Bernd Goller

Person

Munchen, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Device package with reduced radio frequency losses
- Patent number 11,574,879
- Issue date Feb 7, 2023
- Infineon Technologies AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS-sensor
- Patent number 11,117,798
- Issue date Sep 14, 2021
- Infineon Technologies AG
- Gunar Lorenz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor module
- Patent number 11,040,872
- Issue date Jun 22, 2021
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
MEMS assembly
- Patent number 10,793,419
- Issue date Oct 6, 2020
- Infineon Technologies AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Package with vertical interconnect between carrier and clip
- Patent number 10,707,158
- Issue date Jul 7, 2020
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
MEMS assembly and method for producing a MEMS assembly
- Patent number 10,570,007
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Gunar Lorenz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Semiconductor package with a through port for sensor applications
- Patent number 10,549,985
- Issue date Feb 4, 2020
- Infineon Technologies AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Method for producing a semiconductor module
- Patent number 10,435,292
- Issue date Oct 8, 2019
- Infineon Technologies AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus with a high heat capacity and method for producing the same
- Patent number 10,377,626
- Issue date Aug 13, 2019
- Infineon Technologies AG
- Bernd Goller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Grant
Apparatus for determining a characteristic of a fluid having a devi...
- Patent number 10,161,908
- Issue date Dec 25, 2018
- Infineon Technologies AG
- Rui Miguel Moreira Araujo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor wafer with electrically connected contact and test areas
- Patent number 8,753,901
- Issue date Jun 17, 2014
- Infineon Technologies AG
- Ertle Werner
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor package with mold lock opening
- Patent number 8,466,009
- Issue date Jun 18, 2013
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor wafer with electrically connected contact and test areas
- Patent number 8,044,394
- Issue date Oct 25, 2011
- Infineon Technologies AG
- Werner Ertle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component embedded within a plastic compound and includi...
- Patent number 7,795,717
- Issue date Sep 14, 2010
- Infineon Technologies AG
- Bernd Goller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Leadframe having mold lock vent
- Patent number 7,781,899
- Issue date Aug 24, 2010
- Infineon Technologies AG
- Lee Teck Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with mold lock vent
- Patent number 7,732,937
- Issue date Jun 8, 2010
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Sensor component and panel used for the production thereof
- Patent number 7,700,956
- Issue date Apr 20, 2010
- Infineon Technologies AG
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor wafer, panel and electronic component with stacked se...
- Patent number 7,701,066
- Issue date Apr 20, 2010
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Smart card, smart card module, and a method for production of a sma...
- Patent number 7,575,173
- Issue date Aug 18, 2009
- Infineon Technologies, AG
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Biosensor with smart card configuration
- Patent number 7,566,968
- Issue date Jul 28, 2009
- Siemens Aktiengesellschaft
- Michael Bauer
- G01 - MEASURING TESTING
Information Patent Grant
Electronic component and a panel
- Patent number 7,524,699
- Issue date Apr 28, 2009
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing a universal semiconductor housing with precross...
- Patent number 7,517,722
- Issue date Apr 14, 2009
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module having plug contacts and method for producing it
- Patent number 7,391,103
- Issue date Jun 24, 2008
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with a plastic package and method for production
- Patent number 7,276,783
- Issue date Oct 2, 2007
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structure integrated under a pad
- Patent number 7,190,077
- Issue date Mar 13, 2007
- Infineon Technologies AG
- Robert Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with at least one semiconductor chip and metho...
- Patent number 6,953,992
- Issue date Oct 11, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device configured as a multichip module, leadframe, pane...
- Patent number 6,902,951
- Issue date Jun 7, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Universal package for an electronic component with a semiconductor...
- Patent number 6,867,471
- Issue date Mar 15, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component with at least two stacked semiconductor chips...
- Patent number 6,710,455
- Issue date Mar 23, 2004
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic component and process for producing the electronic compo...
- Patent number 6,683,374
- Issue date Jan 27, 2004
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MEMS-Sensor
- Publication number 20210323813
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Gunar Lorenz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
- Publication number 20200039820
- Publication date Feb 6, 2020
- INFINEON TECHNOLOGIES AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ASSEMBLY AND METHOD FOR PRODUCING A MEMS ASSEMBLY
- Publication number 20190359481
- Publication date Nov 28, 2019
- INFINEON TECHNOLOGIES AG
- Gunar Lorenz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS-Sensor
- Publication number 20190270639
- Publication date Sep 5, 2019
- INFINEON TECHNOLOGIES AG
- Gunar Lorenz
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
MEMS ASSEMBLY
- Publication number 20190270637
- Publication date Sep 5, 2019
- INFINEON TECHNOLOGIES AG
- Marc Fueldner
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Device Package with Reduced Radio Frequency Losses
- Publication number 20190259716
- Publication date Aug 22, 2019
- INFINEON TECHNOLOGIES AG
- Pedro Augusto Borrego Lambin Torres Amaral
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
APPARATUS FOR DETERMINING A CHARACTERISTIC OF A FLUID HAVING A DEVI...
- Publication number 20190079055
- Publication date Mar 14, 2019
- INFINEON TECHNOLOGIES AG
- Rui Miguel Moreira Araujo
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Device Package with Reduced Radio Frequency Losses
- Publication number 20180366424
- Publication date Dec 20, 2018
- INFINEON TECHNOLOGIES AG
- Pedro Augusto Borrego Lambin Torres Amaral
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS WITH A HIGH HEAT CAPACITY AND METHOD FOR PRODUCING THE SAME
- Publication number 20180305200
- Publication date Oct 25, 2018
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Semiconductor Package with a Through Port for Sensor Applications a...
- Publication number 20180148322
- Publication date May 31, 2018
- INFINEON TECHNOLOGIES AG
- Dominic Maier
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
METHOD FOR PRODUCING A SEMICONDUCTOR MODULE
- Publication number 20180022601
- Publication date Jan 25, 2018
- INFINEON TECHNOLOGIES AG
- Claus Waechter
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
Package with vertical interconnect between carrier and clip
- Publication number 20170317016
- Publication date Nov 2, 2017
- INFINEON TECHNOLOGIES AG
- Alexander HEINRICH
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Apparatus for Determining a Characteristic of a Fluid
- Publication number 20170276646
- Publication date Sep 28, 2017
- INFINEON TECHNOLOGIES AG
- Rui Miguel Moreira Araujo
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR WAFER WITH ELECTRICALLY CONNECTED CONTACT AND TEST AREAS
- Publication number 20110294238
- Publication date Dec 1, 2011
- INFINEON TECHNOLOGIES AG
- Werner Ertle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING
- Publication number 20100227436
- Publication date Sep 9, 2010
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT
- Publication number 20090224382
- Publication date Sep 10, 2009
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEADFRAME HAVING MOLD LOCK VENT
- Publication number 20090212404
- Publication date Aug 27, 2009
- INFINEON TECHNOLOGIES AG
- Lee Teck Sim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor component and panel used for the production thereof
- Publication number 20070128754
- Publication date Jun 7, 2007
- Edward Fuergut
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
Intermediate connection for flip chip in packages
- Publication number 20070120268
- Publication date May 31, 2007
- Roland Irsigler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer, panel and electronic component with stacked se...
- Publication number 20070108580
- Publication date May 17, 2007
- INFINEON TECHNOLOGIES AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing a universal semiconductor housing with precross...
- Publication number 20060258046
- Publication date Nov 16, 2006
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Smart card, smart card module, and a method for production of a sma...
- Publication number 20060175419
- Publication date Aug 10, 2006
- Edward Fuergut
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Electronic component with semiconductor chip and semiconductor wafe...
- Publication number 20060157849
- Publication date Jul 20, 2006
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component and panel for producing the same
- Publication number 20060125042
- Publication date Jun 15, 2006
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafer with electrically connected contact and test areas
- Publication number 20060097386
- Publication date May 11, 2006
- Werner Ertle
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic component, and system carrier and panel for producing an...
- Publication number 20060087044
- Publication date Apr 27, 2006
- Bernd Goller
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Biosensor with smart card configuration
- Publication number 20060027905
- Publication date Feb 9, 2006
- Michael Bauer
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Method for producing a semiconductor circuit, and corresponding sem...
- Publication number 20050285199
- Publication date Dec 29, 2005
- Wolfgang Stadler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor structure integrated under a pad
- Publication number 20050242374
- Publication date Nov 3, 2005
- Robert Bauer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic device configured as a multichip module, leadframe and p...
- Publication number 20050184375
- Publication date Aug 25, 2005
- Infineon Technologies AG
- Bernd Goller
- H01 - BASIC ELECTRIC ELEMENTS

Bernd Goller

Person

Patents Grantslast 30 patents

Device package with reduced radio frequency losses

MEMS-sensor

Semiconductor module

MEMS assembly

Package with vertical interconnect between carrier and clip

MEMS assembly and method for producing a MEMS assembly

Semiconductor package with a through port for sensor applications

Method for producing a semiconductor module

Apparatus with a high heat capacity and method for producing the same

Apparatus for determining a characteristic of a fluid having a devi...

Semiconductor wafer with electrically connected contact and test areas

Method of fabricating a semiconductor package with mold lock opening

Semiconductor wafer with electrically connected contact and test areas

Electronic component embedded within a plastic compound and includi...

Leadframe having mold lock vent

Semiconductor package with mold lock vent

Sensor component and panel used for the production thereof

Semiconductor wafer, panel and electronic component with stacked se...

Smart card, smart card module, and a method for production of a sma...

Biosensor with smart card configuration

Electronic component and a panel

Method of producing a universal semiconductor housing with precross...

Electronic module having plug contacts and method for producing it

Electronic component with a plastic package and method for production

Semiconductor structure integrated under a pad

Electronic component with at least one semiconductor chip and metho...

Electronic device configured as a multichip module, leadframe, pane...

Universal package for an electronic component with a semiconductor...

Electronic component with at least two stacked semiconductor chips...

Electronic component and process for producing the electronic compo...

Patents Applicationslast 30 patents

MEMS-Sensor

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE

MEMS ASSEMBLY AND METHOD FOR PRODUCING A MEMS ASSEMBLY

MEMS-Sensor

MEMS ASSEMBLY

Device Package with Reduced Radio Frequency Losses

APPARATUS FOR DETERMINING A CHARACTERISTIC OF A FLUID HAVING A DEVI...

Device Package with Reduced Radio Frequency Losses

APPARATUS WITH A HIGH HEAT CAPACITY AND METHOD FOR PRODUCING THE SAME

Semiconductor Package with a Through Port for Sensor Applications a...

METHOD FOR PRODUCING A SEMICONDUCTOR MODULE

Package with vertical interconnect between carrier and clip

Apparatus for Determining a Characteristic of a Fluid

SEMICONDUCTOR WAFER WITH ELECTRICALLY CONNECTED CONTACT AND TEST AREAS

METHOD OF FABRICATING A SEMICONDUCTOR PACKAGE WITH MOLD LOCK OPENING

SEMICONDUCTOR PACKAGE WITH MOLD LOCK VENT

LEADFRAME HAVING MOLD LOCK VENT

Sensor component and panel used for the production thereof

Intermediate connection for flip chip in packages

Semiconductor wafer, panel and electronic component with stacked se...

Method of producing a universal semiconductor housing with precross...

Smart card, smart card module, and a method for production of a sma...

Electronic component with semiconductor chip and semiconductor wafe...

Electronic component and panel for producing the same

Semiconductor wafer with electrically connected contact and test areas

Electronic component, and system carrier and panel for producing an...

Biosensor with smart card configuration

Method for producing a semiconductor circuit, and corresponding sem...

Semiconductor structure integrated under a pad

Electronic device configured as a multichip module, leadframe and p...