Bernd Rakow

Person

  • Regensburg, DE

Patents Grantslast 30 patents

Patents Applicationslast 30 patents

  • Information Patent Application

    Method for Fabricating a Semiconductor Flip-Chip Package

    • Publication number 20200388561
    • Publication date Dec 10, 2020
    • Thorsten Meyer
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    DIFFUSION SOLDER BONDING USING SOLDER PREFORMS

    • Publication number 20160358890
    • Publication date Dec 8, 2016
    • INFINEON TECHNOLOGIES AG
    • Alexander Heinrich
    • C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20110189821
    • Publication date Aug 4, 2011
    • INFINEON TECHNOLOGIES AG
    • Ralf Otremba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    ELECTRONIC DEVICE

    • Publication number 20100213587
    • Publication date Aug 26, 2010
    • INFINEON TECHNOLOGIES AG
    • Thomas Bemmerl
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    Electronic device

    • Publication number 20090152694
    • Publication date Jun 18, 2009
    • INFINEON TECHNOLOGIES AG
    • Thomas Bemmerl
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE

    • Publication number 20080296782
    • Publication date Dec 4, 2008
    • INFINEON TECHNOLOGIES AG
    • Ralf Otremba
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    External contact material for external contacts of a semiconductor...

    • Publication number 20070057372
    • Publication date Mar 15, 2007
    • Michael Bauer
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
  • Information Patent Application

    Electronic component and electronic configuration

    • Publication number 20070018308
    • Publication date Jan 25, 2007
    • Albert Schott
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR