Beng Keh See

Person

Bukit Katil, MY

People

Patents Grantslast 30 patents

Information Patent Grant
Manufacturing a package using plateable encapsulant
- Patent number 11,081,417
- Issue date Aug 3, 2021
- Infineon Technologies AG
- Sook Woon Chan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with plateable encapsulant and a method for m...
- Patent number 10,396,007
- Issue date Aug 27, 2019
- Infineon Technologies AG
- Sook Woon Chan
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Module and method of manufacturing a module
- Patent number 9,691,687
- Issue date Jun 27, 2017
- Infineon Technologies AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip arrangement and a method of manufacturing a chip arrangement
- Patent number 9,653,405
- Issue date May 16, 2017
- Infineon Technologies AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Module and method of manufacturing a module
- Patent number 8,749,056
- Issue date Jun 10, 2014
- Infineon Technologies AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a semiconductor device
- Patent number 8,535,983
- Issue date Sep 17, 2013
- Infineon Technologies AG
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing multiple semiconductor devices
- Patent number 8,053,280
- Issue date Nov 8, 2011
- Infineon Technologies AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20190341324
- Publication date Nov 7, 2019
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Manufacturing a package using plateable encapsulant
- Publication number 20170256472
- Publication date Sep 7, 2017
- INFINEON TECHNOLOGIES AG
- Sook Woon CHAN
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT
- Publication number 20140231971
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Horst Theuss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module and Method of Manufacturing a Module
- Publication number 20140231974
- Publication date Aug 21, 2014
- INFINEON TECHNOLOGIES AG
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Semiconductor Device
- Publication number 20120309130
- Publication date Dec 6, 2012
- INFINEON TECHNOLOGIES AG
- Tze Yang Hin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Module and Method of Manufacturing a Module
- Publication number 20120299170
- Publication date Nov 29, 2012
- Daniel Kehrer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Making a Semiconductor Device
- Publication number 20120273935
- Publication date Nov 1, 2012
- Stefan Martens
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING MULTIPLE SEMICONDUCTOR DEVICES
- Publication number 20090134512
- Publication date May 28, 2009
- INFINEON TECHNOLOGIES AG
- Chau Fatt Chiang
- H01 - BASIC ELECTRIC ELEMENTS

Beng Keh See

Person

Patents Grantslast 30 patents

Manufacturing a package using plateable encapsulant

Semiconductor package with plateable encapsulant and a method for m...

Module and method of manufacturing a module

Chip arrangement and a method of manufacturing a chip arrangement

Module and method of manufacturing a module

Method of manufacturing a semiconductor device

Method of producing multiple semiconductor devices

Patents Applicationslast 30 patents

Manufacturing a package using plateable encapsulant

Manufacturing a package using plateable encapsulant

CHIP ARRANGEMENT AND A METHOD OF MANUFACTURING A CHIP ARRANGEMENT

Module and Method of Manufacturing a Module

Method of Manufacturing a Semiconductor Device

Module and Method of Manufacturing a Module

Semiconductor Device and Method of Making a Semiconductor Device

METHOD OF PRODUCING MULTIPLE SEMICONDUCTOR DEVICES