Bernd Scheibe

Person

Dresden, DE

People

Patents Applicationslast 30 patents

Information Patent Application
MARKING OF A SUBSTRATE OF A SOLAR CELL
- Publication number 20130160832
- Publication date Jun 27, 2013
- Andreas Krause
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesion tape and method for mounting a chip onto a substrate
- Publication number 20070221318
- Publication date Sep 27, 2007
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a flip-chip package, substrate for manufac...
- Publication number 20070224729
- Publication date Sep 27, 2007
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method for an electronic component assembly and corre...
- Publication number 20060270109
- Publication date Nov 30, 2006
- Stephan Blaszczak
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Arrangement of a chip package constructed on a substrate and substr...
- Publication number 20050121807
- Publication date Jun 9, 2005
- Martin Reiss
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrate-based package for integrated circuits
- Publication number 20050104227
- Publication date May 19, 2005
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for producing an adhesive bond and adhesive bond between a c...
- Publication number 20050098890
- Publication date May 12, 2005
- Stephan Blaszczak
- H01 - BASIC ELECTRIC ELEMENTS

Bernd Scheibe

Person

Patents Applicationslast 30 patents

MARKING OF A SUBSTRATE OF A SOLAR CELL

Adhesion tape and method for mounting a chip onto a substrate

Method for manufacturing a flip-chip package, substrate for manufac...

Manufacturing method for an electronic component assembly and corre...

Arrangement of a chip package constructed on a substrate and substr...

Substrate-based package for integrated circuits

Method for producing an adhesive bond and adhesive bond between a c...