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Belgacem Haba

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  • Saratoga, CA, US
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Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
    • Publication number 20240145438
    • Publication date May 2, 2024
    • ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
    • Javier A. DeLaCruz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
    • Publication number 20240136333
    • Publication date Apr 25, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
    • Publication number 20240128186
    • Publication date Apr 18, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED OPTICAL DEVICES
    • Publication number 20240103274
    • Publication date Mar 28, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
    • Publication number 20240096823
    • Publication date Mar 21, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Javier A. DeLaCruz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TSV AS PAD
    • Publication number 20240088101
    • Publication date Mar 14, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DEVICES AND METHODS OF FABRICATION
    • Publication number 20240088120
    • Publication date Mar 14, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED DEBUGGING ELEMENTS FOR INTEGRATED CIRCUITS AND METHODS FOR D...
    • Publication number 20240055407
    • Publication date Feb 15, 2024
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Thomas Workman
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
    • Publication number 20240038633
    • Publication date Feb 1, 2024
    • INVENSAS BONDING TECHNOLOGIES, INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITHOUT INTERVENING ADHESIVE
    • Publication number 20230420399
    • Publication date Dec 28, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRICAL REDUNDANCY FOR BONDED STRUCTURES
    • Publication number 20230420419
    • Publication date Dec 28, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELE...
    • Publication number 20230420398
    • Publication date Dec 28, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CIRCUITRY FOR ELECTRICAL REDUNDANCY IN BONDED STRUCTURES
    • Publication number 20230395544
    • Publication date Dec 7, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Javier A. DeLaCruz
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    TESTING ELEMENTS FOR BONDED STRUCTURES
    • Publication number 20230375613
    • Publication date Nov 23, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • G01 - MEASURING TESTING
  • Information Patent Application

    LOW TEMPERATURE DIRECT BONDING
    • Publication number 20230361074
    • Publication date Nov 9, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    PROTECTIVE ELEMENTS FOR BONDED STRUCTURES
    • Publication number 20230317628
    • Publication date Oct 5, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
    • Publication number 20230317591
    • Publication date Oct 5, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    STACKED DEVICES AND METHODS OF FABRICATION
    • Publication number 20230282634
    • Publication date Sep 7, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Paul M. Enquist
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CORRECTION DIE FOR WAFER/DIE STACK
    • Publication number 20230268320
    • Publication date Aug 24, 2023
    • Invensas LLC
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    CAVITY PACKAGES
    • Publication number 20230260858
    • Publication date Aug 17, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Shaowu Huang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MOLDED DIRECT BONDED AND INTERCONNECTED STACK
    • Publication number 20230253367
    • Publication date Aug 10, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    HEAT DISSIPATING SYSTEM FOR ELECTRONIC DEVICES
    • Publication number 20230245950
    • Publication date Aug 3, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem HABA
    • F28 - HEAT EXCHANGE IN GENERAL
  • Information Patent Application

    DIRECT BONDING ON PACKAGE SUBSTRATES
    • Publication number 20230215836
    • Publication date Jul 6, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MICROELECTRONIC ASSEMBLIES
    • Publication number 20230215739
    • Publication date Jul 6, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES, INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    MULTI-CHANNEL DEVICE STACKING
    • Publication number 20230207437
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    BONDED STRUCTURES WITH INTERCONNECT ASSEMBLIES
    • Publication number 20230207474
    • Publication date Jun 29, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Cyprian Emeka Uzoh
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMOELECTRIC COOLING FOR DIE PACKAGES
    • Publication number 20230197559
    • Publication date Jun 22, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    THERMOELECTRIC COOLING IN MICROELECTRONICS
    • Publication number 20230197560
    • Publication date Jun 22, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Rajesh Katkar
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    POWER DISTRIBUTION FOR STACKED ELECTRONIC DEVICES
    • Publication number 20230187412
    • Publication date Jun 15, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Guilian Gao
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    FLUID COOLING FOR DIE STACKS
    • Publication number 20230154828
    • Publication date May 18, 2023
    • ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
    • Belgacem Haba
    • H01 - BASIC ELECTRIC ELEMENTS