Bentley J. Palmer

Person

Stafford, TX, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method and composition for chemical mechanical planarization of a m...
- Patent number 8,841,216
- Issue date Sep 23, 2014
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and composition for chemical mechanical planarization of a m...
- Patent number 8,697,577
- Issue date Apr 15, 2014
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Polishing slurry for copper films
- Patent number 8,506,661
- Issue date Aug 13, 2013
- Air Products and Chemicals, Inc.
- Rebecca A. Sawayda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and composition for chemical mechanical planarization of a m...
- Patent number 8,414,789
- Issue date Apr 9, 2013
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method and composition for chemical mechanical planarization of a m...
- Patent number 8,252,688
- Issue date Aug 28, 2012
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for chemical mechanical planarization of chalcogenide materials
- Patent number 7,678,605
- Issue date Mar 16, 2010
- DuPont Air Products NanoMaterials LLC
- James Allen Schlueter
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for supercritical carbon dioxide processing of fluoro-carbon...
- Patent number 7,307,019
- Issue date Dec 11, 2007
- Tokyo Electron Limited
- Kohei Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for the electrochemical deposition and planari...
- Patent number 7,297,239
- Issue date Nov 20, 2007
- Novellus Systems, Inc.
- Ismail Emesh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
System and method for processing a substrate using supercritical ca...
- Patent number 7,250,374
- Issue date Jul 31, 2007
- Tokyo Electron Limited
- Glenn Gale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removal of CMP and post-CMP residue from semiconductors using super...
- Patent number 7,064,070
- Issue date Jun 20, 2006
- Tokyo Electron Limited
- William H. Mullee
- C11 - ANIMAL AND VEGETABLE OILS, FATS, FATTY SUBSTANCES AND WAXES FATTY ACIDS...
Information Patent Grant
Scale removal
- Patent number 6,924,253
- Issue date Aug 2, 2005
- Bentley J. Palmer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method and apparatus for the electrochemical deposition and planari...
- Patent number 6,802,955
- Issue date Oct 12, 2004
- SpeedFam-IPEC Corporation
- Ismail Emesh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wellbore fluids and their application
- Patent number 6,608,005
- Issue date Aug 19, 2003
- Schlumberger Technology Corporation
- Bentley J. Palmer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Fracturing process and composition
- Patent number 6,599,863
- Issue date Jul 29, 2003
- Schlumberger Technology Corporation
- Bentley J. Palmer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Patents Applicationslast 30 patents

Information Patent Application
Method and Composition for Chemical Mechanical Planarization of a M...
- Publication number 20130178065
- Publication date Jul 11, 2013
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
METHOD AND COMPOSITION FOR CHEMICAL MECHANICAL PLANARIZATION OF A M...
- Publication number 20130102153
- Publication date Apr 25, 2013
- Air Products and Chemicals, Inc.
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and Composition for Chemical Mechanical Planarization of A M...
- Publication number 20100167546
- Publication date Jul 1, 2010
- DoPont Air Products Nanomaterials LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method and Composition for Chemical Mechanical Planarization of A M...
- Publication number 20100167545
- Publication date Jul 1, 2010
- DuPont Air Products Nanomaterials LLC
- Xiaobo Shi
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Polishing Slurry for Copper Films
- Publication number 20100101448
- Publication date Apr 29, 2010
- DuPont Air Products Nanomaterials LLC
- Rebecca A. Sawayda
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Forming Through-base Wafer Vias in Fabrication of Stacke...
- Publication number 20100081279
- Publication date Apr 1, 2010
- DuPont Air Products Nanomaterials LLC
- Bentley J. Palmer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Chemical Mechanical Planarization of A Metal-containing...
- Publication number 20090061630
- Publication date Mar 5, 2009
- DuPont Air Products Nanomaterials LLC
- Bentley J. Palmer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for Chemical Mechanical Planarization of Chalcogenide Materials
- Publication number 20090057834
- Publication date Mar 5, 2009
- DuPont Air Products Nanomaterials LLC
- James Allen Schlueter
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Method for polishing copper on a workpiece surface
- Publication number 20060255016
- Publication date Nov 16, 2006
- Novellus Systems, Inc.
- Julia Svirchevski
- B24 - GRINDING POLISHING
Information Patent Application
Method for removing a residue from a substrate using supercritical...
- Publication number 20060102204
- Publication date May 18, 2006
- TOKYO ELECTRON LIMITED
- Gunilla Jacobson
- B08 - CLEANING
Information Patent Application
System for removing a residue from a substrate using supercritical...
- Publication number 20060102208
- Publication date May 18, 2006
- TOKYO ELECTRON LIMITED
- Gunilla Jacobson
- B08 - CLEANING
Information Patent Application
A METHOD FOR SUPERCRITICAL CARBON DIOXIDE PROCESSING OF FLUORO-CARB...
- Publication number 20060068583
- Publication date Mar 30, 2006
- TOKYO ELECTRON LIMITED
- Kohei Kawamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
System and method for processing a substrate using supercritical ca...
- Publication number 20060003592
- Publication date Jan 5, 2006
- TOKYO ELECTRON LIMITED
- Glenn Gale
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lubricant for wafer polishing using a fixed abrasive pad
- Publication number 20050121969
- Publication date Jun 9, 2005
- Ismail Emesh
- B24 - GRINDING POLISHING
Information Patent Application
Method and apparatus for the electrochemical deposition and planari...
- Publication number 20050016681
- Publication date Jan 27, 2005
- Ismail Emesh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Removal of CMP and post-CMP residue from semiconductors using super...
- Publication number 20040142564
- Publication date Jul 22, 2004
- William H. Mullee
- B08 - CLEANING
Information Patent Application
Method and apparatus for the electrochemical deposition and planari...
- Publication number 20030132120
- Publication date Jul 17, 2003
- Ismail Emesh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for polishing copper on a workpiece surface
- Publication number 20030134576
- Publication date Jul 17, 2003
- Saket Chadda
- B24 - GRINDING POLISHING
Information Patent Application
Scale removal
- Publication number 20020055439
- Publication date May 9, 2002
- Bentley J. Palmer
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Wellbore fluids and their application
- Publication number 20020019317
- Publication date Feb 14, 2002
- Bentley J. Palmer
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...

Bentley J. Palmer

Person

Patents Grantslast 30 patents

Method and composition for chemical mechanical planarization of a m...

Method and composition for chemical mechanical planarization of a m...

Polishing slurry for copper films

Method and composition for chemical mechanical planarization of a m...

Method and composition for chemical mechanical planarization of a m...

Method for chemical mechanical planarization of chalcogenide materials

Method for supercritical carbon dioxide processing of fluoro-carbon...

Method and apparatus for the electrochemical deposition and planari...

System and method for processing a substrate using supercritical ca...

Removal of CMP and post-CMP residue from semiconductors using super...

Scale removal

Method and apparatus for the electrochemical deposition and planari...

Wellbore fluids and their application

Fracturing process and composition

Patents Applicationslast 30 patents

Method and Composition for Chemical Mechanical Planarization of a M...

METHOD AND COMPOSITION FOR CHEMICAL MECHANICAL PLANARIZATION OF A M...

Method and Composition for Chemical Mechanical Planarization of A M...

Method and Composition for Chemical Mechanical Planarization of A M...

Polishing Slurry for Copper Films

Method for Forming Through-base Wafer Vias in Fabrication of Stacke...

Method for Chemical Mechanical Planarization of A Metal-containing...

Method for Chemical Mechanical Planarization of Chalcogenide Materials

Method for polishing copper on a workpiece surface

Method for removing a residue from a substrate using supercritical...

System for removing a residue from a substrate using supercritical...

A METHOD FOR SUPERCRITICAL CARBON DIOXIDE PROCESSING OF FLUORO-CARB...

System and method for processing a substrate using supercritical ca...

Lubricant for wafer polishing using a fixed abrasive pad

Method and apparatus for the electrochemical deposition and planari...

Removal of CMP and post-CMP residue from semiconductors using super...

Method and apparatus for the electrochemical deposition and planari...

Method for polishing copper on a workpiece surface

Scale removal

Wellbore fluids and their application