apr 9, 1991
- Motorola, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Pad grid array for receiving a solder bumped chip carrier
- Patent number 4,940,181
- Issue date Jul 10, 1990
- Motorola, Inc.
- Frank J. Juskey
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Barry M. Miles

Person

Patents Grantslast 30 patents

Moisture enhanced ball grid array package

Making solder ball mounting pads on substrates

Molded plastic ball grid array package

Moisture relief for chip carriers

Low profile exposed die chip carrier package

Leadless integrated circuit package

Method of manufacturing a liquid crystal display device in which a...

Moisture relief for chip carrier

Method for adhering polyimide to a substrate

Transfer molded semiconductor device package with integral shield

Transfer molded semiconductor package with improved adhesion

Flexible film chip carrier having a flexible film substrate and mea...

Grounding an ultra high density pad array chip carrier

Shielded electrical circuit

Flip-chip package for integrated circuits

Fabrication of pad array carriers from a universal interconnect str...

Pad grid array for receiving a solder bumped chip carrier