Belgacem Haba

Person

Saratoga, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Stacked devices and methods of fabrication
- Patent number 12,347,820
- Issue date Jul 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Paul M. Enquist
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device cooling structures bonded to semiconductor elements
- Patent number 12,341,083
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Microelectronic assemblies
- Patent number 12,341,025
- Issue date Jun 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cold plate cavity designs for improved thermal performance
- Patent number 12,336,141
- Issue date Jun 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Fluid channel geometry optimizations to improve cooling efficiency
- Patent number 12,322,677
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Ron Zhang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded structure with interconnect structure
- Patent number 12,322,718
- Issue date Jun 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuitry for electrical redundancy in bonded structures
- Patent number 12,308,332
- Issue date May 20, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLACruz
- G01 - MEASURING TESTING
Information Patent Grant
Protective semiconductor elements for bonded structures
- Patent number 12,300,634
- Issue date May 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Apparatus for non-volatile random access memory stacks
- Patent number 12,288,771
- Issue date Apr 29, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Symbiotic network on layers
- Patent number 12,283,572
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,283,490
- Issue date Apr 22, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated voltage regulator and passive components
- Patent number 12,278,215
- Issue date Apr 15, 2025
- Adeia Semiconductor Inc.
- Javier A. Delacruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct-bonded lamination for improved image clarity in optical devices
- Patent number 12,270,970
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- G02 - OPTICS
Information Patent Grant
Capacitive coupling in a direct-bonded interface for microelectroni...
- Patent number 12,272,673
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Direct bonded stack structures for increased reliability and improv...
- Patent number 12,272,677
- Issue date Apr 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Molded direct bonded and interconnected stack
- Patent number 12,266,640
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Structures and methods for integrated cold plate in XPUs and memory
- Patent number 12,266,545
- Issue date Apr 1, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Laura Mirkarimi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling systems with coolant channel for device packaging
- Patent number 12,261,099
- Issue date Mar 25, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Correction die for wafer/die stack
- Patent number 12,237,306
- Issue date Feb 25, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrical redundancy for bonded structures
- Patent number 12,218,107
- Issue date Feb 4, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
TSV as pad
- Patent number 12,205,926
- Issue date Jan 21, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Guilian Gao
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded liquid cooling
- Patent number 12,199,011
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Remote optical engine for virtual reality or augmented reality head...
- Patent number RE50272
- Issue date Jan 14, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
Information Patent Grant
Embedded cooling systems and methods of manufacturing embedded cool...
- Patent number 12,191,233
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies including signal redistribution and m...
- Patent number 12,191,235
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assemblies for advanced device packaging and met...
- Patent number 12,191,234
- Issue date Jan 7, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Nanowire bonding interconnect for fine-pitch microelectronics
- Patent number 12,191,267
- Issue date Jan 7, 2025
- Adeia Semiconductor Technologies, LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Embedded cooling assemblies for advanced device packaging and metho...
- Patent number 12,183,659
- Issue date Dec 31, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manifold designs for embedded liquid cooling in a package
- Patent number 12,176,264
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated cooling assembly including coolant channel on the backsi...
- Patent number 12,176,263
- Issue date Dec 24, 2024
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...
- Publication number 20250239504
- Publication date Jul 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-BONDED LAMINATION FOR IMPROVED IMAGE CLARITY IN OPTICAL DEVICES
- Publication number 20250237788
- Publication date Jul 24, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- G02 - OPTICS
Information Patent Application
PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES
- Publication number 20250233086
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS
- Publication number 20250233114
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250233053
- Publication date Jul 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain Jr.
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...
- Publication number 20250226290
- Publication date Jul 10, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DISPLAY DEVICES USING RECONSTITUTED SUBSTRATES AND METHODS OF FORMI...
- Publication number 20250221128
- Publication date Jul 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
Information Patent Application
TRANSFER OF MULTIPLE SMALL ELEMENTS TO A CARRIER
- Publication number 20250212554
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250210457
- Publication date Jun 26, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Gaius Gillman Fountain
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SECURITY CIRCUITRY FOR BONDED STRUCTURES
- Publication number 20250199058
- Publication date Jun 19, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Javier A. DeLaCruz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME
- Publication number 20250201739
- Publication date Jun 19, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Cyprian Emeka Uzoh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMBEDDED LIQUID COOLING
- Publication number 20250183120
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES
- Publication number 20250185163
- Publication date Jun 5, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Oliver Zhao
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
CORRECTION DIE FOR WAFER/DIE STACK
- Publication number 20250157992
- Publication date May 15, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELE...
- Publication number 20250149483
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEE-THROUGH LED DISPLAYS AND METHODS RELATED THERETO
- Publication number 20250151502
- Publication date May 8, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
Information Patent Application
BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT
- Publication number 20250125248
- Publication date Apr 17, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH EFFICIENCY QUANTUM DOT IMAGE SENSORS AND METHODS OF FORMING TH...
- Publication number 20250113627
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
Information Patent Application
QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250113700
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME
- Publication number 20250113646
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
Information Patent Application
STACKED QUANTUM DOT SENSORS AND METHODS OF FORMING THE SAME
- Publication number 20250113641
- Publication date Apr 3, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
Information Patent Application
INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...
- Publication number 20250105094
- Publication date Mar 27, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS
- Publication number 20250096168
- Publication date Mar 20, 2025
- ADEIA SEMICONDUCTOR TECHNOLOGIES LLC
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION
- Publication number 20250054854
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh KATKAR
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC DEVICE COOLING STRUCTURES
- Publication number 20250054837
- Publication date Feb 13, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Thomas WORKMAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED OPTICAL DEVICES
- Publication number 20250044598
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- G02 - OPTICS
Information Patent Application
MICROELECTRONIC ASSEMBLIES
- Publication number 20250046625
- Publication date Feb 6, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
3D NAND - HIGH ASPECT RATIO STRINGS AND CHANNELS
- Publication number 20250048633
- Publication date Feb 6, 2025
- Adeia Semiconductor Inc.
- Rajesh Katkar
Information Patent Application
INTEGRATED CIRCUITS WITH CAPACITORS
- Publication number 20250038104
- Publication date Jan 30, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Rajesh Katkar
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIPLET-TO-CHIPLET PROTOCOL SWITCH
- Publication number 20250006642
- Publication date Jan 2, 2025
- ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC.
- Belgacem Haba
- H01 - BASIC ELECTRIC ELEMENTS

Belgacem Haba

Person

Patents Grantslast 30 patents

Stacked devices and methods of fabrication

Electronic device cooling structures bonded to semiconductor elements

Microelectronic assemblies

Cold plate cavity designs for improved thermal performance

Fluid channel geometry optimizations to improve cooling efficiency

Bonded structure with interconnect structure

Circuitry for electrical redundancy in bonded structures

Protective semiconductor elements for bonded structures

Apparatus for non-volatile random access memory stacks

Symbiotic network on layers

Integrated cooling assemblies for advanced device packaging and met...

Integrated voltage regulator and passive components

Direct-bonded lamination for improved image clarity in optical devices

Capacitive coupling in a direct-bonded interface for microelectroni...

Direct bonded stack structures for increased reliability and improv...

Molded direct bonded and interconnected stack

Structures and methods for integrated cold plate in XPUs and memory

Embedded cooling systems with coolant channel for device packaging

Correction die for wafer/die stack

Electrical redundancy for bonded structures

TSV as pad

Embedded liquid cooling

Remote optical engine for virtual reality or augmented reality head...

Embedded cooling systems and methods of manufacturing embedded cool...

Integrated cooling assemblies including signal redistribution and m...

Integrated cooling assemblies for advanced device packaging and met...

Nanowire bonding interconnect for fine-pitch microelectronics

Embedded cooling assemblies for advanced device packaging and metho...

Manifold designs for embedded liquid cooling in a package

Integrated cooling assembly including coolant channel on the backsi...

Patents Applicationslast 30 patents

EMBEDDED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND METHO...

DIRECT-BONDED LAMINATION FOR IMPROVED IMAGE CLARITY IN OPTICAL DEVICES

PROTECTIVE SEMICONDUCTOR ELEMENTS FOR BONDED STRUCTURES

APPARATUS FOR NON-VOLATILE RANDOM ACCESS MEMORY STACKS

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

EMBEDDED COOLING SYSTEMS AND METHODS OF MANUFACTURING EMBEDDED COOL...

DISPLAY DEVICES USING RECONSTITUTED SUBSTRATES AND METHODS OF FORMI...

TRANSFER OF MULTIPLE SMALL ELEMENTS TO A CARRIER

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

SECURITY CIRCUITRY FOR BONDED STRUCTURES

STRONG BONDING STRUCTURES AND METHODS OF FORMING THE SAME

EMBEDDED LIQUID COOLING

ORGANIC-TO-INORGANIC BONDING METHODS AND STRUCTURES

CORRECTION DIE FOR WAFER/DIE STACK

INTEGRATED DEVICE PACKAGES WITH INTEGRATED DEVICE DIE AND DUMMY ELE...

SEE-THROUGH LED DISPLAYS AND METHODS RELATED THERETO

BONDED STRUCTURES WITH INTEGRATED PASSIVE COMPONENT

HIGH EFFICIENCY QUANTUM DOT IMAGE SENSORS AND METHODS OF FORMING TH...

QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME

QUANTUM DOT IMAGE SENSOR DEVICES AND METHODS OF MANUFACTURING THE SAME

STACKED QUANTUM DOT SENSORS AND METHODS OF FORMING THE SAME

INTEGRATED COOLING ASSEMBLIES FOR ADVANCED DEVICE PACKAGING AND MET...

NANOWIRE BONDING INTERCONNECT FOR FINE-PITCH MICROELECTRONICS

HEAVILY DOPED SEMICONDUCTOR DEVICES FOR POWER DISTRIBUTION

ELECTRONIC DEVICE COOLING STRUCTURES

BONDED OPTICAL DEVICES

MICROELECTRONIC ASSEMBLIES

3D NAND - HIGH ASPECT RATIO STRINGS AND CHANNELS

INTEGRATED CIRCUITS WITH CAPACITORS

CHIPLET-TO-CHIPLET PROTOCOL SWITCH