Baw-Ching Perng

Person

Hsin-Chu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Chip package and manufacturing method thereof
- Patent number 8,916,420
- Issue date Dec 23, 2014
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment of metal interconnect lines
- Patent number 8,053,894
- Issue date Nov 8, 2011
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Measuring low dielectric constant film properties during processing
- Patent number 7,400,401
- Issue date Jul 15, 2008
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jang-Shiang Tsai
- G01 - MEASURING TESTING
Information Patent Grant
CMOS devices with improved gap-filling
- Patent number 7,378,308
- Issue date May 27, 2008
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Ju-Wang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of trimming technology
- Patent number 7,354,847
- Issue date Apr 8, 2008
- Taiwan Semiconductor Manufacturing Company
- Bor-Wen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treated low-k dielectric as diffusion barrier for copper me...
- Patent number 7,271,103
- Issue date Sep 18, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Kuei-Wu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Self-aligned double gate device and method for forming same
- Patent number 7,230,270
- Issue date Jun 12, 2007
- Taiwan Semiconductor Manfacturing Company, Ltd.
- Hao-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and structures for critical dimension and profile measurement
- Patent number 7,208,331
- Issue date Apr 24, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jyu-Horng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for multiple spacer width control
- Patent number 7,176,137
- Issue date Feb 13, 2007
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Recessed polysilicon gate structure for a strained silicon MOSFET d...
- Patent number 7,172,933
- Issue date Feb 6, 2007
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for patterning high-k dielectric material
- Patent number 7,148,114
- Issue date Dec 12, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Kuang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for removing organic materials during formation of a metal...
- Patent number 7,122,484
- Issue date Oct 17, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Baw-Ching Perng
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Method for wet etching of high k thin film at low temperature
- Patent number 7,115,526
- Issue date Oct 3, 2006
- Grand Plastic Technology Corporation Taiwan
- Hsieh Yue Ho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and structure for ultra narrow gate
- Patent number 7,081,413
- Issue date Jul 25, 2006
- Taiwan Semiconductor Manufacturing Company
- Bor-Wen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process for patterning high-k dielectric material
- Patent number 7,037,849
- Issue date May 2, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Hsien-Kuang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Zirconium oxide and hafnium oxide etching using halogen containing...
- Patent number 7,012,027
- Issue date Mar 14, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming multiple spacer widths
- Patent number 7,011,929
- Issue date Mar 14, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd
- Ming-Ta Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wet etchant composition and method for etching HfO2 and ZrO2
- Patent number 6,969,688
- Issue date Nov 29, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface treatment of metal interconnect lines
- Patent number 6,955,984
- Issue date Oct 18, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Selective spacer layer deposition method for forming spacers with d...
- Patent number 6,943,077
- Issue date Sep 13, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Sen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for improving sheet resistance of silicide layer after remo...
- Patent number 6,838,381
- Issue date Jan 4, 2005
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Peng-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Advanced control for plasma process
- Patent number 6,812,044
- Issue date Nov 2, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd
- Hsien-Kuang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a semiconductor device having high-K gate dielec...
- Patent number 6,746,900
- Issue date Jun 8, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ai-Sen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated approach for controlling top dielectric loss during spac...
- Patent number 6,498,067
- Issue date Dec 24, 2002
- Taiwan Semiconductor Manufacturing Company
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method to pattern polysilicon gates with high-k material gate diele...
- Patent number 6,479,403
- Issue date Nov 12, 2002
- Taiwan Semiconductor Manufacturing Company
- Ming-Huan Tsei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20130256869
- Publication date Oct 3, 2013
- Baw-Ching PERNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE AND MANUFACTURING METHOD THEREOF
- Publication number 20110024894
- Publication date Feb 3, 2011
- Baw-Ching PERNG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CMOS devices with improved gap-filling
- Publication number 20070235823
- Publication date Oct 11, 2007
- Ju-Wang Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Measuring low dielectric constant film properties during processing
- Publication number 20060220653
- Publication date Oct 5, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jang-Shiang Tsai
- G01 - MEASURING TESTING
Information Patent Application
Selective spacer layer deposition method for forming spacers with d...
- Publication number 20060113616
- Publication date Jun 1, 2006
- Ai-Sen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Self-aligned double gate device and method for forming same
- Publication number 20060108644
- Publication date May 25, 2006
- Hao-Yu Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and structures for critical dimension and profile measurement
- Publication number 20060073620
- Publication date Apr 6, 2006
- Jyu-Horng Shieh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wet etchant composition and method for etching HfO2 and ZrO2
- Publication number 20060054597
- Publication date Mar 16, 2006
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
A Recessed Polysilicon Gate Structure for a Strained Silicon MOSFET...
- Publication number 20060009001
- Publication date Jan 12, 2006
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Yi-Chun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface treatment of metal interconnect lines
- Publication number 20060001160
- Publication date Jan 5, 2006
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer clean process
- Publication number 20050274393
- Publication date Dec 15, 2005
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Baw-Ching Perng
- B08 - CLEANING
Information Patent Application
Process for removing organic materials during formation of a metal...
- Publication number 20050245082
- Publication date Nov 3, 2005
- Taiwan Semiconductor Manufacturing Co.
- Baw-Ching Perng
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Process for patterning high-k dielectric material
- Publication number 20050181590
- Publication date Aug 18, 2005
- Hsien-Kuang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and structure for ultra narrow gate
- Publication number 20050164503
- Publication date Jul 28, 2005
- Bor-Wen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Novel method of trimming technology
- Publication number 20050164478
- Publication date Jul 28, 2005
- Taiwan Semiconductor Manufacturing Co.
- Bor-Wen Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Zirconium oxide and hafnium oxide etching using halogen containing...
- Publication number 20050164479
- Publication date Jul 28, 2005
- Taiwan Semiconductor Manufacturing Co.
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface treated low-k dielectric as diffusion barrier for copper me...
- Publication number 20050085083
- Publication date Apr 21, 2005
- Kuei-Wu Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Process for patterning high-k dielectric material
- Publication number 20040262262
- Publication date Dec 30, 2004
- Hsien-Kuang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Surface treatment of metal interconnect lines
- Publication number 20040229460
- Publication date Nov 18, 2004
- Wen-Kai Wan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for multiple spacer width control
- Publication number 20040222182
- Publication date Nov 11, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Selective spacer layer deposition method for forming spacers with d...
- Publication number 20040198060
- Publication date Oct 7, 2004
- Ai-Sen Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for forming multiple spacer widths
- Publication number 20040137373
- Publication date Jul 15, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Ming-Ta Lei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods for improving sheet resistance of silicide layer after remo...
- Publication number 20040127026
- Publication date Jul 1, 2004
- Peng-Fu Hsu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Advanced control for plasma process
- Publication number 20040121603
- Publication date Jun 24, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Hsien-Kuang Chiu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wet etchant composition and method for etching HfO2 and ZrO2
- Publication number 20040067657
- Publication date Apr 8, 2004
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Baw-Ching Perng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for wet etching of high k thin film at low temperature
- Publication number 20030148625
- Publication date Aug 7, 2003
- Hsieh Yue Ho
- H01 - BASIC ELECTRIC ELEMENTS

Baw-Ching Perng

Person

Patents Grantslast 30 patents

Chip package and manufacturing method thereof

Surface treatment of metal interconnect lines

Measuring low dielectric constant film properties during processing

CMOS devices with improved gap-filling

Method of trimming technology

Surface treated low-k dielectric as diffusion barrier for copper me...

Self-aligned double gate device and method for forming same

Methods and structures for critical dimension and profile measurement

Method for multiple spacer width control

Recessed polysilicon gate structure for a strained silicon MOSFET d...

Process for patterning high-k dielectric material

Process for removing organic materials during formation of a metal...

Method for wet etching of high k thin film at low temperature

Method and structure for ultra narrow gate

Process for patterning high-k dielectric material

Zirconium oxide and hafnium oxide etching using halogen containing...

Method for forming multiple spacer widths

Wet etchant composition and method for etching HfO2 and ZrO2

Surface treatment of metal interconnect lines

Selective spacer layer deposition method for forming spacers with d...

Methods for improving sheet resistance of silicide layer after remo...

Advanced control for plasma process

Method for forming a semiconductor device having high-K gate dielec...

Integrated approach for controlling top dielectric loss during spac...

Method to pattern polysilicon gates with high-k material gate diele...

Patents Applicationslast 30 patents

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CHIP PACKAGE AND MANUFACTURING METHOD THEREOF

CMOS devices with improved gap-filling

Measuring low dielectric constant film properties during processing

Selective spacer layer deposition method for forming spacers with d...

Self-aligned double gate device and method for forming same

Methods and structures for critical dimension and profile measurement

Wet etchant composition and method for etching HfO2 and ZrO2

A Recessed Polysilicon Gate Structure for a Strained Silicon MOSFET...

Surface treatment of metal interconnect lines

Wafer clean process

Process for removing organic materials during formation of a metal...

Process for patterning high-k dielectric material

Method and structure for ultra narrow gate

Novel method of trimming technology

Zirconium oxide and hafnium oxide etching using halogen containing...

Surface treated low-k dielectric as diffusion barrier for copper me...

Process for patterning high-k dielectric material

Surface treatment of metal interconnect lines

Method for multiple spacer width control

Selective spacer layer deposition method for forming spacers with d...

Method for forming multiple spacer widths

Methods for improving sheet resistance of silicide layer after remo...

Advanced control for plasma process

Wet etchant composition and method for etching HfO2 and ZrO2

Method for wet etching of high k thin film at low temperature